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US 2019/0055443 A1Published application
Thermally Conductive Sheet, Production Method for Thermally Conductive Sheet, Heat Dissipation Member, and Semiconductor Device
AssigneeDexerials Corporation
InventorsHiroki Kanaya, Yu Nomura, Shunsuke Uchida, Shinichi Uchida, Keisuke Aramaki
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Abstract
A thermal conducting sheet including: a binder resin; carbon fibers; and a thermal conducting filler other than the carbon fibers, wherein a mass ratio (carbon fibers/binder resin) of the carbon fibers to the binder resin is less than 1.30, wherein an amount of the thermal conducting filler is from 48% by volume through 70% by volume, and wherein the carbon fibers are oriented in a thickness direction of the thermal conducting sheet.
Claims9
A thermal conducting sheet, comprising:
- a binder resin;
- carbon fibers;
- and
- a thermal conducting filler other than the carbon fibers,
- wherein a mass ratio (carbon fibers/binder resin) of the carbon fibers to the binder resin is less than 1.30,
- wherein an amount of the thermal conducting filler is from 48% by volume through 70% by volume, and
- wherein the carbon fibers are oriented in a thickness direction of the thermal conducting sheet.
4 more elements
Dependencies are inferred from the claim text.