Method for improved semiconductor processing equipment tool pedestal / pad vibration isolation and reduction
AssigneeSK Commercial Construction, Inc.
InventorSuk K. Kim-Whitty
Life of this patent
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Abstract
The present disclosure provides a method, system, and fabrication facility that eliminates or substantially reduces process-limiting vibrations within a high-precision device manufacturing facility, wherein an elevated structure supports high-precision device manufacturing equipment and provides vibration reduction spacing between a floor and an upper surface of said elevated structure.
Claims23
A method for eliminating, or substantially reducing, process-limiting vibrations within a high-precision device manufacturing facility, wherein a hybrid tool pedestal system supports high-precision device manufacturing equipment and provides vibration reduction spacing between a floor and an upper surface of said elevated structure, the method comprising of the following steps:
- Separating a base of said elevated structure from the floor using first vibration isolation pad structure, said;
- Filling a hollow portion of a vertical support structure with a vibration dampening materials, said vertical support structure separating said base from said upper surface and further comprising concrete mix to reduce/isolate vibration and improve stiffness;
- Separating said vertical support structure from the upper structure of said elevated structure using a second vibration isolation pad structure;
- Wherein said first vibration isolation pad structure, said vibration dampening materials, and said second isolation pad structure coordinate to eliminate, or substantially reduce, the ability of vibrations from the floor to reach high-precision device manufacturing equipment operating on the upper surface of said elevated structure;
- and
- Adding an EMI insulation or absorbing material added to and a degaussing process for removing magnetic arc blow to create the hybrid tool pedestal with EMI barrier.
A system for eliminating or substantially reducing process-limiting vibrations within a high-precision device manufacturing facility, wherein a hybrid tool pedestal system supports high-precision device manufacturing equipment and provides vibration reduction spacing between a floor and an upper surface of said elevated structure, the system comprising of the following steps:
- First vibration isolation pad structure for separating a base of said elevated structure from the floor;
- A vibration dampening material for filling a hollow portion of a vertical support structure, said vertical support structure separating said base from said upper surface and further comprising of additional materials to be added into the concrete mix to improve/reduce/isolate vibration and improve stiffness;
- A second vibration isolation pad structure for separating said vertical support structure from the upper structure of said elevated structure;
- Wherein said first vibration isolation pad structure, said vibration dampening material, and said second isolation pad structure coordinate to eliminate, or substantially reduce, the ability of vibrations from the floor to reach high-precision device manufacturing equipment operating on the upper surface of said elevated structure;
- and further
- An EMI barrier applied to the hybrid tool pedestal formed by adding EMI insulation or absorbing material and degaussing said hybrid tool pedestal for removing magnetic arc blow relating to use of said hybrid tool pedestal.
A high-precision device manufacturing facility having eliminated, or substantially reduced, process-limiting vibrations there within, comprising:
- A plurality of hybrid tool pedestal structures for supporting high-precision device manufacturing equipment and providing vibration reduction spacing between a floor and an upper surface of said elevated structure, selected ones of said plurality elevated structures further comprising:
- First vibration isolation pad structure for separating a base of said elevated structure from the floor;
- A vibration dampening material for filling a hollow portion of a vertical support structure, said vertical support structure separating said base from said upper surface;
- A second vibration isolation pad structure for separating said vertical support structure from the upper structure of said elevated structure;
- Wherein said first vibration isolation pad structure, said vibration dampening material, and said second isolation pad structure coordinate to eliminate, or substantially reduce, the ability of vibrations from the floor to reach high-precision device manufacturing equipment operating on the upper surface of said elevated structure;
- and further
- An EMI barrier applied to the hybrid tool hybrid tool pedestal formed by adding EMI insulation or absorbing material and degaussing said hybrid tool pedestal for removing magnetic arc blow relating to use of said hybrid tool pedestal.
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Dependencies are inferred from the claim text.