# US 2018/0323408 A1 · Method for manufacturing organic electronic device and method for manufacturing sealing member

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2018/0323408 A1
- Document ID: US20180323408A1
- Status: Published application
- Kind: A1
- Application number: 15/763,559
- Filed: 2016-08-04
- Published: 2018-11-08
- Earliest claimed: 2015-09-29
- Assignees: Sumitomo Chemical Company, Limited
- Applicants: Sumitomo Chemical Company, Limited
- Inventors: Masato SHAKUTSUI; Masaya SHIMOGAWARA; Shinichi MORISHIMA
- Web page: https://patentgrep.com/patent/US20180323408A1

## CPC

- H10K 50/8426: {Peripheral sealing arrangements, e.g. adhesives, sealants}
- H05B 33/04: Sealing arrangements {, e.g. against humidity}
- H05B 33/10: Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
- H10K 50/846: {comprising getter material or desiccants}
- H10K 71/00: Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K 77/111: {Flexible substrates}
- Y02E 10/549: Organic PV cells
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

According to a method for manufacturing an organic electronic device, a sealing member (19) that includes a sealing substrate (15), an adhesive part (13) exhibiting adhesiveness and is provided on the sealing substrate (15), and a hygroscopic part (11) being a hygroscopic cured product provided on the adhesive part (13) is bonded to an organic electronic element (17).

## Claims

### Claim 1

A method for manufacturing an organic electronic device in which an organic electronic element is formed on a support substrate, the method comprising:
a sealing member forming step of forming a sealing member that includes a sealing substrate, an adhesive part exhibiting adhesiveness and is formed on the sealing substrate, and a hygroscopic part being a hygroscopic cured product formed on the adhesive part; and
a sealing step of bonding the sealing member to the organic electronic element.

### Claim 2 (depends on 1)

The method for manufacturing an organic electronic device according to claim 1,
wherein the sealing member forming step includes
an adhesive part forming step of forming the adhesive part on the sealing substrate, and
a hygroscopic part forming step of forming the hygroscopic part on the adhesive part.

### Claim 3 (depends on 2)

The method for manufacturing an organic electronic device according to claim 2,
wherein, in the hygroscopic part forming step, the hygroscopic part being the hygroscopic cured product is adhered to the adhesive part.

### Claim 4 (depends on 2)

The method for manufacturing an organic electronic device according to claim 2,
wherein, in the hygroscopic part forming step, a precursor of the hygroscopic part is applied to the adhesive part and cured, so as to from the hygroscopic part.

### Claim 5 (depends on 2)

The method for manufacturing an organic electronic device according to claim 2,
wherein, in the hygroscopic part forming step, a recess with a predetermined pattern is formed in the adhesive part, the recess is filled with a precursor of the hygroscopic part, and the precursor is cured, so as to form the hygroscopic part.

### Claim 6 (depends on 5)

The method for manufacturing an organic electronic device according to claim 5,
wherein the recess is formed by emitting a laser beam.

### Claim 7 (depends on 5)

The method for manufacturing an organic electronic device according to claim 5,
wherein the recess is filled with the precursor of the hygroscopic part by a printing method.

### Claim 8 (depends on 1)

The method for manufacturing an organic electronic device according to claim 1,
wherein, before the sealing member is bonded to the organic electronic element, a dehydration treatment is performed on the sealing member.

### Claim 9 (depends on 1)

The method for manufacturing an organic electronic device according to claim 1,
wherein pressure is applied to bond the heated sealing member and organic electronic element together.

### Claim 10

A method for manufacturing a sealing member that seals an organic electronic element formed on a support substrate, the method comprising:
an adhesive part forming step of forming an adhesive part having an adhesive property on a sealing substrate; and
a hygroscopic part forming step of forming a hygroscopic part being a hygroscopic cured product on the adhesive part.