Back to results
US 2019/0054671 A1Published application
Metal-plastic composite structure for electronic devices
AssigneeHewlett-Packard Development Company, L.P.
InventorsKuan-Ting WU, Chi-Hao CHANG, Hung-Ming CHEN
Life of this patent
Estimating the term…
Abstract
In one example, a metal-plastic composite structure for an electronic device is described, which includes a micro-arc oxidized metal substrate and at least one plastic film disposed on the micro-arc oxidized metal substrate using a superplastic forming process.
Claims15
A metal-plastic composite structure for an electronic device comprising:
- a micro-arc oxidized metal substrate;
- and
- at least one plastic film disposed on the micro-arc oxidized metal substrate using a superplastic forming process.
A method for manufacturing an electronic device housing, the method comprising:
- providing a metal substrate;
- forming a micro-arc oxide layer on the eta substrate;
- and
- disposing at least one plastic film on the exposed micro-arc oxide layer using a first superplastic forming process.
1 more element
A method for forming metal-plastic composite structure, the method comprising:
- providing a micro-arc oxidized metal substrate;
- and
- disposing at least one patterned or non-patterned plastic film on the micro-arc oxidized metal substrate using a first superplastic forming process to form the metal-plastic composite structure.
Dependencies are inferred from the claim text.