# US 2019/0048468 A1 · Plasma treatment device and structure of reaction vessel for plasma treatment

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- Number: US 2019/0048468 A1
- Document ID: US20190048468A1
- Status: Published application
- Kind: A1
- Application number: 16/080,362
- Filed: 2016-03-03
- Published: 2019-02-14
- Earliest claimed: 2016-03-03
- Assignees: Core Technology, Inc.; Askagi Corporation
- Applicants: Core Technology, Inc.; Askagi Corporation
- Inventors: Toshiaki YOSHIMURA; Hiroyuki MINOWA; Lung Kei Amos SHEK
- Web page: https://patentgrep.com/patent/US20190048468A1

## CPC

- C23C 16/50: using electric discharges {(generation and control of plasma in discharge tubes for surface treatment H01J37/32, H01J37/34)}
- C23C 16/45559: {Diffusion of reactive gas to substrate}
- C23C 16/45565: {Shower nozzles}
- C23C 16/4586: {Elements in the interior of the support, e.g. electrodes, heating or cooling devices}
- C23C 16/509: using internal electrodes
- H01J 37/32018: {Glow discharge}
- H01J 37/32449: {Gas control, e.g. control of the gas flow}
- H01J 37/32577: {Electrical connecting means}
- H05H 1/24: Generating plasma {(nuclear fusion reactors G21B1/00; gas-filled discharge reactors H01J37/32)}
- H05H 1/46: using applied electromagnetic fields, e.g. high frequency or microwave energy (H05H1/26 takes precedence)
- H01J 37/32899: {Multiple chambers, e.g. cluster tools}
- H01J 2237/3321: CVD [Chemical Vapor Deposition]
- H01J 2237/3323: uniformity
- H01J 2237/3325: large area
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H)
- H05H: PLASMA TECHNIQUE (apparatus or processes specially adapted for producing X-rays H05G2/00); PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS

## Abstract

The present invention improves the in-plane uniformity of film formation via a plasma treatment. It is provided a plasma treatment device constituted so that process gas introduced between an electrode plate and a shower plate is exhausted toward a counter electrode through a plurality of small holes formed in the shower plate, the plasma treatment device comprising a diffuser plate having a plurality of small holes, the diffuser plate being arranged substantially parallel with the shower plate, wherein the process gas is introduced between the electrode plate and the diffuser plate, passes through the plural small holes of the diffuser plate, reaches the shower plate and flows out from the plural small holes of the shower plate toward the electrode plate, and wherein within the small holes formed in the diffuser plate and the small holes formed in the shower plate, the small holes formed in a plate which exists more downstream along a flowing direction of the process gas are made in smaller diameters and an aperture ratio of each plate is made smaller in a plate which exists more upstream along the flowing direction of the process gas.

## Claims

### Claim 1

A plasma treatment device with an electrode plate having a main electrode plate, a diffuser plate and a shower plate, the plasma treatment device being constituted so that process gas introduced between the main electrode plate and the shower plate is exhausted toward a counter electrode through a plurality of first small holes formed in the shower plate,
the plasma treatment device comprising the diffuser plate having a plurality of second small holes, the diffuser plate being arranged substantially parallel with the shower plate,
wherein the process gas is introduced between the main electrode plate and the diffuser plate, passes through the second plural small holes of the diffuser plate, reaches the shower plate and flows out from the first plural small holes of the shower plate toward the electrode plate, and
wherein within the first small holes formed in the diffuser plate and the second small holes formed in the shower plate, the second small holes formed in the shower plate which exists more downstream along a flowing direction of the process gas are made in smaller diameters and an aperture ratio of each of the diffuser plate and the shower plate is made smaller in the diffuser plate which exists more upstream along the flowing direction of the process gas.

### Claim 2 (depends on 1)

The plasma treatment device according to claim 1,
wherein the electrode plate is electrically and integrally constituted as a whole,
wherein frequency power produced in one frequency power generator is supplied to a plurality of portions of the electrode plate through one matching device and a transmission path,
wherein the transmission path is equally branched in a middle thereof and is connected to the electrode plate, and
wherein a impedance value of each transmission path after branched is mutually equal.

### Claim 3 (depends on 1)

The plasma treatment device according to claim 1, wherein formation positions of the plural small holes formed in the shower plate and formation positions of the plural small holes formed in the diffuser plate arranged adjacent to the shower plate are mutually different in a plane direction of the diffuser plate and the shower plate.

### Claim 4 (depends on 1)

The plasma treatment device according to claim 1, wherein an interval between the main electrode plate and the diffuser plate adjacent to the main electrode plate is wider than an interval between the shower plate and the diffuser plate adjacent to the shower plate.

### Claim 5

A plasma treatment reaction vessel with an electrode plate having a main electrode plate, a diffuser plate and a shower plate, the plasma treatment reaction vessel being constituted so that process gas introduced in a space between the main electrode plate and the shower plate is exhausted toward a counter electrode through a plurality of first small holes formed in the shower plate,
the plasma treatment reaction vessel comprising the diffuser plate having a plurality of second small holes, the diffuser plate being arranged between the main electrode plate and the shower plate,
wherein the process gas is introduced between the main electrode plate and the diffuser plate, passes through the second plural small holes of the diffuser plate, reaches the shower plate and flows out from the first plural small holes of the shower plate toward the electrode plate, and
wherein within the first small holes formed in the diffuser plate and the second small holes formed in the shower plate, the second small holes formed in the shower plate which exists more downstream along a flowing direction of the process gas are made in smaller diameters and an aperture ratio of each of the diffuser plate and the shower plate is made smaller in the diffuser plate which exists more upstream along the flowing direction of the process gas.