# US 2018/0323092 A1 · Fluorescence based thermometry for packaging applications

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- Number: US 2018/0323092 A1
- Document ID: US20180323092A1
- Status: Published application
- Kind: A1
- Application number: 15/585,842
- Filed: 2017-05-03
- Published: 2018-11-08
- Earliest claimed: 2017-05-03
- Assignees: Applied Materials, Inc.
- Applicants: Applied Materials, Inc.
- Inventors: Preetham RAO; ANANTHKRISHNA JUPUDI
- Web page: https://patentgrep.com/patent/US20180323092A1

## CPC

- H10P 72/0602: {Temperature monitoring}
- G01K 11/20: using thermoluminescent materials (G01K11/32 takes precedence)
- G01K 11/32: using changes in transmittance, scattering or luminescence in optical fibres
- H10P 72/0441: {Apparatus for sealing, encapsulating, glassing, decapsulating or the like}
- H10P 72/0604: {Process monitoring, e.g. flow or thickness monitoring}
- H10P 72/7621: {characterised by supporting two or more semiconductor substrates}
- H10P 74/20: characterised by the properties tested or measured, e.g. structural or electrical properties
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 72/0198: {batch processes}
- H10W 72/922: {Bond pads being integral with underlying chip-level interconnections}
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- G01K: MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR (radiation pyrometry G01J5/00)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Methods and apparatus for measuring the temperature of epoxy resin in an electronics package are provided herein. In some embodiments, apparatus for encapsulating an electronics package includes: a process chamber having a chamber body enclosing a processing volume; a substrate support having a support surface for receiving and supporting a substrate for forming an electronics package; and a temperature sensor to measure a temperature of an epoxy resin in an electronics package. The temperature sensor includes: an input apparatus including at least a light source disposed outside the chamber body to provide an excitation light energy to a portion of the epoxy resin; and an output apparatus including at least a signal analyzer disposed outside the chamber body to detect fluorescent light energy emitted by the portion of the epoxy resin and determine a temperature of the epoxy resin based on the excitation light energy and the fluorescent light energy.

## Claims

### Claim 1

Apparatus for encapsulating an electronics package, comprising:
a process chamber having a chamber body enclosing a processing volume;
a substrate support having a support surface for receiving and supporting a substrate for forming an electronics package; and
a temperature sensor to measure a temperature of an epoxy resin in an electronics package, the temperature sensor including:
an input apparatus including at least a light source disposed outside the chamber body to provide an excitation light energy to a portion of the epoxy resin; and
an output apparatus including at least a signal analyzer disposed outside the chamber body to detect fluorescent light energy emitted by the portion of the epoxy resin and determine a temperature of the epoxy resin based on the excitation light energy and the fluorescent light energy.

### Claim 2 (depends on 1)

The apparatus of claim 1, further comprising a heat source disposed about the chamber body or in the processing volume.

### Claim 3 (depends on 1)

The apparatus of claim 1, wherein a first window for ingress of the excitation light energy is formed in the chamber body, and wherein a second window for egress of the fluorescent light energy is formed in the chamber body.

### Claim 4 (depends on 3)

The apparatus of claim 3, wherein a first optics arrangement is disposed between the light source and the first window, and wherein a second optics arrangement is disposed between the second window and the signal analyzer.

### Claim 5 (depends on 3)

The apparatus of claim 3, further comprising a first optical conduit disposed through the first window and a second optical conduit disposed through the second window.

### Claim 6 (depends on 1)

The apparatus of claim 1, wherein light source is an excimer laser.

### Claim 7 (depends on 1)

The apparatus of claim 1, wherein the signal analyzer includes a fluorescence spectrophotometer.

### Claim 8 (depends on 1)

The apparatus of claim 1, further comprising a substrate holder disposed about the substrate support, the substrate holder comprising:
one or more vertical supports; and
a plurality of vertically spaced apart peripheral members extending radially inward from the vertical supports and defining a plurality of vertically spaced apart substrate support positions.

### Claim 9 (depends on 8)

The apparatus of claim 8, further comprising a plurality of temperature sensors, wherein different ones of the plurality of temperature sensors are positioned to sense a temperature of substrates disposed in different ones of the plurality of substrate support positions.

### Claim 10 (depends on 8)

The apparatus of claim 8, wherein the substrate holder further comprises a lift assembly to control the vertical position of the peripheral members.

### Claim 11

A substrate for forming an electronics package, comprising:
a body having an upper surface area;
an array of microcircuit dies disposed in the body and substantially covering the upper surface area; and
an epoxy resin disposed between adjacent microcircuit dies and along the periphery of the body, away from the array of microcircuit dies.

### Claim 12 (depends on 11)

The substrate of claim 11, wherein the epoxy resin further comprises a temperature-sensitive fluorescent compound is selected from a list comprising: polycyclic aromatic hydrocarbon compounds (PAHs), bis-byrene propane, benzoxazolyl stilbene (BOS), perylene, bis 2,5-tert-butylphenyl perylenedicarboximide (BTBP), 1-(4-dimethylaminophenyl)-6-phenyl-1,3,5-hexatriene (DMA-DPH), 9,10-diphenylanthracene (DPA), rhodamine, dichlorofluorescein, sulforhodamine B, 4,4′-diamino-2,2′-stilbenedisulfonic acid, 4 4′-bis(benzoxazolyl)-cis-stilbene and 2 5-bis(benzoxazol-2-yl) thiophene.

### Claim 13 (depends on 11)

The substrate of claim 11, wherein the epoxy resin has a glass transition temperature of about 140° C. to about 150° C.

### Claim 14 (depends on 11)

The substrate of claim 11, further comprising:
one or more chips, wherein the one or more chips comprise memory chips, logic chips, communication chips and sensors;
a redistribution layer (RDL) comprising a polymer layer and one or more conductive traces disposed through the polymer layer; and
one or more contact pads disposed on each of the one or more chips, wherein the one or more contact pads are coupled to the conductive traces of the RDL.

### Claim 15 (depends on 14)

The substrate of claim 14, further comprising:
one or more solder bumps coupled to exposed portions of the conductive traces.

### Claim 16 (depends on 14)

The substrate of claim 14, wherein the epoxy resin provides insulation between the one or more chips of single or adjacently disposed microcircuits.

### Claim 17

A method for measuring a temperature of an epoxy resin in an electronics package, comprising:
(a) providing an excitation light beam to a portion of an epoxy resin encapsulating an electronics package;
(b) receiving a fluorescent light beam emitted from the portion of the epoxy resin;
(c) measuring an emission energy, a wavelength, and an intensity of the fluorescent light beam; and
(d) determining a temperature of the epoxy resin based on the excitation light beam and emitted fluorescent light beams.

### Claim 18 (depends on 17)

The method of claim 17, further comprising repeating (a)-(d) for each epoxy resin selected from a group of epoxy resins to develop a temperature reference look-up table for the group of epoxy resins.

### Claim 19 (depends on 17)

The method of claim 17, further comprising simultaneously measuring temperature of epoxy resin in multiple electronics packages.

### Claim 20 (depends on 17)

The method of claim 17, wherein the wavelength of the excitation light beam is between about 360 nm and about 400 nm.