# US 2018/0323134 A1 · Electric conductor track, method, and use > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0323134 A1 - Document ID: US20180323134A1 - Status: Published application - Kind: A1 - Application number: 15/773,633 - Filed: 2016-09-29 - Published: 2018-11-08 - Earliest claimed: 2015-12-03 - Assignees: Continental Teves AG & Co. oHG - Applicants: Continental Teves AG & Co. oHG - Inventors: Svenja Raukopf; Lothar Biebricher; Dietmar Huber; Jakob Schillinger - Web page: https://patentgrep.com/patent/US20180323134A1 ## CPC - H10W 70/438: {of side rails, e.g. having holes} - B23K 20/004: {Wire welding} - B23K 20/10: making use of vibrations, e.g. ultrasonic welding - H01R 4/029: {Welded connections (H01R4/021 - H01R4/028 take precedence)} - H01R 43/0207: {Ultrasonic-, H.F.-, cold- or impact welding} - H10W 70/041: {Connecting or disconnecting interconnections to or from leadframes, e.g. connecting bond wires or bumps} - H10W 70/421: {Shapes or dispositions} - H10W 70/465: {Bumps or wires} - H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00} - H10W 99/00: Subject matter not provided for in other groups of this subclass - B23K 2101/32: Wires - B23K 2101/38: Conductors - B23K 2101/42: Printed circuits - H10W 72/07533: {Ultrasonic bonding, e.g. thermosonic bonding} - H10W 72/5449: {not being orthogonal to a side surface of the chip, e.g. fan-out arrangements} - H10W 72/932: {Plan-view shape, i.e. in top view} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS ## Abstract A conductor track which is designed in particular for use with ultrasonic welding. The invention also relates to an associated method and to an associated use. ## Claims ### Claim 1 An electrical conductor track, comprising: a contact location, which is designed to be connected to an electrical contact by ultrasonic welding, a bonding location, which is designed to bond a bonding wire onto the conductor track, and at least one ultrasonic wave interruption element, which, when ultrasound is coupled in at the contact location, attenuates a propagation of ultrasonic waves from the contact location to the bonding location. ### Claim 2 (depends on 1) The electrical conductor track as claimed in claim 1, wherein the ultrasonic wave interruption element is a hole, in particular an anchor hole. ### Claim 3 (depends on 2) The electrical conductor track as claimed in claim 2, wherein the hole is arranged on a connecting line between the bonding location and the contact location. ### Claim 4 (depends on 1) The electrical conductor track as claimed in claim 1, wherein the ultrasonic wave interruption element is a notch. ### Claim 5 (depends on 1) The electrical conductor track as claimed in claim 1, wherein the ultrasonic wave interruption element is an angled portion. ### Claim 6 (depends on 1) The electrical conductor track as claimed in claim 1, wherein the ultrasonic wave interruption element is an offset portion. ### Claim 7 (depends on 1) The electrical conductor track as claimed in claim 1, further comprising: a plurality of ultrasonic wave interruption elements, which, when ultrasound is used at the contact location, each attenuate a propagation of ultrasonic waves from the contact location to the bonding location. ### Claim 8 (depends on 1) The electrical conductor track as claimed in claim 1, wherein the electrical conductor track is part of a chip package, which contains, in particular, a sensor. ### Claim 9 (depends on 1) The electrical conductor track as claimed in claim 1, which is part of a leadframe. ### Claim 10 (depends on 1) A method for connecting an electrical conductor track to an electrical contact, comprising: providing an electrical conductor track as claimed in claim 1, applying an electrical contact to the contact location, and coupling ultrasound in at the contact location for the purpose of connecting the electrical contact to the electrical conductor track. ### Claim 11 A method for connecting an electrical conductor track to an electrical contact, which has the following steps comprising: providing an electrical conductor track, on which a contact location and a bonding location are formed, applying an electrical contact to the contact location of the electrical conductor track, and coupling ultrasound in at the contact location for the purpose of connecting the electrical contact to the electrical conductor track, wherein a propagation of ultrasonic waves to the bonding location is reduced by a number of ultrasonic wave interruption elements formed in the conductor track. ### Claim 12 (depends on 1, 11) The method as claimed in claim 11, wherein the electrical conductor track is designed as claimed in claim 1. ### Claim 13 (depends on 10) The method as claimed in claim 10, wherein a bonding wire is bonded at the bonding location of the electrical conductor track. ### Claim 14 (depends on 10) The method as claimed in claim 10, wherein a central line of the ultrasound in-coupling does not run through the bonding location. ### Claim 15 The use of ultrasonic welding to connect an electrical contact to an electrical conductor track, wherein a propagation of ultrasonic waves to a bonding location of the conductor track is reduced by at least one ultrasound wave interruption element. ### Claim 16 (depends on 11) The method as claimed in claim 11, wherein a bonding wire is bonded at the bonding location of the electrical conductor track. ### Claim 17 (depends on 12) The method as claimed in claim 12, wherein a bonding wire is bonded at the bonding location of the electrical conductor track. ### Claim 18 (depends on 11) The method as claimed in claim 11, wherein a central line of the ultrasound in-coupling does not run through the bonding location. ### Claim 19 (depends on 12) The method as claimed in claim 12, wherein a central line of the ultrasound in-coupling does not run through the bonding location. ### Claim 20 (depends on 13) The method as claimed in claim 13, wherein a central line of the ultrasound in-coupling does not run through the bonding location.