# US 2018/0323352 A1 · Optical plate, lighting device, and light source module

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- Number: US 2018/0323352 A1
- Document ID: US20180323352A1
- Status: Published application
- Kind: A1
- Application number: 15/773,390
- Filed: 2016-11-02
- Published: 2018-11-08
- Earliest claimed: 2015-11-04
- Assignees: LG Innotek Co., Ltd.
- Applicants: LG Innotek Co., Ltd.
- Inventors: Sadao TAKANO; Takuma KATO; Iwao SHOHJI
- Web page: https://patentgrep.com/patent/US20180323352A1

## CPC

- H10H 20/8514: {characterised by their shape, e.g. plate or foil}
- H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings
- H10H 20/8512: {Wavelength conversion materials}
- H10H 20/856: Reflecting means
- H10H 20/8583: {not being in contact with the bodies}
- H10W 90/00: Package configurations
- H10H 20/8506: {Containers}
- H10H 20/8515: {not being in contact with the bodies}
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/872: {Periodic patterns for optical field-shaping, e.g. photonic bandgap structures}
- H10W 90/753: {between laterally-adjacent chips}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Disclosed according to one embodiment is a lighting device comprising: a light emitting device having a light emitting chip; and an optical plate corresponding to the light emitting chip, wherein the optical plate comprises: a phosphor layer; a transparent film on the upside and/or downside of the phosphor layer; and a support surrounding the outside of the phosphor layer.

## Claims

### Claim at position 1

1-20. (canceled)

### Claim 21

A lighting device comprising:
a light emitting device having a light emitting chip;
an optical plate corresponding to the light emitting chip; and
a semi-transmissive mirror disposed under the optical plate and overlapped with the light emitting chip in a vertical direction,
wherein the optical plate comprises:
a phosphor layer;
a first transparent film on a top surface of the phosphor layer;
a second transparent film on a bottom surface of the phosphor layer; and
a support surrounding the outer side of the phosphor layer,
wherein the support is disposed between the first and second transparent films,
wherein the semi-transmissive mirror is disposed between the phosphor layer and the light emitting chip, and
wherein an area of a bottom surface of the semi-transmissive mirror is greater than an area of a top surface of the light emitting chip and smaller than n area of a bottom surface of the phosphor layer.

### Claim 22 (depends on 21)

The lighting device according to claim 21, wherein the support comprises at least one of a first stepped part in which the outer side of the first transparent film is disposed, and a second stepped part in which the outer side of the second transparent film is disposed.

### Claim 23 (depends on 21)

The lighting device according to claim 21, wherein a length of at least one of the first and second transparent films in a first axis direction is equal to or greater than a length of the phosphor layer in the first axis direction, and is equal to or less than a length of the support in the first axis direction.

### Claim 24 (depends on 21)

The lighting device according to claim 21, wherein a molding member is disposed between the first transparent film and the light emitting chip, and
wherein the molding member contacts the optical plate.

### Claim 25 (depends on 21)

The lighting device according to claim 21, rein the semi-transmissive mirror is disposed at a region between the first transparent film and the phosphor layer or a region between the first transparent film and the light emitting chip, and
wherein the semi-transmissive mirror reflects or transmits incident light, and has a reflectance higher than that of ae transmissivity.

### Claim 26 (depends on 21)

The lighting device according to claim 21, wherein the first and second transparent films comprise a glass material, and
wherein the support comprises a reflective material.

### Claim 27 (depends on 21)

The ting device according to claim 21, wherein the light emitting device comprises:
a body having a recess; and
a plurality of lead frames disposed in the recess, and
wherein at least one light emitting chip is disposed in the recess and is electrically connected to the plurality of lead frames.

### Claim 28 (depends on 27)

The lighting device according to claim 27, herein the optical plate is disposed on the recess and the body, and
wherein the recess overlaps the phosphor layer in a vertical direction.

### Claim 29 (depends on 28)

The lighting device according to claim 28, wherein a groove and is disposed in the outer side of the body, and an adhesive member is disposed in the groove, and
wherein the optical plate is bonded to the adhesive member.

### Claim 30 (depends on 27)

The lighting device according to claim 27, wherein the optical plate is spaced apart from the light emitting chip in the recess of the body.

### Claim 31 (depends on 28)

The lighting device according to claim 28, wherein at least one of the plurality of lead frames comprises a cavity recessed from the bottom of the recess, and
wherein the light emitting chip is disposed in the cavity.

### Claim 32 (depends on 27)

The lighting device according to claim 27, wherein the phosphor layer is a quantum dot.

### Claim 33 (depends on 27)

The lighting device according to claim 27, further comprising a plate cover having an opening on the optical plate,
wherein the plate cover comprises a top cover part disposed around the top surface of the optical plate, and a side cover part surrounding the side of the light emitting device.

### Claim 34 (depends on 27)

The lighting device according to claim 27, further comprising an adhesive tape bonded between the support and the transparent film.

### Claim 35

A lighting device comprising:
a light emitting device having a light emitting chip; and
an optical plate disposed on the light emitting chip,
wherein the light emitting device includes a body; a plurality of lead frames disposed on the body, the light emitting device being disposed on at least one of the plurality of lead frames, and a molding member on the light emitting chip,
wherein the optical plate comprises:
a first transparent film;
a phosphor layer on the first transparent film;
a second transparent film on the phosphor layer;
a support surrounding the outer side of the phosphor layer and disposed between the first and second transparent films; and
a semi-transmissive mirror disposed on a bottom surface of the first transparent film and reflecting and transmitting incident light,
wherein an area of a bottom surface of the semi-transmissive mirror is larger than an area of a top surface of the light emitting chip, and
wherein the molding member contacts the bottom surface of the semi-transmissive mirror and the bottom surface of the first transparent film.

### Claim 36 (depends on 35)

The lighting device according to claim 35, wherein the semi-transmissive mirror has an oval, circular, or polygonal shape,
wherein the support comprises a reflective material or a transmissive material, and
wherein the phosphor layer is a quantum dot.

### Claim 37 (depends on 35)

The lighting device according to claim 35, wherein a plurality of semi-transmissive mirrors and a plurality of light emitting chips are disposed on the bottom surface of the first transparent film in a first axis direction.

### Claim 38 (depends on 35)

The lighting device according to claim 35, wherein the body of the light emitting device has a recess,
wherein the plurality of lead frames are disposed below the recess and coupled to the body,
wherein the plurality of lead frames are electrically connected to the light emitting chip, and
wherein the optical plate is disposed inside the recess or on a top surface of the body.

### Claim 39 (depends on 35)

The lighting device according to claim 35, wherein the semi-transmissive mirror is spaced from the light emitting chip by 1 mm or less, and
wherein the area of the top surface of the semi-transmission mirror is less two times than the top surface area of the light emitting chip.

### Claim 40 (depends on 35)

The lighting device according to claim 35, wherein the semi-transmissive mirror comprises a metal material or a diffusion sheet and has a reflectance higher than that of a transmissivity.
