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US 2019/0047066 A1Published application
Composite Soldering, De-Soldering Station and System
AssigneeHakko Corporation
InventorsKenji Matsuzaki, Hitoshi Takeuchi, Kenta Nakamura
Life of this patent
Estimating the term…
Abstract
A soldering and de-soldering station and systems including enhanced features for the soldering heating tools, load detection functionality, tip management, automatic tip temperature calibration, cartridge/handle position and movement sensing and interactive capabilities.
Claims33
1) A system for use in soldering and de-soldering of electrical devices, the system comprising:
- a control station including a central processing unit and operations programs, said control station further including an output interface allowing said control station to be connected to a host machine to allow said control station to output solder operations data to the host machine and receive instructions from the host machine;
- a cable assembly;
- a handle connected to said control station by said cable assembly;
- a cartridge removably inserted within and powered by said handle, said cartridge including a memory element storing information specific to the cartridge.
1 more element
12) A system for use in soldering operations, the system comprising:
- at least one control station including a central processing unit with an operating program and associated circuitry contained within a case having a front panel, a display, control buttons and a socket;
- a cable assembly having a proximal end configured to engage said socket of said control station and a distal end terminating in a handle for receiving cartridges, whereby said handle is connected to said control station by said cable assembly;
- at least one soldering cartridge removably inserted within and powered by said handle, said cartridge including a memory element storing information specific to the cartridge that can be accessed by said central processing unit of said control station, said information specific to the cartridge stored in said memory element selected from the group consisting of a cartridge serial number, cartridge tip shape data, factory set temperature data, programmed set temperature data, temperature offset value data, applied load count data, totaled powered time data, total solder operations data, and the cartridge's use with leaded solder data.
31) A soldering system including a control station, the control station comprising:
- a central processing unit (CPU) having operations programs and associated circuitry within a case having a front panel including a display, control buttons, a power switch and a socket and a rear panel having a power socket, a connector port and a circuit board dock, said circuit board dock configured to receive at least one of a standard connector board, a conversion board, a USB connector board, a LAN board, a board for any of a Ethernet, Ethernet for Control Automation Technology, EtherNet/IPEthernet Industrial Protocol, Controller Area Network, Universal Asynchronous Receiver/Transmitter or I2C—Inter-Integrated Circuit, Serial Peripheral Interface;
- an output interface allowing said control station to be connected to a host machine to allow said control station to output solder operations data to the host machine and receive instructions from the host machine;
- said operations programs including a program to utilize acceleration data to monitor the non-use and movement of the cartridge, a program to use temperature data from an external thermometer to calculate an offset temperature for a specific cartridge, a program to monitor the power delivered to a cartridge and identify the completion of each soldering operation based upon the energy load experienced by a cartridge, a program providing write instructions to a memory element of a cartridge to update one or more of the applied load count data, totaled powered time data and total solder operations data in the memory element.
33) A control station for a soldering system for use in soldering electrical devices, the control station comprising:
- a central processing unit and associated circuitry contained within a case having a front panel, a display and control inputs;
- and
- an operation program including a plurality of sub-routines selected from the group consisting of:
- an automatic cartridge temperature calibration program;
- a program sub-routine to update an offset temperature for a cartridge;
- a program sub-routine to update an offset leak voltage data memory for a soldering cartridge;
- a program sub-routine to update the tip to ground resistance for a soldering cartridge;
- a program sub-routine for a cartridge tip management program;
- a program sub-routine to set the lead solder and lead-free solder settings within the control station;
- a program sub-routine to set or reset the lead solder and lead free solder for a soldering cartridge;
- and
- a program sub-routine to lock the control station operation program.
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Dependencies are inferred from the claim text.