Methods for metalizing vias within a substrate
AssigneeCorning Incorporated
InventorShrisudersan Jayaraman
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Abstract
Methods of metalizing vias are disclosed. A method of metalizing at least one via includes contacting a substrate with a sacrificial metal sheet. The substrate includes a first surface, a second surface, and the at least one via extending between the first surface and the second surface and the first surface or the second surface of the substrate contacts a surface of the sacrificial metal sheet. The method further includes applying a solution comprising metal ions to the substrate and the sacrificial metal sheet such that a Galvanic displacement reaction occurs between the sacrificial metal sheet and the metal ions in the solution until the metal ions form a metal coating on at least one surface of the at least one via.
Claims19
A method of metalizing at least one via, the method comprising:
- contacting a substrate with a sacrificial metal sheet, wherein:
- the substrate comprises a first surface, a second surface, and the at least one via extending between the first surface and the second surface, and
- the first surface or the second surface of the substrate contacts a surface of the sacrificial metal sheet;
- and
- applying a solution comprising metal ions to the substrate and the sacrificial metal sheet such that a Galvanic displacement reaction occurs between the sacrificial metal sheet and the metal ions in the solution until the metal ions form a metal coating on at least a portion of one surface of the at least one via.
A method of metalizing at least one via, the method comprising:
- contacting a substrate with an aluminum sheet, wherein:
- the substrate comprises a first surface, a second surface, and the at least one via extending between the first surface and the second surface, and
- the first surface or the second surface of the substrate contacts a surface of the aluminum sheet;
- and
- applying a solution containing copper ions to the substrate and the aluminum sheet, resulting in a Galvanic displacement reaction between the aluminum sheet and copper ions in the solution containing copper ions until the copper ions form a copper coating on at least a portion of one surface of the at least one via.
Dependencies are inferred from the claim text.