# US 2018/0324953 A1 · Multi-piece wiring substrate, wiring substrate, and method for manufacturing multi-piece wiring substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0324953 A1 - Document ID: US20180324953A1 - Status: Published application - Kind: A1 - Application number: 15/570,997 - Filed: 2017-04-20 - Published: 2018-11-08 - Earliest claimed: 2016-04-22 - Assignees: KYOCERA Corporation - Applicants: KYOCERA Corporation - Inventors: Yoshitomo ONITSUKA - Web page: https://patentgrep.com/patent/US20180324953A1 ## CPC - H05K 3/0029: {of inorganic insulating material} - H03H 3/02: for the manufacture of piezoelectric or electrostrictive resonators or networks (H03H3/08 takes precedence) - H03H 3/08: for the manufacture of resonators or networks using surface acoustic waves - H03H 9/02897: {of strain or mechanical damage, e.g. strain due to bending influence} - H03H 9/058: {for surface acoustic wave devices} - H03H 9/19: consisting of quartz - H05K 1/02: Details - H05K 1/0298: {Multilayer circuits} - H05K 3/00: Apparatus or processes for manufacturing printed circuits - H05K 3/0052: {Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards} - H10W 46/00: Marks applied to devices, e.g. for alignment or identification - H10W 70/68: Shapes or dispositions thereof - H03B 5/326: {the resonator being an acoustic wave device, e.g. SAW or BAW device} - H05K 1/0284: {Details of three-dimensional rigid printed circuit boards (H05K1/119 takes precedence; shaping of the substrate H05K3/0014)} - H05K 1/03: Use of materials for the substrate - H05K 1/119: {Details of rigid insulating substrates therefor, e.g. three-dimensional details (H05K1/117 takes precedence)} - H05K 3/4629: {laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets} - H05K 2201/0909: Preformed cutting or breaking line - H05K 2203/107: Using laser light - H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H03B: GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS (generators adapted for electrophonic musical instruments G10H; masers or lasers H01S; generation of oscillations in plasma H05H) ## Abstract A multi-piece wiring substrate includes a matrix substrate provided with dividing grooves arranged along boundaries of wiring substrate regions in a first principal face and a second principal face, the dividing grooves including first dividing grooves, second dividing grooves, third dividing grooves, and fourth dividing grooves, depths of the first dividing grooves and depths of the second dividing grooves being set to be greater than depths of the third dividing grooves and depths of the fourth dividing grooves, first curved parts being provided so that the depths of the third dividing grooves gradually increase as going toward respective corners of the wiring substrate regions, and second curved parts being provided so that the depths of the fourth dividing grooves gradually increase as going toward the respective corners of the wiring substrate regions. ## Claims ### Claim 1 A multi-piece wiring substrate, comprising: a matrix substrate including a first principal face and a second principal face opposite to the first principal face, the matrix substrate being provided with a plurality of wiring substrate regions, the matrix substrate being provided with dividing grooves arranged along boundaries of the wiring substrate regions in the first principal face and the second principal face, the dividing grooves including first dividing grooves located along respective first sides of the wiring substrate regions in the first principal face, second dividing grooves arranged in the second principal face so as to be opposite to the first dividing grooves, respectively, third dividing grooves located along respective second sides of the wiring substrate regions in the first principal face, and fourth dividing grooves arranged in the second principal face so as to be opposite to the third dividing grooves, respectively, depths of the first dividing grooves and depths of the second dividing grooves being set to be greater than depths of the third dividing grooves and depths of the fourth dividing grooves, first curved parts being provided so that the depths of the third dividing grooves gradually increase as going toward respective corners of the wiring substrate regions, and second curved parts being provided so that the depths of the fourth dividing grooves gradually increase as going toward the respective corners of the wiring substrate regions. ### Claim 2 (depends on 1) The multi-piece wiring substrate according to claim 1, wherein on the first principal surface side, a first curved surface is provided between a first side surface exposed along each of the first sides and a second side surface exposed along each of the second sides, on the second principal surface side, a second curved surface is provided between a third side surface exposed along each of the first sides and a fourth side surface exposed along each of the second sides, and the first curved surface and the second curved surface individually have a width gradually decreasing as going toward a center part of the multi-piece wiring substrate in the thickness direction thereof in each of the wiring board regions. ### Claim 3 (depends on 1) The multi-piece wiring substrate according to claim 1, wherein a first bottom part is provided in a region where each of the first dividing grooves and each of the third dividing grooves intersect with each other, in a transparent plan view of the multi-piece wiring substrate, the first bottom part is located within a first imaginary circle whose center is located in a first intersection part where each of the second dividing grooves and each of the fourth dividing grooves intersect with each other and whose radius is equal to a length between the first intersection part and one end part of each of the second curved parts where the depth of each of the fourth dividing grooves is smallest, a second bottom part is provided in a region where each of the second dividing grooves and each of the fourth dividing grooves intersect with each other, and in a transparent plan view of the multi-piece wiring substrate, the second bottom part is located within a second imaginary circle whose center is located in a second intersection part where each of the first dividing grooves and each of the third dividing grooves intersect with each other and whose radius is equal to a length between the second intersection part and one end part of each of the first curved parts where the depth of each of the third dividing grooves is smallest. ### Claim 4 A wiring substrate, comprising: a substrate including a first principal face and a second principal face opposite to the first principal face and having a rectangular shape in a plan view thereof, the substrate including first side surfaces which are located along a set of opposite first sides of the first principal face, second side surfaces which are located along a set of opposite second sides of the first principal face, third side surfaces which are located along a set of opposite first sides of the second principal face, fourth side surface which are located along a set of opposite second sides of the second principal face, first fracture parts for connecting together the first side surfaces and the third side surfaces, respectively, and second fracture parts for connecting together the second side surfaces and the fourth side surfaces, respectively, in a thickness direction of the substrate, lengths of the first side surfaces and lengths of the third side surfaces being set to be greater than lengths of the second side surfaces and lengths of the fourth side surfaces, first curved parts being provided so that the lengths of the second side surfaces gradually increase as going toward respective corners of the substrate, and second curved parts being provided so that the lengths of the fourth side surfaces gradually increase as going toward the respective corners of the substrate. ### Claim 5 A method for manufacturing a multi-piece wiring substrate, comprising: a step of preparing a matrix substrate including a monolayer or multi-layer ceramic insulating layer, the matrix substrate including a first principal face and a second principal face opposite to the first principal face and forming a plurality of wiring substrate regions provided in the matrix substrate; a step of, by laser processing, forming first dividing grooves on a first principal face side of the matrix substrate along respective first sides of the wiring substrate regions and forming, on the first principal face side along respective second sides of the wiring substrate regions, the third dividing grooves, depths of which are smaller than depths of the first dividing grooves and gradually increase as going toward respective corners of the wiring substrate regions, and thereby forming the first curved parts; and a step of, by laser processing, forming the second dividing grooves on a second principal face side of the matrix substrate along the respective first sides of the wiring substrate regions and forming, on the second principal face side along the respective second sides of the wiring substrate regions, the fourth dividing grooves, depths of which are smaller than depths of the second dividing grooves and gradually increase as going toward the respective corners of the wiring substrate regions, and thereby forming the second curved parts. ### Claim 6 (depends on 5) The method for manufacturing the multi-piece wiring substrate according to claim 5, comprising a step of forming a first bottom part and a second bottom part so that: in a transparent plan view of the multi-piece wiring substrate, the first bottom part formed in a region where each of the first dividing grooves and each of the third dividing grooves intersect with each other is located within a first imaginary circle whose center is located in a first intersection part where each of the second dividing grooves and each of the fourth dividing grooves intersect with each other and whose radius is equal to a length between the first intersection part and one end part of each of the second curved parts where the depth of each of the fourth dividing grooves is smallest; and in a transparent plan view of the multi-piece wiring substrate, the second bottom part formed in a region where each of the second dividing grooves and each of the fourth dividing grooves intersect with each other is located within a second imaginary circle whose center is located in a second intersection part where each of the first dividing grooves and each of the third dividing grooves intersect with each other and whose radius is equal to a length between the second intersection part and each of the first curved parts where the depth of each of the third dividing grooves is smallest. ### Claim 7 (depends on 2) The multi-piece wiring substrate according to claim 2, wherein a first bottom part is provided in a region where each of the first dividing grooves and each of the third dividing grooves intersect with each other, in a transparent plan view of the multi-piece wiring substrate, the first bottom part is located within a first imaginary circle whose center is located in a first intersection part where each of the second dividing grooves and each of the fourth dividing grooves intersect with each other and whose radius is equal to a length between the first intersection part and one end part of each of the second curved parts where the depth of each of the fourth dividing grooves is smallest, a second bottom part is provided in a region where each of the second dividing grooves and each of the fourth dividing grooves intersect with each other, and in a transparent plan view of the multi-piece wiring substrate, the second bottom part is located within a second imaginary circle whose center is located in a second intersection part where each of the first dividing grooves and each of the third dividing grooves intersect with each other and whose radius is equal to a length between the second intersection part and one end part of each of the first curved parts where the depth of each of the third dividing grooves is smallest.