# US 2018/0323355 A1 · Condensation reaction-type die bonding agent, led light emitting device and method for manufacturing same

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- Number: US 2018/0323355 A1
- Document ID: US20180323355A1
- Status: Published application
- Kind: A1
- Application number: 16/069,556
- Filed: 2017-01-13
- Published: 2018-11-08
- Earliest claimed: 2016-01-15
- Assignees: Citizen Watch Co., Ltd.; Citizen Electronics Co., Ltd.
- Applicants: Citizen Watch Co., Ltd.; Citizen Electronics Co., Ltd.
- Inventors: Hiroo Kajiwara; Yuji Ogawa; Kenichiro Sato; Yuta Yaguchi
- Web page: https://patentgrep.com/patent/US20180323355A1

## CPC

- H10H 20/856: Reflecting means
- C08L 83/04: Polysiloxanes
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- C08G 77/16: to hydroxy groups
- C08G 77/18: to alkoxy or aryloxy groups
- H10H 20/036: {of packages}
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10W 72/071: {Connecting or disconnecting}
- H10W 72/073: {of die-attach connectors}
- H10W 72/075: {of bond wires}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A condensation reaction-type die bonding agent has little liability of poor electrical connection at the electrodes. A condensation reaction-type die bonding agent for bonding an LED device provided on its surface with device electrodes having connection surfaces covered by gold, where the die bonding agent includes (A) a polysilsesquioxane solid in state at room temperature having trisiloxy units (TA) expressed by R1SiO3/2 where, R1 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having hydroxyl groups, (B) a polysilsesquioxane liquid in state at room temperature having trisiloxy units (TB) expressed by R2SiO3/2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having —OR2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and (C) a condensation reaction catalyst.

## Claims

### Claim 1

A condensation reaction-type die bonding agent for bonding an LED device provided on its surface with device electrodes having connection surfaces covered by gold, said die bonding agent comprising:
(A) a polysilsesquioxane solid in state at room temperature having trisiloxy units (TA) expressed by R1SiO3/2 where, R1 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having hydroxyl groups;
(B) a polysilsesquioxane liquid in state at room temperature having 65 mol % to 100 mol % trisiloxy units (TB) expressed by R2SiO3/2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having —OR2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group; and
(C) a condensation reaction catalyst.

### Claim 2 (depends on 1)

The condensation reaction-type die bonding agent according to claim 1, wherein a softening point of the (A) component is 40 to 150° C.

### Claim 3 (depends on 1)

The condensation reaction-type die bonding agent according to claim 1, wherein a viscosity of the (B) component is 5 to 10,000 mPa·s/25° C.

### Claim 4 (depends on 1)

b The condensation reaction-type die bonding agent according to claim 1, further comprising (D) an inorganic filler.

### Claim 5

A method for manufacturing an LED light emitting device comprising the steps of:
using a die bonding agent to bond an LED device provided on its surface with device electrodes having connection surfaces covered by gold to a surface of a mounting substrate having substrate electrodes;
connecting said substrate electrodes and said connection surfaces of said device electrodes by conductive interconnect members; and
sealing said LED device by a sealing member, wherein
said die bonding agent is a condensation reaction type bonding agent comprising:
(A) a polysilsesquioxane solid in state at room temperature having trisiloxy units (TA) expressed by R1SiO3/2 where, R1 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having hydroxyl groups,
(B) a polysilsesquioxane liquid in state at room temperature having 65 mol % to 100 mol % trisiloxy units (TB) expressed by R2SiO3/2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having —OR2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and
(C) a condensation reaction catalyst.

### Claim 6 (depends on 5)

The method for manufacturing an LED light emitting device according to claim 5 wherein the (C) condensation reaction catalyst is at least one catalyst selected from the group comprising compounds of magnesium, aluminum, tin, zinc, iron, cobalt, nickel, zirconium, cerium, titanium, and other metals.

### Claim 7 (depends on 6)

The method for manufacturing an LED light emitting device according to claim 6 wherein the (C) condensation reaction catalyst does not comprise free carboxylic acid.

### Claim 8

An LED light emitting device comprising:
a mounting substrate having substrate electrodes;
an LED device provided on its surface with device electrodes having connection surfaces covered with gold;
a bonding member for bonding a front surface of said mounting substrate and a back surface of said LED device;
conductive interconnect members with one ends connected to said substrate electrodes and with other ends connected to the connection surfaces of said device electrodes; and
a sealing member for sealing said LED device, wherein
said bonding member is obtained by a condensation reaction of
(A) a polysilsesquioxane solid in state at room temperature having trisiloxy units (TA) expressed by R1SiO3/2 where, R1 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having hydroxyl groups,
(B) a polysilsesquioxane liquid in state at room temperature having 65 mol % to 100 mol % trisiloxy units (TB) expressed by R2SiO3/2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having —OR2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and
(C) a condensation reaction catalyst.

### Claim 9 (depends on 8)

The LED light emitting device according to claim 8, wherein the (C) condensation reaction catalyst is at least one catalyst selected from the group comprising compounds of magnesium, aluminum, tin, zinc, iron, cobalt, nickel, zirconium, cerium, titanium, and other metals.

### Claim 10 (depends on 9)

The LED light emitting device according to claim 9, wherein the (C) condensation reaction catalyst does not comprise free carboxylic acid.