Selective particles transfer from one device to another

A method of transferring a target particle from one device to another device, comprising:

• (i) providing a device comprising a substrate with a thickness of T and a width of W, having a top portion and a bottom portion immediately adjacent to the top portion, the top portion having a top surface and the bottom portion having a bottom surface opposite to the top surface;
• (ii) identifying one area of the substrate that has a particle of interest attached onto the substrate as a target substrate portion, wherein the target substrate portion has a width of W2 and a thickness of T and is located in the top and bottom portions of the substrate;
• (iii) fabricating a notch structure, the notch structure being formed in the bottom portion of the substrate and comprising:
• a groove with a width of W1, located at a distance oft below the top surface of the substrate, wherein the groove is formed in the bottom portion from the bottom surface extending toward the top portion and surrounds the target substrate portion;
• (iv) removing the target substrate portion away from the device along with the particle of interest attached thereto by using a tool;
• and
• (iii) placing the removed target substrate portion along with the particle attached thereto into a container.

A method of transferring a target particle from one device to another device, comprising:

• (i) providing a device comprising a substrate with a thickness of T and a width of W, having a top portion and a bottom portion immediately adjacent to the top portion, the top portion having a top surface and the bottom portion having a bottom surface opposite to the top surface;
• wherein the substrate is made out of a soft material.
• (ii) identifying one area of the substrate 306 that has a particle of interest attached onto the substrate as a target substrate portion, wherein the target substrate portion has a width of W2 and a thickness of T and is located in the top and bottom portions of the substrate;
• (iii) removing the target substrate portion away from the device along with the particle of interest attached onto the target substrate portion by using a tool;
• and
• (iv) placing the removed target substrate portion along with the particle attached thereto into a container.