Image sensor module having protective structure
AssigneeOmniVision Technologies, Inc.
InventorsWei-Feng Lin, Chi-Chih Huang, Yu-Mei Su
Life of this patent
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Abstract
An image sensor module comprises: a substrate having a first side and second side, the first side being an opposite of the second side, an image sensor attached to the first side of the substrate, bonding wires to bond the image sensor to pads on the first side of the substrate, a protective structure disposed on the first side of the substrate surrounding the image sensor, the bonding wires, and the pads, the protective structure having a dam and a lid, a cover glass disposed on the protective structure, and a set of solder balls attached to the second side of the substrate.
Claims20
An image sensor module comprising:
- a substrate having a first side and a second side, the first side being an opposite to the second side;
- an image sensor attached to the first side of the substrate;
- bonding wires to bond the image sensor to pads on the first side of the substrate;
- a protective structure disposed on the first side of the substrate surrounding the image sensor, the bonding wires, and the pads;
- the protective structure comprising a dam and a lid;
- the lid comprising a hole and a non-transparent part surrounding the hole;
- wherein the hole transmits incident light to arrive at the image sensor, and the non-transparent part blocks incident light to arrive at the bonding wires and the pads;
- and
- a cover glass disposed on the protective structure;
- wherein a bottom of the dam of the protective structure is attached to the first side of the substrate and the cover glass is attached to the lid of the protective structure.
A method for making an image sensor module comprising:
- providing a substrate having a first side and a second side, the first side being an opposite to the second side, the substrate having a plurality of pads on the first side;
- attaching a plurality of image sensors to the first side of the substrate;
- wire bonding each image sensor using bonding wires to the pads;
- disposing a unified structure on the first side of the substrate;
- wherein the unified structure comprises a plurality of inter-connected protective structures,
- wherein each protective structure surrounds each image sensor, the bonding wires, and the pads,
- wherein each protective structure comprises a dam and a lid,
- wherein the lid comprises a hole and a non-transparent part surrounding the hole;
- wherein the hole transmits incident light to arrive at the image sensor, and the non-transparent part blocks incident light to arrive at the bonding wires and the pads;
- wherein a bottom of the dam is attached to the first side of the substrate;
- attaching a piece of cover glass to the lid of each protective structure;
- and
- attaching a plurality of sets of solder balls to the second side of the substrate.
A camera module comprising:
- an image sensor module comprising:
- a substrate having a first side and a second side, the first side being an opposite to the second side;
- an image sensor attached to the first side of the substrate;
- bonding wires to bond the image sensor to pads on the first side of the substrate;
- a protective structure disposed on the first side of the substrate surrounding the image sensor, the bonding wires, and the pads;
- the protective structure comprising a dam and a lid;
- the lid comprising a hole and a non-transparent part surrounding the hole;
- wherein the hole transmits incident light to arrive at the image sensor, and the non-transparent part blocks incident light to arrive at the bonding wires and the pads;
- and
- a cover glass disposed on the protective structure;
- wherein a bottom of the dam of the protective structure is attached to the first side of the substrate and the cover glass is attached to the lid of the protective structure;
- a lens system;
- and
- a spacer disposed in between the image sensor module and the lens system.
Dependencies are inferred from the claim text.