# US 2018/0324978 A1 · Heat dissipation device

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- Number: US 2018/0324978 A1
- Document ID: US20180324978A1
- Status: Published application
- Kind: A1
- Application number: 15/584,038
- Filed: 2017-05-02
- Published: 2018-11-08
- Earliest claimed: 2017-05-02
- Inventors: KAI HUI LIN
- Web page: https://patentgrep.com/patent/US20180324978A1

## CPC

- H10W 40/43: by flowing gases, e.g. forced air cooling
- G06F 1/203: {for portable computers, e.g. for laptops}
- F28D 15/0233: {the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence)}
- G06F 2200/201: Cooling arrangements using cooling fluid
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general)

## Abstract

A heat dissipation device includes a flat heat conductive unit having a flat sealed chamber and a fluid flowing within the flat sealed chamber; the flat sealed chamber including a heat dissipation surface, a heat absorption surface and a peripheral surface; the heat dissipation surface being arranged opposite to the heat absorption surface and the peripheral surface being arranged between the heat dissipation surface and the heat absorption surface; a heat dissipating wall installed and standing on the heat dissipation surface and being enclosed as a receiving space; and a fan received within the receiving space. The heat dissipation device comprises a cover covering on the heat dissipating wall. The cover is a heat dissipation cover and is formed with at least one heat dissipation hole. The cover is adhered to the heat dissipating wall by using heat conducive glue. The cover further includes a fin set.

## Claims

### Claim 1

A heat dissipation device comprising:
a flat heat conductive unit having a flat sealed chamber and a fluid flowing within the flat sealed chamber; the flat sealed chamber including a heat dissipation surface, a heat absorption surface and a peripheral surface; the heat dissipation surface being arranged opposite to the heat absorption surface and the peripheral surface being arranged between the heat dissipation surface and the heat absorption surface;
a heat dissipating wall installed and standing on the heat dissipation surface and being enclosed as a receiving space; and
a fan received within the receiving space.

### Claim 2 (depends on 1)

The heat dissipation device as claimed in claim 1, further comprising a cover covering on the heat dissipating wall.

### Claim 3 (depends on 1)

The heat dissipation device as claimed in claim 1, wherein the cover is a heat dissipation cover.

### Claim 4 (depends on 2)

The heat dissipation device as claimed in claim 2, wherein the cover is formed with at least one heat dissipation hole which is communicated with the receiving space.

### Claim 5 (depends on 3)

The heat dissipation device as claimed in claim 3, wherein the cover is adhered to the heat dissipating wall by using heat conducive glue.

### Claim 6 (depends on 3)

The heat dissipation device as claimed in claim 3, wherein the cover further includes a fin set.

### Claim 7 (depends on 2)

The heat dissipation device as claimed in claim 2, wherein the fan is pivotally installed on the cover.

### Claim 8 (depends on 1)

The heat dissipation device as claimed in claim 1, wherein the heat dissipating wall includes at least one heat dissipating opening which is communicated to the receiving space.

### Claim 9 (depends on 1)

The heat dissipation device as claimed in claim 1, further comprising a fin set installed on the heat dissipation surface.

### Claim 10 (depends on 1)

The heat dissipation device as claimed in claim 1, wherein the heat dissipating wall and the heat dissipation surface are adhered by heat conductive glue.

### Claim 11 (depends on 1)

The heat dissipation device as claimed in claim 1, wherein the flat heat conductive unit is a flat heat conductive tube or a heat conductive plate.