# US 2018/0323472 A1 · Miniaturized electronics package with patterned thin film solid state battery

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- Number: US 2018/0323472 A1
- Document ID: US20180323472A1
- Status: Published application
- Kind: A1
- Application number: 15/585,924
- Filed: 2017-05-03
- Published: 2018-11-08
- Earliest claimed: 2017-05-03
- Assignees: International Business Machines Corporation
- Applicants: International Business Machines Corporation
- Inventors: Qianwen Chen; Bing Dang; John U. Knickerbocker
- Web page: https://patentgrep.com/patent/US20180323472A1

## CPC

- H01M 10/0585: of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
- A61B 5/681: {Wristwatch-type devices}
- A61B 5/6861: {Capsules, e.g. for swallowing or implanting}
- H01M 10/0436: {Small-sized flat cells or batteries for portable equipment}
- H01M 10/052: Li-accumulators
- A61B 2560/0214: of power generation or supply
- A61B 2562/125: characterised by the manufacture of electrodes
- A61B 2562/166: the sensor is mounted on a specially adapted printed circuit board
- Y02E 60/10: Energy storage using batteries
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H01M: PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D)
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.

## Claims

### Claim 1

A structure for integrating a thin film microbattery with electronic circuitry, the structure comprising:
a thin film microbattery formed over a release layer of a handler, wherein subsequent to formation, the thin film microbattery is removed from the handier and deposited onto an interposer;
electronic circuitry formed on the interposer; and
a seal formed over the thin film microbattery and the electronic circuitry to create individual microbattery modules.

### Claim 2 (depends on 1)

The structure of claim 1, wherein the thin film microbattery includes at least a cathode current collector, a cathode, a solid state electrolyte, an anode, and an anode current collector.

### Claim 3 (depends on 1)

The structure of claim 1, wherein the thin film microbattery and the electronic circuitry are electrically connected by electrical connections formed within the interposer.

### Claim 4 (depends on 1)

The structure of claim 1, wherein the thin film microbattery is removed from the handier by a low-power laser device.

### Claim 5 (depends on 1)

The structure of claim 1, wherein the thin film microbattery is formed via a shadow mask positioned either in a non-engaging relationship with the handler or in direct contact with the handler.

### Claim 6 (depends on 1)

The structure of claim 1, wherein the microbattery modules are incorporated into wearable electronic devices.

### Claim 7 (depends on 6)

The structure of claim 6, wherein the wearable electronic devices enable at least health and fitness monitoring.

### Claim 8

A structure for integrating a thin film microbattery with electronic circuitry, the structure comprising:
a thin film microbattery formed directly on an interposer;
electronic circuitry formed directly on the interposer after complete formation of the thin-film microbattery; and
a seal formed over the thin film microbattery and the electronic circuitry to create individual microbattery modules.

### Claim 9 (depends on 8)

The structure of claim 8, wherein the thin film microbattery includes at least a cathode current collector, a cathode, a solid state electrolyte, an anode, and an anode current collector.

### Claim 10 (depends on 9)

The structure of claim 9, wherein a protective layer covers the thin film microbattery.

### Claim 11 (depends on 8)

The structure of claim 8, wherein the thin film microbattery and the electronic circuitry are electrically connected by electrical connections formed within the interposer.

### Claim 12 (depends on 8)

The structure of claim 8, wherein the thin film microbattery is formed via a shadow mask positioned either in a non-engaging relationship with the interposer or in direct contact with the interposer.

### Claim 13 (depends on 8)

The structure of claim 8, wherein the microbattery modules are incorporated into wearable, implantable, or ingestible electronic devices.

### Claim 14 (depends on 13)

The structure of claim 13, wherein the wearable, implantable, or ingestible electronic devices enable at least health and fitness monitoring.

### Claim at position 15

15-20. (canceled)