Method for producing a mems sensor, and mems sensor
AssigneeInfineon Technologies AG
InventorMatthias Steiert
Life of this patent
Estimating the term…
Abstract
In accordance with an embodiment, a MEMS structure is produced on a front side of a substrate. A decoupling structure which has recesses is produced in the substrate, which decoupling structure decouples a first region from a second region of the substrate in terms of stresses. In a rear side, situated opposite the front side, of the substrate, a first cavity is produced by means of a first etching process and a second cavity is produced by means of a second etching process. The first cavity and the second cavity are produced such that the second cavity encompasses the first cavity and such that the second cavity adjoins a base region of the MEMS structure and a base region of the decoupling structure.
Claims17
A method for producing a MEMS sensor,
- providing a substrate;
- producing a MEMS structure on a front side of the substrate, producing the MEMS structure comprising
- producing a decoupling structure comprising recesses in the substrate, wherein the decoupling structure decouples a first region from a second region of the substrate in terms of stresses;
- producing a first cavity using a first etching process in a rear side of the substrate, the rear side of the substrate situated opposite the front side of the substrate;
- and
- producing a second cavity using a second etching process in the rear side of the substrate, wherein the second cavity encompasses the first cavity, and the second cavity adjoins a base region of the MEMS structure and a base region of the decoupling structure.
A method for producing a MEMS sensor,
- disposing a MEMS membrane on a front side of a substrate;
- disposing an etch stop mask on a rear side of the substrate opposite the front side of the substrate;
- etching recesses on the front side of a substrate adjacent to the MEMS membrane;
- etching a first cavity using a first etching process in the rear side of the substrate opposite the MEMS membrane, wherein the etch stop mask protects a first portion of the substrate disposed below the recesses from the first etching process;
- and
- etching a second cavity encompassing the first cavity using a second etching process, wherein portions of the second cavity are disposed below the recesses, the second cavity adjoins a base region of the MEMS sensor, and the etch stop mask protects the base region of the MEMS sensor from the second etching process.
A method for producing a MEMS sensor,
- disposing a MEMS membrane on a front side of a substrate;
- disposing an etch stop mask on a rear side of the substrate opposite the front side of the substrate;
- etching a first cavity using a first etching process in the rear side of the substrate opposite the MEMS membrane, wherein the etch stop mask protects a first portion of the substrate from the first etching process;
- etching provisional recesses on the rear side of a substrate adjacent the first cavity using the first etching process;
- and
- etching a second cavity encompassing the first cavity using a second etching process, wherein the second cavity adjoins a base region of the MEMS sensor, and the etch stop mask protects the base region of the MEMS sensor from the second etching process.
Dependencies are inferred from the claim text.