# US 2018/0323320 A1 · Optical package and method of producing an optical package

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- Number: US 2018/0323320 A1
- Document ID: US20180323320A1
- Status: Published application
- Kind: A1
- Application number: 15/773,539
- Filed: 2016-11-04
- Published: 2018-11-08
- Earliest claimed: 2015-11-06
- Assignees: Ams AG
- Applicants: ams AG
- Inventors: David MEHRL; Thomas BODNER; Gregor TOSCHKOFF; Harald ETSCHMAIER; Franz SCHRANK
- Web page: https://patentgrep.com/patent/US20180323320A1

## CPC

- H10F 77/413: {directly associated or integrated with the devices, e.g. back reflectors (directly associated or integrated with photovoltaic cells H10F77/42)}
- G02B 3/04: with continuous faces that are rotationally symmetrical but deviate from a true sphere {, e.g. so called "aspheric" lenses}
- G02B 19/0028: {refractive and reflective surfaces, e.g. non-imaging catadioptric systems}
- G02B 19/0061: {the light source comprising a LED}
- G02B 19/0076: {for use with a detector (G02B19/009, G02B19/0095 take precedence)}
- H10F 39/011: {Manufacture or treatment of image sensors covered by group H10F39/12}
- H10F 39/024: {of coatings or optical elements}
- H10F 39/804: {Containers or encapsulations}
- H10F 39/806: {Optical elements or arrangements associated with the image sensors}
- H10F 71/137: {Batch treatment of the devices}
- H10F 77/40: Optical elements or arrangements (surface textures H10F77/70)
- H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80)
- H10F 77/933: {for devices having potential barriers}
- H10H 20/01: Manufacture or treatment
- H10H 20/841: Reflective coatings, e.g. dielectric Bragg reflectors
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10H 20/856: Reflecting means
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10F 39/8057: {Optical shielding}
- H10H 20/0362: {of encapsulations}
- H10H 20/0363: {of optical field-shaping means}
- H10H 20/0364: {of interconnections}
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

An optical package is proposed comprising a carrier, an optoelectronic component, an aspheric lens, and a reflective layer. The carrier comprises electrical interconnections and the optoelectric component is arranged for emitting and/or detecting electromagnetic radiation in a specified wavelength range. Furthermore, the optoelectric component is mounted on the carrier or integrated into the carrier and electrically connected to the electric interconnections. The aspheric lens has an upper surface, a lateral surface, and a bottom surface and the bottom surface is arranged on or near the optoelectric component. The aspheric lens comprises a material which is at least transparent in the specified wavelength range. The reflective layer comprises a reflective material, wherein the reflective layer at least partly covers the lateral surface of the aspheric lens, and wherein the reflective material is at least partly reflective in the specified wavelength range.

## Claims

### Claim 1

An optical package, comprising:
a carrier comprising electrical interconnections,
an optoelectric component arranged for detecting and/or emitting electromagnetic radiation in a specified wavelength range, mounted on the carrier or integrated into the carrier, and electrically connected to the electric interconnections,
an aspheric lens having an upper surface, a lateral surface, and a bottom surface, wherein the bottom surface is arranged at or near the optoelectric component, and wherein the aspheric lens comprises a material which is at least transparent in the specified wavelength range, and
a reflective layer comprising a reflective material, wherein the reflective layer at least partly covers the lateral surface of the aspheric lens, and wherein the reflective material is at least partly reflective in the specified wavelength range.

### Claim 2

(canceled)

### Claim 3 (depends on 1)

The optical package according to claim 1, wherein
the reflective layer covers the lateral surface completely, and/or
the reflective layer covers at least parts of a main surface of the carrier, in particular covers the main surface of the carrier completely.

### Claim 4 (depends on 1)

The optical package according to claim 1, further comprising an encasement which is arranged on the carrier, wherein
the encasement comprises a filler material, and
the encasement comprises sidewalls which at least partly enclose the lateral surface of the aspheric lens.

### Claim 5 (depends on 4)

The optical package according to claim 4, wherein
the reflective layer is coated onto the lateral surface of the aspheric lens or
the reflective layer is coated onto the sidewalls of the encasement.

### Claim 6 (depends on 1)

The optical package according to claim 1, wherein the reflective material of the reflective layer comprises at least one type of metal and/or a metal alloy, in particular, aluminum, chrome, gold, silver and/or an alloy thereof.

### Claim 7 (depends on 1)

The optical package according to claim 1, wherein the filler material is opaque at least in the specified wavelength range, in particular the filler material comprises a moldable material.

### Claim 8 (depends on 1)

The optical package according to claim 1, wherein the optoelectric component comprises:
an optical sensor,
an ambient light sensor,
a color sensor, and/or
an optical proximity sensor.

### Claim 9 (depends on 1)

The optical package according to claim 1, wherein the optoelectric component comprises:
a photodiode, and/or
a light emitting diode.

### Claim 10 (depends on 1)

The optical package according to claim 1, wherein
the aspheric lens has an optical axis, and
the lateral surface, at least in sections, has an aspheric surface profile with respect to the optical axis.

### Claim 11 (depends on 10)

The optical package according to claim 10, wherein the aspheric surface profile, at least in sections, is
hyperbolic,
parabolic,
elliptical, and/or
linear,
conical, and/or
tapered
or a frustum thereof.

### Claim 12 (depends on 11)

The optical package according to claim 11, wherein a length of the aspheric lens along its optical axis is at least equal or greater than a width of the bottom surface.

### Claim 13 (depends on 12)

The optical package according to claim 12, wherein the width of the bottom surface is at least equal or greater than a width of a light sensitive area or light emitting area of the optoelectric component.

### Claim 14 (depends on 1)

The optical package according to claim 1, wherein the encasement comprises an aperture at or near the upper surface arranged for light entrance into the aspheric lens.

### Claim 15 (depends on 1)

The optical package according to claim 1, wherein a diffuser is arranged at or near the upper surface of the aspheric lens.

### Claim 16

A method of producing an optical package, comprising the steps of:
providing a wafer as carrier having electrical interconnections,
mounting at least one optoelectric component on the wafer or into the wafer, wherein the optoelectric component is arranged for emitting and/or detecting electromagnetic radiation in a specified wavelength range,
electrically connecting the optoelectric component to the electric interconnections,
forming a least one aspheric lens having an upper surface, a lateral surface, and a bottom surface from a material which is at least transparent in the specified wavelength range,
arranging the aspheric lens with its bottom surface at or near the optoelectric component,
at least partly covering the lateral surface of the aspheric lens with a reflective layer comprising a reflective material, wherein the reflective material is at least partly reflective in the specified wavelength range.

### Claim 17 (depends on 16)

A method according to claim 16, wherein an encasement is formed on the wafer using a filler material such that sidewalls are formed which at least partly enclose the lateral surface of the aspheric lens.

### Claim 18 (depends on 17)

The method according to claim 17, wherein
the reflective layer is coated at least on the sidewalls of the encasement or
the reflective layer is coated on the lateral surface of the aspheric lens.

### Claim 19 (depends on 17)

The method according to claim 17, wherein
an aperture is formed in the encasement at or near the upper surface of the aspheric lens,
the upper surface of the aspheric lens protrudes into the aperture or the upper surface is modified to flush with an outer surface of the encasement.

### Claim 20 (depends on 19)

The method according to claim 19, wherein
a plurality of optoelectric components are mounted on the wafer, wherein the optoelectric components are arranged for detecting electromagnetic radiation in the specified wavelength range, and the method comprises the steps of:
electrically connecting the optoelectric components to the electric interconnections provided by the wafer,
aspheric lenses, wherein the aspheric lenses have an upper surface, a lateral surface, and a bottom surface, and wherein the upper surface is smaller than the bottom surface,
arranging the aspheric lenses with its bottom surface at or near the optoelectric components, respectively,
covering the an upper surface, the lateral surface, and the bottom surface with the reflective layer,
forming the encasement the wafer such that the filler material at least partly encloses the lateral surfaces of the aspheric lenses and such that apertures are formed in the encasement at or near the upper surfaces of the aspheric lenses, and
singulating the wafer carrying the plurality of optoelectric components into single optical packages.