Sensor self-diagnostics using multiple signal paths

A monolithic integrated circuit, comprising:

• a first sensor device configured to indicate a physical quantity, the first sensor device having a first signal path for a first sensor signal on a semiconductor chip;
• and
• a second sensor device configured to indicate the physical quantity, the second sensor device having a second signal path for a second sensor signal on the semiconductor chip, the second signal path separate and distinct from the first signal path,
• wherein the second sensor device comprises at least one characteristic selected from the group of characteristics consisting of:
• fewer second sensing elements than the first sensor device comprises first sensing elements,
• the second sensor device comprises second sensing elements of a smaller second sensitive area than the first sensor device comprises first sensing elements of a first sensing area,
• the second sensor device has a different working principle compared with the first sensor device,
• the second sensor device has different signal encodings compared with the first sensor device,
• the second sensor device has different mapping of sensor signals compared with the first sensor device,
• the second sensor device has different compensation algorithms compared with the first sensor device,
• the second sensor device has a different processing schedule compared with the first sensor device,
• the second signal path, when compared with the first signal path, has a lower sampling rate,
• the second signal path, when compared with the first signal path, has a higher latency time,
• the second signal path, when compared with the first signal path, has a lower bandwidth,
• the second signal path, when compared with the first signal path, has a smaller analog-to-digital conversion resolution, or
• the second signal path, when compared with the first signal path, has a smaller signal range, and
• wherein a first output signal related to the first signal path and a second output signal related to the second signal path are communicable from the monolithic integrated circuit to an external controller.