Liquid Metal Thermal Interface Material Having Anti-melt Characteristic and Preparation Method Thereof

Abstract

The present invention discloses a liquid metal thermal interface material having an anti-melt characteristic and a preparation method thereof. The liquid metal thermal interface material is characterized by comprising, in percentage by weight, 20-40 wt % of indium, 0-6 wt % of bismuth, 0-2 wt % of antimony, 0-3 wt % of zinc, 0-0.6 wt % silver, 0-0.3 wt % of nickel, 0-0.8 wt % of cerium, 0-0.6 wt % of europium and the balance of tin. The liquid metal thermal interface material has excellent thermal conductivity and chemical stability in an operating environment of an insulated gate bipolar transistor (IGBT), and thus is very suitable for IGBT devices in large-scale industrial production and practical applications.

Dependencies are inferred from the claim text.