# US 2018/0323249 A1 · Organic light emitting display device and method of manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0323249 A1 - Document ID: US20180323249A1 - Status: Published application - Kind: A1 - Application number: 16/020,991 - Filed: 2018-06-27 - Published: 2018-11-08 - Earliest claimed: 2014-12-29 - Assignees: LG Display Co., Ltd. - Applicants: LG Display Co., Ltd. - Inventors: Min-Joo Kim; Jung-Sun Beak; Jin-Hee Jang; Nam-Yong Kim - Web page: https://patentgrep.com/patent/US20180323249A1 ## CPC - H10K 59/123: Connection of the pixel electrodes to the thin film transistors [TFT] - H10K 59/131: Interconnections, e.g. wiring lines or terminals - H10K 59/1315: {comprising structures specially adapted for lowering the resistance} - H10K 59/80522: {combined with auxiliary electrodes} - H10K 59/1201: {Manufacture or treatment} - H10K 59/122: Pixel-defining structures or layers, e.g. banks - H10K 59/873: {Encapsulations} - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES ## Abstract An organic light emitting display device and a method of manufacturing the same are provided that may reduce the resistance of a second electrode and may prevent corrosion and metal migration of a pad electrode without adding a separate mask process, or while reducing the number of mask processes. In the organic light emitting display device, an auxiliary line is connected to a second electrode through an auxiliary electrode, which is provided in the same layer as a first electrode, and a pad cover electrode is configured to cover an upper surface and a side surface of a pad connection electrode so as to prevent the pad connection electrode connected to a pad from being exposed outward. ## Claims ### Claim 1 An organic light-emitting display device comprising: an organic emission layer disposed on a substrate; an upper electrode disposed on the organic emission layer; first and second lower electrodes disposed below the upper electrode; and a plurality of lower insulation layers disposed between each of the first and second lower electrodes and the substrate, wherein, among the plurality of lower insulation layers, side surfaces of the lower insulation layers exposed between the first and second lower electrodes face each other. ### Claim 2 (depends on 1) The device according to claim 1, wherein the first and second lower electrodes are formed of at least two layers including a transparent conductive material or a metal material. ### Claim 3 (depends on 1) The device according to claim 1, further comprising an upper insulation layer configured to be in contact with the side surfaces of the lower insulation layers exposed between the first and the second lower electrodes, among the plurality of lower insulation layers. ### Claim 4 (depends on 1) The device according to claim 1, further comprising an upper insulation layer configured to be in contact with the lower insulation layers exposed between the first and the second lower electrodes, among the plurality of lower insulation layers, the upper insulation layer being disposed on a portion of an upper surface and a side surface of each of the first and second lower electrodes. ### Claim 5 (depends on 2) The device according to claim 2, further comprising a plurality of upper insulation layers disposed on opposite side surfaces of each of the first and second lower electrodes, wherein the upper insulation layers disposed between the first and second lower electrodes are spaced apart from each other. ### Claim 6 (depends on 1) The device according to claim 1, wherein the first lower electrode is a first electrode that is connected to a thin-film transistor disposed on the substrate, and wherein the second lower electrode is an auxiliary electrode that is disposed in the same layer as the first lower electrode and is connected to the upper electrode. ### Claim 7 (depends on 6) The device according to claim 6, further comprising: an auxiliary line connected to the auxiliary electrode and disposed below the auxiliary electrode; a connection line configured to interconnect the thin-film transistor and the first electrode and disposed in the same layer as the auxiliary line; an auxiliary cover line disposed to cover an upper surface and a side surface of the auxiliary line; and a connection cover line disposed on the connection line to cover an upper surface and a side surface of the connection line and spaced apart from the auxiliary cover line. ### Claim 8 (depends on 7) The device according to claim 7, wherein the plurality of lower insulation layers comprises: a first protective layer disposed between the first electrode and the connection line; and a second protective layer disposed between the auxiliary electrode and the auxiliary line, and wherein side surfaces of the first and second protective layers exposed between the first electrode and the auxiliary electrode face each other. ### Claim 9 (depends on 8) The device according to claim 8, further comprising an upper insulation layer disposed between the first and second protective layers that face each other. ### Claim 10 An organic light-emitting display device comprising: an organic emission layer disposed on a substrate; an upper electrode disposed on the organic emission layer; a plurality of lower electrodes disposed below the upper electrode; a plurality of lower insulation layers disposed between the lower electrodes and the substrate; and a trench located in each lower insulation layer exposed between the plurality of lower electrodes, among the plurality of lower insulation layers. ### Claim 11 (depends on 10) The device according to claim 10, wherein the plurality of lower electrodes comprises: a first lower electrode connected to a thin-film transistor; and a second lower electrode disposed in the same layer as the first lower electrode. ### Claim 12 (depends on 11) The device according to claim 11, wherein the first and second lower electrodes are formed of at least two layers including a transparent conductive material or a metal material. ### Claim 13 (depends on 10) The device according to claim 10, further comprising an upper insulation layer disposed in the trench. ### Claim 14 (depends on 11) The device according to claim 11, further comprising an upper insulation layer configured to be in contact with a side surface of the lower insulation layer exposed between the first and the second lower electrodes, among the plurality of lower insulation layers. ### Claim 15 (depends on 11) The device according to claim 11, further comprising an upper insulation layer configured to be in contact with the lower insulation layer exposed between the first and the second lower electrodes, among the plurality of lower insulation layers, the upper insulation layer being disposed on a portion of an upper surface and a side surface of the first and second lower electrodes. ### Claim 16 (depends on 11) The device according to claim 11, further comprising a plurality of upper insulation layers disposed on opposite side surfaces of each of the first and second lower electrodes, wherein the upper insulation layers disposed between the first and second lower electrodes are spaced apart from each other. ### Claim 17 (depends on 10) The device according to claim 10, wherein the trench is directed from an upper surface of the lower insulation layer towards the substrate. ### Claim 18 (depends on 13) The device according to claim 13, wherein the first lower electrode is a first electrode that faces the upper electrode with the organic emission layer interposed therebetween, and wherein the second lower electrode is an auxiliary electrode that is connected to the upper electrode. ### Claim 19 (depends on 18) The device according to claim 18, wherein the plurality of lower insulation layers comprises: a first protective layer disposed between the first electrode and a connection line; and a second protective layer disposed between the auxiliary electrode and an auxiliary line, and wherein side surfaces of the first and second protective layers face each other with the upper insulation layer, disposed in the trench, interposed therebetween. ### Claim 20 (depends on 19) The device according to claim 19, further comprising: the auxiliary line connected to the auxiliary electrode and disposed below the auxiliary electrode; the connection line configured to interconnect a thin-film transistor and the first electrode and disposed in the same layer as the auxiliary line; an auxiliary cover line disposed to cover an upper surface and a side surface of the auxiliary line; and a connection cover line disposed on the connection line to cover an upper surface and a side surface of the connection line and spaced apart from the auxiliary cover line with the trench interposed therebetween.