# US 2018/0323165 A1 · Vertically die-stacked bonder and method using the same

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- Number: US 2018/0323165 A1
- Document ID: US20180323165A1
- Status: Published application
- Kind: A1
- Application number: 15/964,165
- Filed: 2018-04-27
- Published: 2018-11-08
- Earliest claimed: 2017-05-02
- Assignees: Gallant Micro. Machining Co., Ltd.
- Applicants: Gallant Micro. Machining Co., Ltd.
- Inventors: Tun-Chih Shih; Liang-Yin Huang
- Web page: https://patentgrep.com/patent/US20180323165A1

## CPC

- H10W 72/011: {Apparatus therefor}
- H10W 72/0711: {Apparatus therefor}
- H10W 72/0198: {batch processes}
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- H10W 72/07173: {Means for moving chips, wafers or other parts, e.g. conveyor belts}
- H10W 72/07178: {Means for aligning}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A vertically die-stacked bonder able to stack laterally dies one by one includes a self-elevating unit, a retrieval unit neighbored to the self-elevating unit, and a receiving unit neighbored to the retrieval unit. At least one die is located at the self-elevating unit. The self-elevating unit elevates one die by 90 degrees, so as to form a vertical state. The retrieval unit hands over the die in the vertical state to the receiving unit. The self-elevating unit then elevates another die by 90 degrees once again. The retrieval unit stacks laterally the another die in the vertical state to the previous die at the receiving unit. Thereupon, by stacking laterally the dies in the vertical state orderly, the speed of die stacking can be increased, the production costs can be reduced, and the productivity can be increased.

## Claims

### Claim 1

A vertically die-stacked bonder, comprising:
a self-elevating unit;
a retrieval unit, neighbored to the self-elevating unit; and
a receiving unit, neighbored to the retrieval unit;
wherein at least one die is located at the self-elevating unit, the self-elevating unit elevates one of the at least one die by 90 degrees so as to have the die into a vertical state, the retrieval unit moves the die in the vertical state to the receiving unit, the self-elevating unit elevates again another one of the at least one die by 90 degrees so as to have this another one die into the vertical state, and the retrieval unit stacks laterally this another one die in the vertical state to the die already in the vertical state at the receiving unit.

### Claim 2 (depends on 1)

The vertically die-stacked bonder of claim 1, wherein the self-elevating unit has a self-elevating carrier and a self-elevating displacement module coupling the self-elevating carrier.

### Claim 3 (depends on 1)

The vertically die-stacked bonder of claim 1, wherein the retrieval unit has at least two sucking modules and a rotational retrieval module, the at least two sucking modules being mounted at the rotational retrieval module.

### Claim 4 (depends on 1)

The vertically die-stacked bonder of claim 1, wherein the receiving unit has a receiving carrier and a receiving displacement module, the receiving carrier being located at the receiving displacement module.

### Claim 5 (depends on 4)

The vertically die-stacked bonder of claim 4, further including a first vision unit, the first vision unit being located under the retrieval unit and respective to the receiving carrier.

### Claim 6 (depends on 5)

The vertically die-stacked bonder of claim 5, wherein the first vision unit aligns the die of the receiving carrier and the die of the retrieval unit.

### Claim 7 (depends on 4)

The vertically die-stacked bonder of claim 4, further including a first vision unit, the first vision unit has an image-capturing module and a lens module, the lens module being located under the retrieval unit and respective to the receiving carrier, the image-capturing module being located above the retrieval unit and respective to the lens module.

### Claim 8 (depends on 7)

The vertically die-stacked bonder of claim 7, wherein the first vision unit aligns the die of the receiving carrier and the die of the retrieval unit.

### Claim 9 (depends on 1)

The vertically die-stacked bonder of claim 1, further including a second vision unit, the second vision unit being located above the self-elevating unit.

### Claim 10 (depends on 1)

The vertically die-stacked bonder of claim 1, further including a supply unit and a third vision unit, the supply unit being neighbored to the self-elevating unit, the third vision unit being located above the supply unit.

### Claim 11 (depends on 10)

The vertically die-stacked bonder of claim 10, wherein the supply unit has a carrier, at least one ejection pin and at least one supply-suck module, the carrier being neighbored to the self-elevating unit, the ejection pin being located in the carrier, the supply-suck module being located above the carrier.

### Claim 12

A vertically die-stacked method, comprising the steps of:
(a) elevating a die by 90 degrees so as to have the die into a vertical state;
(b) sucking the die in the vertical state by a retrieval unit, and moving the die to a receiving unit;
(c) placing the die to the receiving unit by the retrieval unit;
(d) elevating another die by 90 degrees so as to have the another die into the vertical state;
(e) sucking the another die in the vertical state by the retrieval unit, and moving the another die to the receiving unit having the die; and
(f) stacking laterally the another die in the vertical state to the die already at the receiving unit.

### Claim 13 (depends on 12)

The vertically die-stacked method of claim 12, wherein, in the step (f), if a number of the dies stacked at the receiving unit has reached a predetermined amount, then the method is stopped; and, if the number of the dies stacked at the receiving unit has not yet reached the predetermined amount, then go back to perform the step (d).

### Claim 14 (depends on 12)

The vertically die-stacked method of claim 12, wherein, in the step (a), the die is located at a self-elevating carrier of a self-elevating unit, the self-elevating carrier is to elevate 90 degrees so as to have the die elevated by 90 degrees.

### Claim 15 (depends on 12)

The vertically die-stacked method of claim 12, wherein, in the step (b), a first vision unit captures image information of the receiving unit, and provides the image information to the retrieval unit and the receiving unit; wherein, in the step (c), the receiving unit bases on the image information from the first vision unit to adjust a position of the receiving unit with respect to the retrieval unit having the die; wherein, if the receiving unit is confirmed that the die can be placed to the receiving unit, the receiving unit moves laterally to place or adhere the die to the receiving unit; wherein the first vision unit is able to align the dies of the receiving unit and the retrieval unit simultaneously or individually.

### Claim 16 (depends on 12)

The vertically die-stacked method of claim 12, wherein, in the step (e), a first vision unit captures image information of the another die at the receiving unit, and provides the image information to the receiving unit and the retrieval unit; wherein, in the step (f), the receiving unit bases on the image information from the first vision unit to adjust a position of the die at the receiving unit with respect to the another die at the retrieval unit; wherein, if the another die at the retrieval unit is able to stack the another die to the die at the receiving unit, the receiving unit moves laterally so as to have the another die at the retrieval unit to stack laterally onto the die already at the receiving unit; wherein the first vision unit aligns the die at the receiving unit to the another die at the retrieval unit.

### Claim 17 (depends on 12)

The vertically die-stacked method of claim 12, wherein, in the step (e), a second vision unit captures image information of the another die at the self-elevating unit, and provides the image information to the self-elevating unit first position compensation, such that the retrieval unit sucks the another die been compensated in position and already been elevated.

### Claim 18 (depends on 14)

The vertically die-stacked method of claim 14, further including a step of a supply unit providing the die to the self-elevating carrier.

### Claim 19 (depends on 18)

The vertically die-stacked method of claim 18, wherein the supply unit has a carrier, at least one ejection pin and at least one supply-suck module, the ejection pin being located in the carrier, the carrier mounting at least one die, a third vision unit capturing the image information of the die at the carrier so as to provide the image information to the ejection pin and the supply-suck module, the ejection pin basing on the image information to eject a specific die, the supply-suck module basing on the image information to suck the specific die and place the die to the self-elevating unit via the carrier.