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US 2019/0054575 A1Published application
Lead-free solder composition
AssigneesHyundai Motor Company, Kia Motors Corporation, Heesung Material Ltd.
InventorsJeejung KIM, Hyun Chae JUNG, Taekhee PARK, Joo Dong LEE
Life of this patent
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Abstract
A lead-free solder composition includes, with respect to 100 wt % of a total weight of the lead-free solder composition, silver (Ag) at 0.3 to 3.0 wt %, antimony (Sb) at 0.5 to 3.0 wt %, indium (In) at 0.3 to 3.0 wt %, and tin (Sn) as the remaining portion.
Claims17
A lead-free solder composition comprising,
- with respect to 100 wt % of a total weight of the lead-free solder composition,
- silver (Ag) at 0.3 to 3.0 wt %,
- antimony (Sb) at 0.5 to 3.0 wt %,
- indium (In) at 0.3 to 3.0 wt %, and
- tin (Sn) as the remaining portion.
2 more elements
Dependencies are inferred from the claim text.