# US 2018/0324949 A1 · Circuit Board and Electronic Module with an Electrode Structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0324949 A1 - Document ID: US20180324949A1 - Status: Published application - Kind: A1 - Application number: 15/970,893 - Filed: 2018-05-04 - Published: 2018-11-08 - Earliest claimed: 2017-05-05 - Assignees: Cyntec Co., Ltd. - Applicants: Cyntec Co., Ltd. - Inventors: Chi-Feng Huang - Web page: https://patentgrep.com/patent/US20180324949A1 ## CPC - H05K 1/117: {Pads along the edge of rigid circuit boards, e.g. for pluggable connectors} - H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 1/14: Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00) - H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)} - H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards - H05K 3/423: {characterised by electroplating method} - H05K 3/3442: {having edge contacts, e.g. leadless chip capacitors, chip carriers} - H05K 3/403: {Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof (H05K3/4092 takes precedence)} - H05K 2201/09009: Substrate related - H05K 2201/09181: Notches in edge pads - H05K 2201/1003: Non-printed inductor - H05K 2201/10378: Interposers - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An electronic module is disclosed, wherein the electronic module comprises: a first circuit board, comprising a top surface, a bottom surface, and a lateral surface connecting the top surface and the bottom surface of the first circuit board; wherein an electrode structure is disposed on the first circuit board, wherein a second circuit board is disposed under the bottom surface of the first circuit board, wherein a soldering material is disposed between the bottom surface of the electrode structure and the second circuit board and extended onto a wettable flank of the electrode structure to form a soldering structure, wherein said soldering structure comprises an outer surface that is located above the bottom surface of the first circuit board and outside the outmost portion of the lateral surface of the first circuit board. ## Claims ### Claim 1 An electronic module, comprising: a first circuit board, comprising a top surface, a bottom surface, and a lateral surface connecting the top surface and the bottom surface; and at least one first electronic device, disposed over the top surface of the first circuit board; wherein an electrode structure is disposed on the first circuit board for electrically connecting with an external circuit, wherein the electrode structure comprises a bottom surface and a side surface, wherein a second circuit board is disposed under the bottom surface of the first circuit board with the bottom surface of the first circuit board facing the top surface of the second circuit board, wherein a soldering material is disposed between the bottom surface of the electrode structure and the top surface of the second circuit board and extended onto said side surface of the electrode structure to form a soldering structure to electrically connect the first circuit board and the second circuit board, wherein said soldering structure comprises an outer surface that is located at a lateral side of the lateral surface of the first circuit board and above the bottom surface of the first circuit board, wherein said outer surface of the soldering structure is located outside the outmost portion of the lateral surface of the first circuit board. ### Claim 2 (depends on 1) The electronic module according to claim 1, wherein an opening is formed on the lateral surface of the first circuit board, wherein the electrode structure comprises at least one metal layer disposed on an inner sidewall of the opening, wherein the opening is partially filled by the at least one metal layer the opening is partially filled by the at least one metal layer, wherein a portion of the soldering structure is disposed inside said opening. ### Claim 3 (depends on 1) The electronic module according to claim 1, wherein an opening is formed on the lateral surface of the first circuit board, wherein the electrode structure comprises at least one metal layer disposed on an inner sidewall of the opening, wherein the opening is entirely filled by the at least one metal layer. ### Claim 4 (depends on 2) The electronic module according to claim 2, wherein said opening is a via on the lateral surface of the first circuit board and has a semi-circular shape. ### Claim 5 (depends on 3) The electronic module according to claim 3, wherein the electrode structure comprises a copper layer formed on the bottom surface of the first circuit board by an electroplating process, wherein the thickness of the copper layer is in the range of 50-100 um. ### Claim 6 (depends on 3) The electronic module according to claim 3, wherein a through-hole is formed on the lateral surface of the first circuit board, wherein the through-hole is entirely filled with a conductive material, wherein the electrode structure comprises at least one metal layer formed on the bottom surface of the through-hole by an electroplating process. ### Claim 7 (depends on 3) The electronic module according to claim 3, wherein a through-hole is formed on the lateral surface of the first circuit board, wherein the through-hole is entirely filled with a conductive material, wherein the electrode structure comprises at least one metal layer formed on the top and the bottom surface of the through-hole by an electroplating process. ### Claim 8 (depends on 2) The electronic module according to claim 2, wherein said at least one metal layer comprises a copper layer disposed on the inner sidewall of the through-hole and a tin layer overlaid on the copper layer. ### Claim 9 (depends on 1) The electronic module according to claim 1, wherein the first circuit board comprises a plurality of insulating layers, wherein a through-hole is formed on a lateral surface of the plurality of insulating layers, wherein a conductive material is disposed in the through-hole for forming the electrode structure. ### Claim 10 (depends on 1) The electronic module according to claim 1, wherein the first circuit board is a PCB board. ### Claim 11 (depends on 1) The electronic module according to claim 1, wherein an IC is embedded inside the first circuit board. ### Claim 12 (depends on 1) The electronic module according to claim 1, wherein an inductor or choke is disposed over the first circuit board, wherein a first copper pillar and a second copper pillar are disposed between said inductor or choke and the first circuit board. ### Claim 13 A circuit board, having a top surface, a bottom surface, and a lateral surface connecting the top surface and the bottom surface, wherein an electrode structure is disposed on the circuit board for electrically connecting with an external board, wherein the electrode structure comprises a bottom surface and a side surface, wherein said external board is disposed under the bottom surface of the circuit board with the bottom surface of the circuit board facing the top surface of the external board, wherein a soldering material is disposed between the bottom surface of the electrode structure and the top surface of the external board and extended onto said side surface of the electrode structure to form a soldering structure to electrically connect the circuit board and the external board, wherein said soldering structure comprises an outer surface that is located at a lateral side of said side surface of the electrode structure and above the bottom surface of the circuit board, wherein said outer surface of the soldering structure is located outside the outmost portion of the lateral surface of the circuit board. ### Claim 14 (depends on 13) The circuit board according to claim 13, wherein an opening is formed on the lateral surface of the first circuit board, wherein the electrode structure comprises at least one metal layer disposed on an inner sidewall of the opening, wherein the opening is partially filled by the at least one metal layer, wherein a portion of the soldering structure is disposed inside said opening. ### Claim 15 (depends on 13) The circuit board according to claim 13, wherein an opening is formed on the lateral surface of the first circuit board, wherein the electrode structure comprises at least one metal layer disposed on an inner sidewall of the opening, wherein the opening is entirely filled by the at least one metal layer. ### Claim 16 (depends on 14) The circuit board according to claim 14, wherein said opening is a via on the lateral surface of the first circuit board and has a semi-circular shape. ### Claim 17 (depends on 15) The circuit board according to claim 15, wherein the electrode structure comprises a copper layer formed on the bottom surface of the first circuit board by an electroplating process, wherein the thickness of the copper layer is in the range of 50-100 um. ### Claim 18 (depends on 15) The circuit board according to claim 15, wherein a through-hole is formed on the lateral surface of the first circuit board, wherein the through-hole is entirely filled with a conductive material, wherein the electrode structure comprises at least one metal layer formed on the bottom surface of the through-hole by an electroplating process. ### Claim 19 (depends on 15) The circuit board according to claim 15, wherein a through-hole is formed on the lateral surface of the first circuit board, wherein the through-hole is entirely filled with a conductive material, wherein the electrode structure comprises at least one metal layer formed on the top and the bottom surface of the through-hole by an electroplating process. ### Claim 20 (depends on 14) The circuit board according to claim 14, wherein said at least one metal layer comprises a copper layer disposed on the inner sidewall of the through-hole and a tin layer overlaid on the copper layer.