Powder for conductive material, ink for conductive material, conductive paste, and method for producing powder for conductive material
AssigneesSumitomo Electric Industries, Ltd., Sumitomo Electric Printed Circuits, Inc.
InventorsIssei OKADA, Motohiko SUGIURA, Yoshio OKA, Kenji OHKI
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Abstract
A powder for a conductive material according to an embodiment of the present invention includes a large number of particles that contain copper as a main component and having an average primary particle diameter of 1 nm or more and 200 nm or less. The particles contain titanium on surfaces or inside thereof, and a content of the titanium is 0.003 atomic percent or more and 0.5 atomic percent or less.
Claims7
A powder for a conductive material, the powder comprising a large number of particles that contain copper as a main component and having an average primary particle diameter of 1 nm or more and 200 nm or less,
- wherein the particles contain titanium on surfaces or inside thereof, and
- a content of the titanium is 0.003 atomic percent or more and 0.5 atomic percent or less.
A method for producing a powder for a conductive material by using a liquid-phase reduction method, the powder including a large number of particles that contain copper as a main component and having an average primary particle diameter of 1 nm or more and 200 nm or less, the method comprising:
- a step of inputting a raw material aqueous solution containing a copper ion into a reducing agent aqueous solution containing a trivalent titanium ion,
- wherein an input rate of the raw material aqueous solution is 0.01 mol·L−1·s−1 or more in terms of amount of copper ion per unit amount of a synthesis liquid obtained by inputting the raw material aqueous solution into the reducing agent aqueous solution.
Dependencies are inferred from the claim text.