Back to results
US 2019/0054562 A1Published application
Ultrasonic bonding jig, ultrasonic bonding method, and bonding structure
AssigneeNippon Mektron, Ltd.
InventorsHiroshi MIYASHIRO, Yoichi SURUGA, Shuhei KOYANO
Life of this patent
Estimating the term…
Abstract
An ultrasonic bonding jig includes: a plurality of protrusions; a planar portion among protrusions formed among base ends of the protrusions; and recessed portions recessed to a side opposite to a projection direction of the protrusions, the recessed portions being formed on both sides in a vibration direction of the protrusions.
Claims7
An ultrasonic bonding jig comprising:
- a planar surface;
- a plurality of protrusions formed on the planar surface;
- and
- recessed portions, each of which are recessed in the planar surface, and each recessed portion is recessed to a side opposite to a projection direction of the protrusions along which each of the plurality of protrusions has been projected, the recessed portions being arranged on at least two sides of each of the plurality of protrusions in a direction orthogonal to the projection direction.
1 more element
5-7. (canceled)
Dependencies are inferred from the claim text.