# US 2018/0323140 A1 · Electronic device with delamination resistant wiring board

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- Number: US 2018/0323140 A1
- Document ID: US20180323140A1
- Status: Published application
- Kind: A1
- Application number: 16/036,084
- Filed: 2018-07-16
- Published: 2018-11-08
- Earliest claimed: 2016-09-05
- Assignees: Renesas Electronics Corporation
- Applicants: Renesas Electronics Corporation
- Inventors: Hiroki SHIBUYA
- Web page: https://patentgrep.com/patent/US20180323140A1

## CPC

- H10W 20/43: Layouts of interconnections
- H05K 1/0224: {Patterned shielding planes, ground planes or power planes (H05K1/0253 takes precedence)}
- H10W 20/42: Vias, e.g. via plugs
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 70/65: Shapes or dispositions of interconnections
- H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)}
- H05K 2201/09618: Via fence, i.e. one-dimensional array of vias
- H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
- H10W 44/209: {Vertical interconnections, e.g. vias}
- H10W 44/248: {for antennas}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

This invention provides an electronic device with improved reliability. The electronic device has a wiring board with a back-surface ground pattern formed at the back surface of the board. The back-surface ground pattern is provided with a notch overlapping a region of an upper wiring layer at which a board member is exposed and which is encircled by a wide pattern, the notch permitting the release of water vapor from the region.

## Claims

### Claim at position 1

1-15. (canceled)

### Claim 16

An electronic device functioning as a wireless communication unit, comprising:
a wiring board having a front surface and a back surface; and
a semiconductor device mounted over the front surface of the wiring board,
wherein the wiring board includes
a front-surface wiring layer formed at the front surface,
an internal wiring layer formed inside the wiring board, and
a back-surface wiring layer formed at the back surface,
wherein the internal wiring layer includes
a board-member exposed region from which a board member is exposed, and
a first internal wide pattern enclosing the board-member exposed region,
wherein the back-surface wiring layer includes
a back-surface wide pattern, and
a plurality of back-surface terminal patterns formed away from and around the back-surface wide pattern,
wherein a first region is formed between the back-surface wide pattern and a group of the back-surface terminal patterns in plan view, and the first region has a first distance between the back-surface wide pattern and the group of the back-surface terminal patterns,
wherein a second region is formed between the back-surface wide pattern and another group of the back-surface terminal patterns in plan view, and the second region has a second distance between the back-surface wide pattern and the another group of the back-surface terminal patterns, and
wherein the first region overlaps with the board-member exposed region in plan view.

### Claim 17 (depends on 16)

The electronic device according to claim 16,
wherein the back-surface terminal patterns include an antenna terminal connectable to an antenna provided outside the electronic device.

### Claim 18

An electronic device functioning as a wireless communication unit, comprising:
a wiring board having a front surface and a back surface; and
a semiconductor device mounted over the front surface of the wiring board,
wherein the wiring board includes
a front-surface wiring layer formed at the front surface,
an internal wiring layer formed inside the wiring board, and
a back-surface wiring layer formed at the back surface,
wherein the internal wiring layer includes
a board-member exposed region from which the board member is exposed, and
an internal wide pattern divided into a plurality of parts by the board-member exposed region, and
wherein the board-member exposed region is connected to a side surface of the wiring board.

### Claim 19 (depends on 18)

The electronic device according to claim 18,
wherein the back-surface wiring layer includes
the back-surface wide pattern, and
a plurality of back-surface terminal patterns formed away from and around the back-surface wide pattern, and
wherein the back-surface terminal patterns include an antenna terminal connectable to an antenna provided outside the electronic device.