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US 2019/0055403 A1Published application
Polyamide resin and film comprising the same
AssigneeUbe Industries, Ltd.
InventorsShuichi MAEDA, Tomoyuki NAKAGAWA, Shusaku WADA, Yasunari HANAOKA
Life of this patent
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Abstract
Provided is a polyamide resin having excellent heat shrinkability. A polyamide resin which contains three or more types of units, wherein the polyamide resin comprises (A) units derived from a lactam and/or an aminocarboxylic acid, and (B) units derived from an equimolar salt of a diamine and a dicarboxylic acid, wherein (B) the units derived from an equimolar salt of a diamine and a dicarboxylic acid comprise (B-1) units having no alicyclic structure and (B-2) units having an alicyclic structure.
Claims17
1-16. (canceled)
A polyamide resin containing three or more types of units,
- the polyamide resin comprising:
- (A) units derived from a lactam and/or an aminocarboxylic acid;
- and
- (B) units derived from an equimolar salt of a diamine and a dicarboxylic acid,
- wherein (B) the units derived from an equimolar salt of a diamine and a dicarboxylic acid comprise:
- (B-1) units having no alicyclic structure;
- and
- (B-2) units having an alicyclic structure, and
- wherein (B-2) the units having an alicyclic structure comprise at least dicarboxylic acid units having an alicyclic structure.
6 more elements
Dependencies are inferred from the claim text.