# US 2018/0323764 A1 · Emc-filter > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0323764 A1 - Document ID: US20180323764A1 - Status: Published application - Kind: A1 - Application number: 15/942,986 - Filed: 2018-04-02 - Published: 2018-11-08 - Earliest claimed: 2017-05-02 - Assignees: Hanon Systems - Applicants: Hanon Systems - Inventors: Stephan Werker; Stefan Tydecks; Wilfried Pfahl; Klaus Schulz - Web page: https://patentgrep.com/patent/US20180323764A1 ## CPC - H03H 1/00: Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network (constructional details of electromechanical transducers H03H9/00) - B60H 1/3229: {characterised by constructional features, e.g. housings, mountings, conversion systems (B60H1/3227, B60H1/3233 take precedence)} - H01F 17/06: with core substantially closed in itself, e.g. toroid - H01F 27/22: Cooling by heat conduction through solid or powdered fillings - H01F 27/263: {Fastening parts of the core together} - H01F 27/306: {Fastening or mounting coils or windings on core, casing or other support} - H01F 27/40: Structural association with built-in electric component, e.g. fuse - H02M 7/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections} - H03H 7/0115: {comprising only inductors and capacitors (H03H7/075, H03H7/09, H03H7/12, H03H7/13 take precedence)} - H05K 1/181: associated with surface mounted components - H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)} - B60H 1/3222: {characterised by the compressor driving arrangements, e.g. clutches, transmissions or multiple drives (B60H1/3208, B60H1/3226 take precedence)} - H01F 2017/065: {Core mounted around conductor to absorb noise, e.g. EMI filter} - H03H 2001/0021: {Constructional details} - H05K 2201/10015: Non-printed capacitor - H05K 2201/10272: Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - B60H: ARRANGEMENTS OF HEATING, COOLING, VENTILATING OR OTHER AIR-TREATING DEVICES SPECIALLY ADAPTED FOR PASSENGER OR GOODS SPACES OF VEHICLES - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract The invention which relates to an EMC filter (1) addresses the problem of specifying an EMC filter (1) that is simple of structure, cost-effective and temperature resistant. This problem is resolved thereby that the core of the choke (4, 5) is comprised of one or two core parts (10), that at least one first planar or convex heat transfer area (23) is located on an outside of the core and that the core with this first planar or convex heat transfer area (23) is disposed on a housing (12) of the refrigerant compressor, wherein the housing (12) in the region of the first planar or convex heat transfer area (23) is implemented planar or concave. ## Claims ### Claim at position 1 -10. (canceled) ### Claim 11 An electromagnetic compatibility (EMC) filter connected to an inverter of a refrigerant compressor and comprising at least one choke with a core and several capacitors, wherein the core of the choke is developed having one or two core parts, wherein at least one first planar or convex heat transfer area is disposed on an outside of the core, wherein the core with this first planar or convex heat transfer area is disposed on a housing of the refrigerant compressor, and wherein the housing in the region of the first planar or convex heat transfer area is implemented planar or concave. ### Claim 12 (depends on 11) An EMC filter as in claim 11, wherein a second planar or convex heat transfer area is disposed on the outside of the core, and wherein the second planar or convex heat transfer area is disposed oriented in parallel or oppositely to the first planar or convex heat transfer area. ### Claim 13 (depends on 11) An EMC filter as in claim 11, wherein a bracket is disposed on the second planar or convex heat transfer area of the core and wherein the bracket is connected with the housing. ### Claim 14 (depends on 11) An EMC filter as in claim 11, wherein a cap is disposed on the second planar or convex heat transfer area of the core, wherein the cap is connected with the housing, and wherein the cap in the region of the second planar or convex heat transfer area is implemented planar or concave. ### Claim 15 (depends on 11) An EMC filter according to claim 11, wherein a thermally conductive layer is disposed between the first planar or convex heat transfer area and the housing. ### Claim 16 (depends on 11) An EMC filter according to claim 11, wherein a thermally conductive layer is disposed between the second planar or convex heat transfer area and the bracket or the cap. ### Claim 17 (depends on 11) An EMC filter according to claim 11, wherein a thermally conductive paste or a gap pad is disposed as the thermally conductive layer. ### Claim 18 (depends on 11) An EMC filter according to claim 11, wherein as the winding of the choke in the core a bus bar or at least one conductor track of a circuit board of the inverter is disposed. ### Claim 19 (depends on 11) An EMC filter according to claim 11, wherein washers are disposed on the bracket plate, wherein the plate washers include holes for screws, and wherein the bracket and the plate washers are bolted or secured on the housing with the screws, bolts or adjusting pins. ### Claim 20 (depends on 11) An EMC filter according to claim 11, wherein the bus bar is electrically conducting connected to the circuit board of the inverter and wherein on the circuit board the capacitors of the passive EMC filter are disposed. ### Claim 21 (depends on 12) An EMC filter as in claim 12, wherein a cap is disposed on the second planar or convex heat transfer area of the core, and wherein the cap is connected with the housing, wherein the cap in the region of the second planar or convex heat transfer area is implemented planar or concave. ### Claim 22 (depends on 12) An EMC filter according to claim 12, wherein a thermally conductive layer is disposed between the first planar or convex heat transfer area and the housing. ### Claim 23 (depends on 13) An EMC filter according to claim 13, wherein a thermally conductive layer is disposed between the first planar or convex heat transfer area and the housing. ### Claim 24 (depends on 14) An EMC filter according to claim 14, wherein a thermally conductive layer is disposed between the first planar or convex heat transfer area and the housing. ### Claim 25 (depends on 12) An EMC filter according to claim 12, wherein the bus bar is electrically conducting connected to the circuit board of the inverter, and wherein the capacitors of the passive EMC filter are disposed on the circuit board. ### Claim 26 (depends on 13) An EMC filter according to claim 13, wherein the bus bar is electrically conducting connected to the circuit board of the inverter, and wherein the capacitors of the passive EMC filter are disposed on the circuit board. ### Claim 27 (depends on 14) An EMC filter according to claim 14, wherein the bus bar is electrically conducting connected to the circuit board of the inverter, and wherein the capacitors of the passive EMC filter are disposed on the circuit board. ### Claim 28 (depends on 15) An EMC filter according to claim 15, wherein the bus bar is electrically conducting connected to the circuit board of the inverter, and wherein the capacitors of the passive EMC filter are disposed on the circuit board. ### Claim 29 (depends on 16) An EMC filter according to claim 16, wherein the bus bar is electrically conducting connected to the circuit board of the inverter, and wherein the capacitors of the passive EMC filter are disposed on the circuit board. ### Claim 30 (depends on 17) An EMC filter according to claim 17, wherein the bus bar is electrically conducting connected to the circuit board of the inverter, and wherein the capacitors of the passive EMC filter are disposed on the circuit board.