# US 2018/0324982 A1 · Joint structure between electronic component and frame

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- Number: US 2018/0324982 A1
- Document ID: US20180324982A1
- Status: Published application
- Kind: A1
- Application number: 15/965,899
- Filed: 2018-04-28
- Published: 2018-11-08
- Earliest claimed: 2017-05-02
- Inventors: Yueh-Han LI
- Web page: https://patentgrep.com/patent/US20180324982A1

## CPC

- B62J 45/00: Electrical equipment arrangements specially adapted for use as accessories on cycles, not otherwise provided for
- B60R 13/00: Elements for body-finishing, identifying, or decorating; Arrangements or adaptations for advertising purposes
- B62K 19/40: for attaching accessories, e.g. article carriers, lamps
- H05K 7/20472: {Sheet interfaces}
- B62J: CYCLE SADDLES OR SEATS; AUXILIARY DEVICES OR ACCESSORIES SPECIALLY ADAPTED TO CYCLES AND NOT OTHERWISE PROVIDED FOR, e.g. ARTICLE CARRIERS OR CYCLE PROTECTORS
- B60R: VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B62K: CYCLES; CYCLE FRAMES; CYCLE STEERING DEVICES; RIDER-OPERATED TERMINAL CONTROLS SPECIALLY ADAPTED FOR CYCLES; CYCLE AXLE SUSPENSIONS; CYCLE SIDECARS, FORECARS, OR THE LIKE
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

In a joint structure between an electronic component and a frame provided in the present invention, an electronic component is disposed in a frame, and heat is conducted from the electronic component to a corresponding windward part of the frame when a bicycle moves, so that the heat can be dissipated rapidly, thereby achieving a desirable heat dissipation effect.

## Claims

### Claim 1

A joint structure between an electronic component and a frame, comprising:
a vehicle, having a frame and a mounting space provided on the frame, an opening being formed on the frame in a corresponding windward direction when the vehicle moves;
a cover part, fixedly disposed on the frame, and covering at least a part of the opening;
an electronic component, accommodated in the mounting space, and having a plate-shaped circuit board, one side surface of electronic component facing the cover part, and at least one electronic part being protrusively disposed on the other side surface, opposite the cover part, of the circuit board; and
a heat conduction layer, located between the side surface of the circuit board and the cover part.

### Claim 2 (depends on 1)

The joint structure between an electronic component and a frame according to claim 1, wherein the heat conduction layer joins the circuit board and the cover part.

### Claim 3 (depends on 2)

The joint structure between an electronic component and a frame according to claim 2, wherein the material of the heat conduction layer is soldering tin.

### Claim 4 (depends on 1)

The joint structure between an electronic component and a frame according to claim 1, wherein the material of the heat conduction layer is soldering tin.

### Claim 5 (depends on 1)

The joint structure between an electronic component and a frame according to claim 1, wherein the mounting space is a hole.

### Claim 6 (depends on 1)

The joint structure between an electronic component and a frame according to claim 1, wherein the mounting space is a groove.

### Claim 7 (depends on 1)

The joint structure between an electronic component and a frame according to claim 1, wherein the cover part covers the entire opening.

### Claim 8 (depends on 7)

The joint structure between an electronic component and a frame according to claim 7, wherein the cover part is plate-shaped.

### Claim 9 (depends on 8)

The joint structure between an electronic component and a frame according to claim 8, wherein the material of the cover part is aluminum or aluminum alloy.

### Claim 10 (depends on 8)

The joint structure between an electronic component and a frame according to claim 8, wherein the cover part has a plate-shaped cover body, a joint portion is disposed between the cover body and the frame, and the cover body is fixedly connected on the frame.

### Claim 11 (depends on 1)

The joint structure between an electronic component and a frame according to claim 1, wherein the cover part is plate-shaped.

### Claim 12 (depends on 11)

The joint structure between an electronic component and a frame according to claim 11, wherein the material of the cover part is aluminum or aluminum alloy.

### Claim 13 (depends on 11)

The joint structure between an electronic component and a frame according to claim 11, wherein the cover part has a plate-shaped cover body, a joint portion is disposed between the cover body and the frame, and the cover body is fixedly connected on the frame.

### Claim 14 (depends on 1)

The joint structure between an electronic component and a frame according to claim 1, wherein the electronic part is a power device.