Novel chemical-mechanical planarization system
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChun-Hsi Huang, Huang-Chu Ko
Life of this patent
Estimating the term…
Abstract
An apparatus for performing a polishing process includes: a rotatable polishing pad; a temperature sensor configured to monitor a temperature on a top surface of the rotatable polishing pad; a first dispenser configured to dispense a first slurry that is maintained at a first temperature on the rotatable polishing pad; and a second dispenser configured to dispense a second slurry that is maintained at a second temperature on the rotatable polishing pad, wherein the second temperature is different from the first temperature so as to maintain the temperature on the top surface of the rotatable polishing pad at a substantially constant value.
Claims20
An apparatus for performing a polishing process, comprising:
- a rotatable polishing pad;
- a temperature sensor configured to monitor a temperature on a top surface of the rotatable polishing pad;
- a first dispenser configured to dispense a first slurry that is maintained at a first temperature on the rotatable polishing pad;
- and
- a second dispenser configured to dispense a second slurry that is maintained at a second temperature on the rotatable polishing pad,
- wherein the second temperature is different from the first temperature so as to maintain the temperature on the top surface of the rotatable polishing pad at a substantially constant value.
A method, comprising:
- dispensing a first slurry at a first temperature using a first flow rate on a rotating polishing pad;
- dispensing a second slurry at a second temperature using a second flow rate on the rotating polishing pad, wherein the second temperature is different from the first temperature;
- and
- performing a polishing process on a sample under a substantially constant temperature by adjusting at least one of the first rate of the first slurry and the second flow rate of the second slurry.
A method, comprising:
- dispensing a first slurry with a first temperature using a first flow rate on a polishing pad;
- dispensing a second slurry with a second temperature using a second flow rate on the polishing pad, wherein the second temperature is different from the first temperature;
- rotating the polishing pad to polish a sample by holding the sample against the polishing pad in a presence of a mixture of the first and second slurries;
- monitoring a temperature on a top surface of the polishing pad;
- and
- when the temperature is offset from a substantially constant temperature, adjusting at least one of the first and second flow rates so as to maintain the temperature at the substantially constant temperature.
Dependencies are inferred from the claim text.