Vapor deposition machine
AssigneeWuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
InventorsQian JIANG, Yungsheng CHEN
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Abstract
A vapor deposition machine includes at least two substrate cleaning units, an atmospheric pressure chamber, and a vacuum chamber assembly. The atmospheric pressure chamber is disposed between the substrate cleaning unit and the vacuum chamber assembly. The atmospheric pressure chamber includes a compensation and testing chamber for at least one metal mask at atmospheric pressure and a receiving chamber for the metal mask at atmospheric pressure.
Claims20
A vapor deposition machine, comprising:
- at least two substrate cleaning units;
- an atmospheric pressure chamber comprising a compensation and testing chamber for at least one metal mask at atmospheric pressure, and a receiving chamber for the metal mask at atmospheric pressure;
- the compensation and testing chamber configured to receive the metal mask, an alignment system, at least one substrate, and a fight source, the alignment system configured to align the at least one substrate, and the light source disposed on a bottom part of the compensation and testing chamber;
- and
- a vacuum chamber assembly, wherein the atmospheric pressure chamber is disposed between the substrate cleaning units and the vacuum chamber assembly.
A vapor deposition machine, comprising:
- at least two substrate cleaning units;
- an atmospheric pressure chamber comprising a compensation and testing chamber for at least one metal mask at atmospheric pressure and a receiving chamber for the metal mask at atmospheric pressure;
- and
- a vacuum chamber assembly, wherein the atmospheric pressure chamber is disposed between the substrate cleaning unit and the vacuum chamber assembly.
The vapor deposition machine according to claim 19, wherein the fifth sub-chamber of the first vacuum chamber is a fine patterned film-forming chamber, and the fifth sub-chamber of the first vacuum chamber is configured to receive one of the substrates and one of the metal masks during operation, the sixth sub-chamber of the first vacuum chamber comprises a first vacuum receiving chamber and a second vacuum receiving chamber, the first vacuum receiving chamber is disposed above the second vacuum receiving in a vertical direction chamber, the first vacuum receiving chamber and the second vacuum receiving chamber are configured to receive the metal mask cassette, and a bottom layer of the second vacuum receiving chamber is configured to receive the substrate.
Dependencies are inferred from the claim text.