# US 2018/0324338 A1 · Camera module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0324338 A1 - Document ID: US20180324338A1 - Status: Published application - Kind: A1 - Application number: 15/772,451 - Filed: 2016-11-02 - Published: 2018-11-08 - Earliest claimed: 2015-11-06 - Assignees: LG Innotek Co., Ltd. - Applicants: LG Innotek Co., Ltd. - Inventors: JONG HO CHUNG; SUNG IL LEE - Web page: https://patentgrep.com/patent/US20180324338A1 ## CPC - H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof - G02B 7/006: {Filter holders} - G02B 7/08: adapted to co-operate with a remote control mechanism - G02B 7/09: adapted for automatic focusing or varying magnification - G02B 27/646: {compensating for small deviations, e.g. due to vibration or shake (movement of one or more optical elements for control of motion blur in cameras, projectors or printers G03B2205/0007; image stabilisation in cameras peculiar to the presence or use of an electronic image sensor H04N23/68)} - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H05K 3/305: {Affixing by adhesive} - H05K 1/0281: {Reinforcement details thereof} - H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass} - H05K 1/147: {at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence)} - H05K 3/341: Surface mounted components - H05K 2201/0175: Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor - H05K 2201/09036: Recesses or grooves in insulating substrate - H05K 2201/10121: Optical component, e.g. opto-electronic component - H05K 2201/10151: Sensor - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A camera module of an embodiment may comprise: a first holder in which a filter is mounted; a lens barrel which is provided to be vertically movable in a first direction with respect to the first holder; a lens operating device which comprises a terminal and moves the lens barrel in the first direction; a first circuit board which is disposed under the first holder and on which an image sensor is mounted; a soldering part for electrically connecting the terminal of the lens operating device to the first circuit board; and a coupling reinforcement part which is disposed to face the soldering part and couples the lens operating device and the first circuit board. ## Claims ### Claim 1 A camera module, comprising: a first holder on which a filter is mounted; a lens barrel configured to be movable up and down in a first direction with respect to the first holder; a lens driving device configured to move the lens barrel in the first direction and comprising a terminal; a first circuit board on which an image sensor is mounted, wherein the first circuit board is configured to be disposed on a bottom of the first holder; a soldering portion configured to electrically connect the terminal of the lens driving device and the first circuit board; and a coupling reinforcement portion configured to be disposed to face toward the soldering portion and couple the lens driving device and the first circuit board. ### Claim 2 (depends on 1) The camera module of claim 1, wherein the coupling reinforcement portion is formed such that a length direction thereof is perpendicular to the first direction and in parallel with a length direction of the soldering portion. ### Claim 3 (depends on 1) The camera module of claim 1, further comprising a flexible circuit board configured to be electrically connected to the first circuit board. ### Claim 4 (depends on 3) The camera module of claim 3, wherein one side of the flexible circuit board is configured to be coupled to one surface of the first circuit board so that the flexible circuit board is electrically connected to the first circuit board. ### Claim 5 (depends on 4) The camera module of claim 4, wherein an electrically insulating layer is formed on an other surface of a coupling area of the flexible circuit board, where the flexible circuit board is coupled to the first circuit board. ### Claim 6 (depends on 5) The camera module of claim 5, wherein a lower surface of the coupling reinforcement portion is configured to be coupled to an upper surface of the first circuit board or the flexible circuit board. ### Claim 7 (depends on 5) The camera module of claim 5, wherein at least part of a side surface of the coupling reinforcement portion is configured to be coupled to one end of the electrically insulting layer. ### Claim 8 (depends on 1) The camera module of claim 1, wherein the first circuit board is made of a high temperature co-fired ceramic (HTTC) material. ### Claim 9 (depends on 8) The camera module of claim 8, wherein a mounting groove where the image sensor is mounted is formed on the first circuit board. ### Claim 10 (depends on 1) The camera module of claim 1, wherein the lens driving device comprises: a bobbin in which the lens barrel is provided configured to move in the first direction; a first coil configured to be disposed on an outer circumference surface of the bobbin; a first magnet configured to be disposed such that the first magnet faces the first coil; a housing in which the first magnet is disposed; an upper elastic member configured to be provided at an upper side of the bobbin and to elastically support movement of the bobbin in the first direction; a lower elastic member configured to be provided at a lower side of the bobbin and to elastically support movement of the bobbin in the first direction; a printed circuit board in which the terminal is provided, wherein the printed circuit board is configured to be coupled to the housing; and a base configured to be disposed on a bottom of the bobbin. ### Claim 11 (depends on 10) The camera module of claim 10, wherein at least part of a side surface of the coupling reinforcement portion is configured to be coupled to a side surface of the base. ### Claim 12 A camera module, comprising: a lens driving device; a first circuit board on which an image sensor is mounted, wherein the first circuit board is configured to be disposed on a bottom of the lens driving device; a soldering portion configured to be disposed to one end of the lens driving device and electrically connect the lens driving device and the first circuit board; a coupling reinforcement portion configured to be disposed on the other end of the lens driving device to face toward the soldering portion and couple the lens driving device and the first circuit board; and a flexible circuit board configured to be electrically connected to the first circuit board, wherein a lower surface of the coupling reinforcement portion is configured to be coupled to an upper surface of the first circuit board or an upper surface of the flexible circuit board. ### Claim 13 A camera module, comprising: a first circuit board configured to be coupled to a lens driving device, wherein a first terminal is provided on one surface of the first circuit board; a second circuit board made of a flexible material, wherein a second terminal to be coupled to the first terminal is formed on one surface of the second circuit board, and wherein when the first terminal and the second terminal are coupled to each other, the second terminal is partially exposed; and a first reinforcement portion configured to, when the first terminal and the second terminal are coupled to each other, cover an exposed area of the second terminal and be coupled to each of the first and second terminals. ### Claim 14 (depends on 13) The camera module of claim 13, wherein the exposed area of the second terminal is formed on a lower surface of the second circuit board, and wherein a part of the first reinforcement portion is configured to be coupled to the exposed area of the second terminal, another part of the first reinforcement portion is configured to be coupled to a side surface of the first circuit board, and the other part of the first reinforcement portion is configured to be coupled to a remaining area of the lower surface of the second circuit board except the exposed area. ### Claim 15 (depends on 13) The camera module of claim 13, wherein a first cover layer is configured to be coupled to an upper surface of the second circuit board, a second cover layer is configured to be coupled to a lower surface of the second circuit board, and each of the first and second cover layers is made of an electrically insulating material, wherein a plating layer on which the second terminal is disposed is configured to be provided at one side of the second cover layer on the lower surface of the second circuit board, and wherein a part of the plating layer corresponds to the exposed area. ### Claim 16 (depends on 15) The camera module of claim 15, wherein a part of the first reinforcement portion is configured to be coupled to a lower surface of the second cover layer. ### Claim 17 (depends on 15) The camera module of claim 15, wherein a second reinforcement portion that restricts deformation of the second circuit board is configured to be coupled to an area corresponding to the plating layer on the upper surface of the second circuit board. ### Claim 18 (depends on 17) The camera module of claim 17, wherein the second reinforcement portion is formed to be longer than the plating layer along a length direction of the second circuit board. ### Claim 19 (depends on 17) The camera module of claim 17, wherein a third reinforcement portion that restricts the deformation of the second circuit board and has a shape corresponding to the second reinforcement portion is configured to be coupled to an upper surface of the second reinforcement portion. ### Claim 20 (depends on 13) The camera module of claim 13, wherein the first reinforcement portion is made of an ultraviolet setting material or a thermosetting material.