Method for producing electroconductive laminate, laminate, and electroconductive laminate
AssigneeFUJIFILM Corporation
InventorsKohei HIGASHI, Takehiro KASAHARA, Daigo MURAI
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AssigneeFUJIFILM Corporation
InventorsKohei HIGASHI, Takehiro KASAHARA, Daigo MURAI
Estimating the term…
An object of the present invention is to provide a method for producing an electroconductive laminate, which is capable of forming a metal layer having low resistance at a position corresponding to a patterned plated layer, a laminate, and an electroconductive laminate. The method for producing an electroconductive laminate of the present invention includes: a step of forming a plated layer forming layer on a base material using a predetermined plated layer forming composition; a step of subjecting the plated layer forming layer to a patternwise exposure treatment and a development treatment to form a patterned plated layer containing a portion having a line width of less than 3 μm; a step of applying a plating catalyst or a precursor thereof to the patterned plated layer using an alkaline plating catalyst-applying liquid containing the plating catalyst or the precursor thereof; and a step of subjecting the patterned plated layer to which the plating catalyst or the precursor thereof has been applied to a plating treatment using a plating liquid containing aminocarboxylic acids to form a metal layer on the patterned plated layer.
A method for producing an electroconductive laminate having a base material, a patterned plated layer, and a metal layer, the method comprising:
Dependencies are inferred from the claim text.