# US 2018/0323098 A1 · Wafer positioning pedestal for semiconductor processing > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0323098 A1 - Document ID: US20180323098A1 - Status: Published application - Kind: A1 - Application number: 16/024,608 - Filed: 2018-06-29 - Published: 2018-11-08 - Earliest claimed: 2016-10-12 - Assignees: Lam Research Corporation - Applicants: Lam Research Corporation - Inventors: Paul Konkola; Karl F. Leeser; Easwar Srinivasan - Web page: https://patentgrep.com/patent/US20180323098A1 ## CPC - H10P 72/7626: {characterised by the construction of the shaft} - C23C 16/45525: {Atomic layer deposition [ALD]} - C23C 16/45544: {characterized by the apparatus} - C23C 16/458: characterised by the method used for supporting substrates in the reaction chamber - C23C 16/50: using electric discharges {(generation and control of plasma in discharge tubes for surface treatment H01J37/32, H01J37/34)} - H01J 37/32009: {Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources (plasma generation in general H05H1/24)} - H10P 14/6339: {deposition by cyclic CVD, e.g. ALD, ALE or pulsed CVD} - H10P 72/00: Handling or holding of wafers, substrates or devices during manufacture or treatment thereof - H10P 72/50: for positioning, orientation or alignment - H10P 72/72: using electrostatic chucks - H10P 72/7611: {characterised by edge profile or support profile} - H10P 72/7612: {characterised by lifting arrangements, e.g. lift pins} - H10P 72/7614: {characterised by a plurality of individual support members, e.g. support posts or protrusions} - H10P 72/7618: {characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel} - H01J 2237/334: Etching - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) ## Abstract An assembly used in a process chamber for depositing a film on a wafer and including a pedestal extending from a central axis. An actuator is configured for controlling movement of the pedestal. A central shaft extends between the actuator and pedestal, the central shaft configured to move the pedestal along the central axis. A lift pad is configured to rest upon the pedestal and having a pad top surface configured to support a wafer placed thereon. A pad shaft extends between the actuator and the lift pad and controls movement of the lift pad. The pad shaft is positioned within the central shaft and is configured to separate the lift pad from the pedestal top surface by a process rotation displacement when the pedestal is in an upwards position. The pad shaft is configured to rotate relative to the pedestal top surface between first and second angular orientations. ## Claims ### Claim 1 An assembly for use in a process chamber for depositing a film on a wafer, comprising: a pedestal having a pedestal top surface centered about the central axis; and a recess in the pedestal top surface centered about the central axis, the recess having a recess top surface; a lift pad configured to support a wafer resting on a pad top surface of the lift pad, the lift pad centered about the central axis, wherein the lift pad is configured to separate from the pedestal along the central axis. ### Claim 2 (depends on 1) The assembly of claim 1, wherein a diameter of the pad top surface is smaller than a diameter of the wafer. ### Claim 3 (depends on 1) The assembly of claim 1, wherein the pad top surface is coplanar with the pedestal top surface when the lift pad is resting on the recess surface. ### Claim 4 (depends on 1) The assembly of claim 1, further comprising: a pad shaft extending from a bottom of the lift pad along the central axis, the pad shaft configured for movement of the lift pad along the central axis, wherein the pad shaft is positioned in a travel space that extends through the pedestal along the central axis. ### Claim 5 (depends on 4) The assembly of claim 4, wherein the pad shaft is configured to separate the lift pad from the pedestal along the central axis such that the pad top surface is separated from the pedestal top surface by a process rotation displacement. ### Claim 6 (depends on 5) The assembly of claim 5, wherein the pad shaft is configured to rotate the lift pad relative to the pedestal top surface when the lift pad is separated from the pedestal between at least a first angular orientation and a second angular orientation. ### Claim 7 (depends on 1) The assembly of claim 1, wherein the lift pad is configured to move with the pedestal. ### Claim 8 (depends on 1) The assembly of claim 1, wherein the lift pad is configured to separate the lift pad from the pedestal a sufficient distance to allow access by an end-effector. ### Claim 9 An assembly for use in a process chamber for depositing a film on a wafer, comprising: a lift pad configured to support a wafer resting on a pad top surface of the lift pad, the lift pad centered about a central axis, wherein a diameter of the pad top surface is smaller than a diameter of the wafer; a pad shaft extending from a bottom of the lift pad along the central axis, the pad shaft configured for movement of the lift pad along the central axis; an annular ring extending from a bottom of the lift pad, the annular ring configured to fixedly interface with the pad shaft; a pedestal having a pedestal top surface centered about the central axis, wherein the pad shaft is positioned in a travel space that extends through the pedestal along the central axis; and a recess in the pedestal top surface and having a recess surface that is configured to support the lift pad when the lift pad is resting on the recess surface, the recess centered about the central axis, wherein the pad shaft is configured to separate the lift pad from the pedestal along the central axis. ### Claim 10 (depends on 9) The assembly of claim 9, wherein the annular ring is configured to surround an end of the pad shaft. ### Claim 11 (depends on 9) The assembly of claim 9, wherein the pad top surface is coplanar with the pedestal top surface, when the lift pad is resting on the recess surface. ### Claim 12 (depends on 9) The assembly of claim 9, wherein the pad shaft is configured to separate the lift pad from the pedestal such that the pad top surface is separated from the pedestal top surface by a process rotation displacement. ### Claim 13 (depends on 9) The assembly of claim 9, wherein the pad shaft is configured to separate the lift pad from the pedestal a sufficient distance to allow access by an end-effector. ### Claim 14 (depends on 9) The assembly of claim 9, further comprising: a central shaft extending from a bottom of the pedestal along the central axis, the central shaft configured for movement of the pedestal along the central axis, wherein the travel space extends through the central shaft along the central axis, and wherein the pad shaft is positioned in the travel space that extends through the central shaft along the central axis. ### Claim 15 (depends on 14) The assembly of claim 14, wherein the lift pad is configured to move with the pedestal. ### Claim 16 (depends on 14) The assembly of claim 14, wherein the central shaft is configured to move the pedestal to an uppermost upwards position, and wherein the pad shaft separates the lift pad from the pedestal by the process rotation displacement when the pedestal is in the uppermost position. ### Claim 17 (depends on 14) The assembly of claim 14, wherein the central shaft is configured to move the pedestal to a bottommost downwards position, and wherein the pad shaft is configured to separate the lift pad from the pedestal along the central axis by a displacement large enough for entry of an end-effector arm. ### Claim 18 (depends on 9) The assembly of claim 9, wherein the pad shaft is configured to rotate the lift pad relative to the pedestal top surface when the lift pad is separated from the pedestal between at least a first angular orientation and a second angular orientation. ### Claim 19 (depends on 9) The assembly of claim 9, further comprising: a plurality of minimum contact areas (MCAs) disposed on the pedestal top surface configured to support the wafer when the lift pad is resting on the surface of the recess, wherein the lift pad is rotated relative to the plurality of MCAs. ### Claim 20 (depends on 9) The assembly of claim 9, further comprising: a raised rim disposed on an outer edge of the pedestal top surface, the raised rim configured for blocking lateral movement of the wafer that is placed on the pedestal. ### Claim 21 (depends on 9) The assembly of claim 9, further comprising: a lift pin assembly including a plurality of lift pins extending through a plurality of pedestal shafts configured within the pedestal. ### Claim 22 An assembly for use in a process chamber for depositing a film on a wafer, comprising: a lift pad configured to support a wafer resting on a pad top surface of the lift pad, the lift pad centered about a central axis, wherein a diameter of the pad top surface is smaller than a diameter of the wafer; a pad shaft extending from a bottom of the lift pad along the central axis, the pad shaft configured for movement of the lift pad along the central axis; a pedestal having a pedestal top surface centered about the central axis, wherein the pad shaft is positioned in a travel space that extends through the pedestal along the central axis; and a recess in the pedestal top surface and having a recess surface that is configured to support the lift pad when the lift pad is resting on the recess surface, the recess centered about the central axis, wherein the pad shaft is configured to separate the lift pad from the pedestal along the central axis.