# US 2018/0324981 A1 · Electronic component housing apparatus and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0324981 A1 - Document ID: US20180324981A1 - Status: Published application - Kind: A1 - Application number: 15/772,914 - Filed: 2016-12-01 - Published: 2018-11-08 - Earliest claimed: 2015-12-02 - Assignees: NEC Network and Sensor Systems, Ltd. - Applicants: NEC Network and Sensor Systems, Ltd. - Inventors: Masahiro MURAKAMI; Norio MASUDA - Web page: https://patentgrep.com/patent/US20180324981A1 ## CPC - H05K 7/20445: {the coupling element being an additional piece, e.g. thermal standoff} - H05K 5/0217: {Mechanical details of casings (covers, lids, hoods or members for covering apertures H05K5/03)} - H05K 7/20: Modifications to facilitate cooling, ventilating, or heating - H05K 7/20145: {Means for directing air flow, e.g. ducts, deflectors, plenum or guides} - H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)} - H05K 7/20909: {Forced ventilation, e.g. on heat dissipaters coupled to components} - H05K 5/023: {Handles; Grips} - H05K 5/04: Metal casings - H05K 7/20172: {Fan mounting or fan specifications} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract To provide an electronic component housing apparatus that is able to efficiently cool the heat of a first and second electronic component, a first electronic component housing chamber 5000 houses the high voltage power supply module 100 (the first electronic component). A second electronic component housing chamber 6000 houses the TWT 200 (the second electronic component). At least some of a first partition plate 2500 and a second partition plate 2600 are provided so as to face each other. A first gap part G1 is provided between the first partition plate 2500 and the second partition plate 2600. ## Claims ### Claim 1 An electronic component housing apparatus comprising: a case housing a first electronic component and a second electronic component having a heat quantity greater than that of the first electronic component; a first electronic component housing chamber housing the first electronic component; a second electronic component housing chamber housing the second electronic component; a first partition plate arranged between the first electronic component housing chamber and the second electronic component housing chamber, on the first electronic component housing chamber side; and a second partition plate arranged between the first electronic component housing chamber and the second electronic component housing chamber, on the second electronic component housing chamber side, wherein the first partition plate and the second partition plate are provided in such a way as to at least partially face each other, and a first gap part is provided between the first partition plate and a second partition plate. ### Claim 2 (depends on 1) The electronic component housing apparatus according to claim 1, further comprising: a first base plate being part of the case and being thermally connected to the first electronic component, the first electronic component being installed on the plate; and a second base plate being part of the case and being thermally connected to the second electronic component, the second electronic component being installed on the plate, wherein the first base plate and the second base plate are provided in such a way as to at least partially face each other, a second gap part is provided between the first base plate and a second base plate, the first partition plate is connected to the first base plate, and the second partition plate is connected to the second base plate, and the first gap part and the second gap part communicate with each other. ### Claim 3 (depends on 2) The electronic component housing apparatus according to claim 2, further comprising a heat radiation part being thermally connected to the second base plate and radiating heat of the second electronic component. ### Claim 4 (depends on 1) The electronic component housing apparatus according to claim 1, further comprising a communicating part causing the first electronic component housing chamber and the second electronic component housing chamber to communicate with each other, wherein a flow path of air flowing from the first electronic component housing chamber to the second electronic component housing chamber through the communicating part is formed. ### Claim 5 (depends on 1) The electronic component storage apparatus according to claim 1, wherein a heat-insulating member inhibiting transfer of heat inside the first gap part or the second gap part is provided in the first gap part or the second gap part. ### Claim 6 An electronic device comprising: a first electronic component; a second electronic component having a heat quantity greater than that of the first electronic component; a case housing a first electronic component and the second electronic component; a first electronic component housing chamber housing the first electronic component; a second electronic component housing chamber housing the second electronic component; a first partition plate arranged between the first electronic component housing chamber and the second electronic component housing chamber, on the first electronic component housing chamber side; and a second partition plate arranged between the first electronic component housing chamber and the second electronic component housing chamber, on the second electronic component housing chamber side, wherein the first partition plate and the second partition plate are provided in such a way as to at least partially face each other, and a first gap part is provided between the first partition plate and a second partition plate. ### Claim 7 (depends on 6) The electronic device according to claim 6, further comprising: a first base plate being part of the case and being thermally connected to the first electronic component, the first electronic component being installed on the plate; and a second base plate being part of the case and being thermally connected to the second electronic component, the second electronic component being installed on the plate, wherein the first base plate and the second base plate are provided in such a way as to at least partially face each other, a second gap part is provided between the first base plate and a second base plate, the first partition plate is connected to the first base plate, and the second partition plate is connected to the second base plate, and the first gap part and the second gap part communicate with each other.