# US 2018/0324510 A1 · Mems multi-module assembly, manufacturing method and electronics apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0324510 A1 - Document ID: US20180324510A1 - Status: Published application - Kind: A1 - Application number: 15/772,576 - Filed: 2015-11-03 - Published: 2018-11-08 - Earliest claimed: 2015-11-03 - Assignees: Goertek Inc. - Applicants: Goertek Inc. - Inventors: Quanbo Zou - Web page: https://patentgrep.com/patent/US20180324510A1 ## CPC - H04R 1/04: Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) - B81B 7/0061: {suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound} - B81B 7/02: containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence) - G01L 9/0001: {Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means (G01L9/0026, G01L9/0033, G01L9/0082, G01L9/0089, G01L9/0091 take precedence)} - G01L 19/0092: {Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature (G01L9/025, G01L9/045, G01L9/065, G01L9/085, G01L9/105, G01L9/125, G01L19/02, G01L19/04 take precedence; measuring two or more variable G01D21/02; temperature sensors with pressure compensation G01K1/26)} - H04R 19/005: {using semiconductor materials} - H04R 19/04: Microphones (H04R19/01 takes precedence) - H10W 90/00: Package configurations - B81B 2201/0257: Microphones or microspeakers - B81B 2201/0264: Pressure sensors - B81B 2207/012: the micromechanical device and the control or processing electronics being separate parts in the same package - H04R 2201/003: Mems transducers or their use - H04R 2499/11: Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's - H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K) - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A MEMS multi-module assembly, manufacturing method, and electronics apparatus are disclosed herein. The MEMS multi-module assembly comprises: a first die having a first hole; and a second die stacked on the first die, having a second MEMS device, wherein the second MEMS device is connected outside via the first hole. ## Claims ### Claim at position 1 1-21. (canceled) ### Claim 22 A MEMS multi-module assembly, comprising: a first die having a first hole; and a second die stacked on the first die, having a second MEMS device, wherein the second MEMS device is connected outside via the first hole. ### Claim 23 (depends on 22) The MEMS multi-module assembly according to claim 22, wherein the first die has a pad on the side opposite to the second die. ### Claim 24 (depends on 22) The MEMS multi-module assembly according to claim 22, wherein the first die has a first MEMS device and the first MEMS device is connected outside via the first hole. ### Claim 25 (depends on 22) The MEMS multi-module assembly according to claim 22, further comprising: a third die stacked on the second die. ### Claim 26 (depends on 25) The MEMS multi-module assembly according to claim 25, wherein the third die has a pad on the side opposite to the second die. ### Claim 27 (depends on 25) The MEMS multi-module assembly according to claim 25, wherein the second die has a second hole, the third die has a third MEMS device, and the third MEMS device is connected outside via the first hole and the second hole. ### Claim 28 (depends on 22) The MEMS multi-module assembly according to claim 22, wherein the first die and the second die are bonded through at least one of metal-metal thermal-compression bond, metal/alloy eutectic bond, or electric-conductive adhesive bond. ### Claim 29 (depends on 25) The MEMS multi-module assembly according to claim 25, wherein the second die and the third die are bonded through at least one of metal-metal thermal-compression bond, metal/alloy eutectic bond, or electric-conductive adhesive bond. ### Claim 30 (depends on 22) The MEMS multi-module assembly according to claim 22, wherein the first die and the second die are vertically electrically interconnected by through silicon via. ### Claim 31 (depends on 25) The MEMS multi-module assembly according to claim 25, wherein the second die and the third die are vertically electrically interconnected by through silicon via. ### Claim 32 A method for manufacturing a MEMS multi-module assembly, comprising: forming a first wafer, wherein the first wafer has at least one first MEMS device and has at least one first hole; forming a second wafer, wherein the second wafer has at least one second MEMS device; stacking the second wafer onto the first wafer, wherein the second MEMS device is connected outside via the first hole; and singulating the wafers at a wafer level, to form a MEMS multi-module assembly, wherein each wafer is singulated into at least one dies. ### Claim 33 (depends on 32) The method according to claim 32, further comprising: forming a pad on the first wafer at the side opposite to the second wafer. ### Claim 34 (depends on 32) The method according to claim 32, wherein the first MEMS device is connected outside via the first hole. ### Claim 35 (depends on 32) The method according to claim 32, further comprising: stacking a third wafer on the second wafer. ### Claim 36 (depends on 35) The method according to claim 35, further comprising: forming a pad on the third wafer at the side opposite to the second wafer. ### Claim 37 (depends on 35) The method according to claim 35, wherein the second wafer has at least one second hole, the third wafer has at least one third MEMS device, and the third MEMS device is connected outside via the first hole and the second hole. ### Claim 38 (depends on 32) The method according to claim 32, further comprising: bonding the first wafer and the second wafer through at least one of metal-metal thermal-compression bond, metal/alloy eutectic bond, or electric-conductive adhesive bond. ### Claim 39 (depends on 35) The method according to claim 35, further comprising: bonding the second wafer and the third wafer through at least one of metal-metal thermal-compression bond, metal/alloy eutectic bond, or electric-conductive adhesive bond. ### Claim 40 (depends on 32) The method according to claim 32, further comprising: vertically electrically interconnecting the first wafer and the second wafer by through silicon via. ### Claim 41 (depends on 35) The method according to claim 35, further comprising: vertically electrically interconnecting the second wafer and the third wafer by through silicon via. ### Claim 42 (depends on 22) An electronics apparatus, comprising the MEMS multi-module assembly according to claim 22.