# US 2018/0324945 A1 · Interface for Limiting Substrate Damage Due to Discrete Failure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0324945 A1 - Document ID: US20180324945A1 - Status: Published application - Kind: A1 - Application number: 15/804,265 - Filed: 2017-11-06 - Published: 2018-11-08 - Earliest claimed: 2017-05-08 - Assignees: International Business Machines Corporation - Applicants: International Business Machines Corporation - Inventors: Bruce J. Chamberlin; Scott B. King; Joseph Kuczynski; David J. Russell - Web page: https://patentgrep.com/patent/US20180324945A1 ## CPC - H05K 1/0293: {Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches} - H05K 1/0201: {Thermal arrangements, e.g. for cooling, heating or preventing overheating} - H05K 1/11: Printed elements for providing electric connections to or between printed circuits - H05K 1/181: associated with surface mounted components - H05K 1/0263: {High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board (H05K1/0293 takes precedence)} - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 1/16: incorporating printed electric components, e.g. printed resistors, capacitors or inductors - H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence) - H05K 1/182: associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] - H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs - H05K 1/186: {manufactured by mounting on or connecting to patterned circuits before or during embedding} - H05K 3/341: Surface mounted components - H05K 2201/0308: Shape memory alloy [SMA] - H05K 2201/10151: Sensor - H05K 2201/10265: Metallic coils or springs, e.g. as part of a connection element - H05K 2201/105: Mechanically attached to another device - H05K 2201/10568: Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element - H05K 2203/043: Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste - H05K 2203/175: Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections - H05K 2203/176: Removing, replacing or disconnecting component; Easily removable component - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An apparatus is provided with a component configured with an interface comprising a resilient material. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to the temperature that meets or exceeds the transition temperature of interface causes the resilient material to undergo a state change. The state change of the interface alters the position of the component, including separation of the component from the substrate. The separation disrupts the attachment thereby mitigating damage to the substrate and/or component. ## Claims ### Claim 1 A method comprising: configuring a component in communication with a substrate in a first position; positioning an interface in communication with the component in a first state, the interface comprising a resilient material; subjecting the interface to a thermal event above a first temperature; responsive to the thermal event, changing a state of the resilient material from the first state to a second state, including physically transforming the resilient material; and the transformation changing a position of the component from the first position to a second position, including separating the component from the substrate. ### Claim 2 (depends on 1) The method of claim 1, wherein the resilient material is a shape memory alloy and wherein a transition temperature of the shape memory alloy is above the first temperature. ### Claim 3 (depends on 2) The method of claim 2, wherein the transition temperature is above about 270 degrees Celsius and less than about 400 degrees Celsius. ### Claim 4 (depends on 1) The method of claim 1, further comprising: encapsulating the resilient material in a body; and wherein transforming further comprises softening the body. ### Claim 5 (depends on 4) The method of claim 4, wherein softening occurs above about 270 degrees Celsius and below about 400 degrees Celsius. ### Claim 6 (depends on 1) The method of claim 1, wherein configuring the component in communication with the substrate further comprises: securing the component to the substrate with an attachment. ### Claim 7 (depends on 6) The method of claim 6, wherein the attachment is a solder joint, and wherein separating the component from the substrate further comprises interrupting the solder joint. ### Claim 8 (depends on 7) The method of claim 7, wherein the thermal event is in response to an electrical short in the component. ### Claim 9 (depends on 8) The method of claim 8, further comprising configuring a non-shorting component in communication with a substrate in a first position; wherein the formation change is limited to separating the component having the electrical short from the substrate, and the non-shorting component remaining operatively coupled to the substrate. ### Claim 10 (depends on 9) The method of claim 9, wherein subjecting the interface to the thermal event further comprises: increasing a temperature of a part to a second temperature above a solder reflow temperature and below a critical temperature of the substrate, wherein the part is selected from the group consisting of the substrate and the component.