# US 2018/0324947 A1 · Metallic nano structure, method of fabricating the same, and electrical apparatus having the same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2018/0324947 A1
- Document ID: US20180324947A1
- Status: Published application
- Kind: A1
- Application number: 15/966,223
- Filed: 2018-04-30
- Published: 2018-11-08
- Earliest claimed: 2017-05-08
- Assignees: University-Industry Foundation (Uif), Yonsei University
- Applicants: University-Industry Foundation (Uif), Yonsei University
- Inventors: Dahl-Young Khang; Sung-Soo Yoon
- Web page: https://patentgrep.com/patent/US20180324947A1

## CPC

- H05K 1/0296: {Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18)}
- G02B 6/107: {Subwavelength-diameter waveguides, e.g. nanowires}
- H05K 1/0212: {Printed circuits or mounted components having integral heating means}
- H05K 3/382: {by special treatment of the metal}
- B23K 28/00: Welding or cutting not covered by groups B23K5/00 - B23K26/00
- B82Y 30/00: Nanotechnology for materials or surface science, e.g. nanocomposites
- B82Y 40/00: Manufacture or treatment of nanostructures
- C22C 2200/04: Nanocrystalline
- H05K 1/097: {Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence)}
- H05K 2201/0257: Nanoparticles
- H05K 2201/026: Nanotubes or nanowires
- H05K 2201/0338: Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
- H05K 2201/09054: Raised area or protrusion of metal substrate
- H05K 2203/0307: Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
- H05K 2203/1131: Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B82Y: SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- C22C: ALLOYS (treatment of alloys C21D, C22F)

## Abstract

The present invention relates to a metallic nano structure including a plurality of metallic nano materials; and a junction locally disposed in a region where the metallic nano materials adjacent to each other among the plurality of metallic nano materials are in contact with each other in order to bond the adjacent metallic nano materials.

## Claims

### Claim 1

A metallic nano structure comprising:
a plurality of metallic nano materials; and
a junction locally disposed in a region where metallic nano materials adjacent to each other among the plurality of metallic nano materials are in contact with each other, so that the metallic nano materials adjacent to each other may be bonded.

### Claim 2 (depends on 1)

The metallic nano structure of claim 1, wherein the plurality of metallic nano materials have a crystal structure, and the junction has the crystal structure.

### Claim 3 (depends on 2)

The metallic nano structure of claim 2, wherein the crystal structure of the junction includes both of a crystal orientation of a first metallic nano material and a crystal orientation of a second metallic nano material among the metallic nano materials adjacent to each other.

### Claim 4 (depends on 1)

The metallic nano structure of claim 1, wherein the junction comprises a part of surfaces of the first metallic nano material and a part of surfaces of the second metallic nano material among the metallic nano materials adjacent to each other.

### Claim 5 (depends on 1)

The metallic nano structure of claim 1, wherein the metallic nano materials include metallic nano wires, metallic nano particles, metallic nano rods, metallic nano discs, metallic nano patterns, metallic nano blocks, metal fibers and metal filaments, or combinations thereof.

### Claim 6 (depends on 1)

The metallic nano structure of claim 1, wherein a part of the metallic nano materials adjacent to each other cross each other in order to form a nano gap.

### Claim 7 (depends on 1)

The metallic nano structure of claim 1, further comprising a flexible polymer substrate providing a surface on which the plurality of metallic nano materials are disposed.

### Claim 8

A method of fabricating a metallic nano structure comprising:
preparing a plurality of metallic nano materials by using at least more than two metallic nano materials adjacent to each other;
exposing the plurality of metallic nano materials to corrosive vapor;
forming a localized etchant in which the corrosive vapor is selectively condensed in a region where the at least more than two metallic nano materials adjacent to each other are in contact with each other;
dissolving a part of a region where the at least more than two adjacent metallic nano materials adjacent to each other are in contact with by the localized etchant; and
forming a junction for bonding the at least more than two metallic nano materials adjacent to each other by resolidifying the dissolved part of the at least more than two metallic nano materials adjacent to each other.

### Claim 9 (depends on 8)

The method of fabricating a metallic nano structure of claim 8, wherein the plurality of metallic nano materials have a crystal structure, and the junction has the crystal structure.

### Claim 10 (depends on 9)

The method of fabricating a metallic nano structure of claim 9, wherein the crystal structure of the junction includes both a crystal orientation of a first metallic nano material and a crystal orientation of a second metallic nano material among the metallic nano materials adjacent to each other.

### Claim 11 (depends on 8)

The method of fabricating a metallic nano structure of claim 8, wherein the plurality of metallic nano materials includes a metallic nano wire, a metallic nano particle, a metallic nano rod, a metallic nano disc, a metallic nano pattern, a metallic nano block, a metal fiber and a metal filament, or a combination thereof.

### Claim 12 (depends on 11)

The method of fabricating a metallic nano structure of claim 11, wherein the metallic nano particle comprises Ag, Cu, Fe, Ni, Co, an alloy thereof, or a combination thereof.

### Claim 13 (depends on 8)

The method of fabricating a metallic nano structure of claim 8, wherein the step for exposing the plurality of metallic nano materials to the corrosive vapor are performed through a process for supplying (spraying) the corrosive vapor to the plurality of metallic nano materials; or a process for transferring the plurality of metallic nano materials to a space filled with the corrosive vapor.

### Claim 14

An electrical device comprising:
a substrate; and
a metallic nano structure comprising:
a plurality of metallic nano materials; and
a junction locally disposed in a region where metallic nano materials adjacent to each other among the plurality of metallic nano materials are in contact with each other, so that the metallic nano materials adjacent to each other may be bonded.

### Claim 15 (depends on 14)

The electrical device of claim 14, wherein the electrical device includes any one of an electrode using the metallic nano structure, a photoelectrical cell, a sensor, and a heater.

### Claim 16 (depends on 15)

The electrical device of claim 15, wherein the heater is formed as a structure in which a first electrode and a second electrode are disposed apart from each other on the metallic nano structure.

### Claim 17 (depends on 14)

The electrical device of claim 14, wherein the plurality of metallic nano materials have a crystal structure, and the junction has the crystal structure.

### Claim 18 (depends on 17)

The electrical device of claim 17, wherein the crystal structure of the junction includes both of a crystal orientation of a first metallic nano material and a crystal orientation of a second metallic nano material among the metallic nano materials adjacent to each other.

### Claim 19 (depends on 14)

The electrical device of claim 14, wherein the junction comprises a part of surfaces of the first metallic nano material and a part of surfaces of the second metallic nano material among the metallic nano materials adjacent to each other.

### Claim 20 (depends on 14)

The electrical device of claim 14, wherein a part of the metallic nano materials adjacent to each other cross each other in order to form a nano gap.
