Test interface board having a transmission line to merge signals, test method using the same, and test system including the same
AssigneeSamsung Electronics Co., Ltd.
InventorYONGJEONG KIM
Life of this patent
Estimating the term…
Abstract
A test interface board includes a first input terminal, a second input terminal, an output terminal, and a transmission line. The first input terminal receives a first test signal for testing a semiconductor device. The second input terminal receives a second test signal for testing the semiconductor device. The output terminal outputs the first test signal and the second test signal to the semiconductor device. The transmission line electrically connects the first input terminal, the second input terminal, and the output terminal such that the first test signal and the second test signal are merged.
Claims20
A test interface board comprising:
- a first input terminal configured to receive a first test signal for testing a semiconductor device;
- a second input terminal configured to receive a second test signal for testing the semiconductor device;
- an output terminal configured to output the first test signal and the second test signal to the semiconductor device;
- and
- a transmission line electrically connecting the first input terminal, the second input terminal, and the output terminal such that the first test signal and the second test signal are merged.
A method for testing a semiconductor device by using a test interface board configured to output, through one output terminal, a plurality of test signals input through a plurality of input terminals, the method comprising:
- generating the plurality of test signals from a plurality of buffers and an algorithm pattern generator (ALPG) of a tester connected to the test interface board;
- and
- transmitting the plurality of test signals to the test interface board at different time points.
A test system comprising:
- a semiconductor device;
- and
- a test interface board comprising input terminals configured to receive test signals for testing the semiconductor device, an output terminal configured to output the test signals as a merged signal to the semiconductor device, and a transmission line electrically connecting the input terminals and the output terminal.
Dependencies are inferred from the claim text.