Device for processing substrates

Abstract

A device for processing substrates improves processing quality during separation or punching of such substrates. The device has a first processing cylinder and a second processing cylinder for treating substrates, and between which the substrate can be inserted. The substrate undergoes processing as it passes through the cylinder nip between the processing cylinders by use of tool parts that are active therein, and which may be chosen from a group composed of cutting tools, punching tools, creasing tools, perforating tools and grooving tools. The first processing cylinder has a sheet holding system and one of the first processing cylinder and the second processing cylinder has a tool carrier for receiving a tool part. An impression cylinder, which is in surface contact with the second processing cylinder, is assigned to the second processing cylinder, on the side thereof that faces away from the first processing cylinder.

Dependencies are inferred from the claim text.