# US 2018/0323083 A1 · Sensor Device With Media Channel Between Substrates > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0323083 A1 - Document ID: US20180323083A1 - Status: Published application - Kind: A1 - Application number: 15/589,611 - Filed: 2017-05-08 - Published: 2018-11-08 - Earliest claimed: 2017-05-08 - Assignees: Tt Electronics PLC - Applicants: TT Electronics Plc - Inventors: Shivesh Langhanoja; Brent Hans Larson - Web page: https://patentgrep.com/patent/US20180323083A1 ## CPC - H10W 74/014: {using batch processing} - B81B 7/0061: {suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound} - G01L 19/0627: {Protection against aggressive medium in general} - G01L 19/147: {Details about the mounting of the sensor to support or covering means} - H10W 72/0198: {batch processes} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/01: Manufacture or treatment - B81B 7/0032: {Packages or encapsulation (processes for packaging MEMS B81C1/00261; packaging of smart-MEMS B81C1/0023)} - B81B 2201/0264: Pressure sensors - B81B 2207/012: the micromechanical device and the control or processing electronics being separate parts in the same package - B81B 2207/096: through the substrate - G01L 19/0061: {Electrical connection means} - G01L 19/141: {Monolithic housings, e.g. molded or one-piece housings} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 72/522: {Multilayered bond wires, e.g. having a coating concentric around a core} - H10W 72/5522: {comprising gold [Au]} - H10W 72/5524: {comprising aluminium [Al]} - H10W 72/5525: {comprising copper [Cu]} - H10W 72/555: {of outermost layers of multilayered bond wires, e.g. material of a coating} - H10W 74/114: {by a substrate and the encapsulations} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G) ## Abstract A sensor device including: a first substrate having a bottom surface and a top surface; a second substrate having a bottom surface and a top surface, a media channel having two vertical sections and a horizontal section, wherein the two vertical sections are through the second substrate, a portion of the bottom surface of the second substrate forms a top surface of the horizontal section, and a portion of the top surface of the first substrate forms a bottom surface of the horizontal section; a sensor chip disposed on one of the two vertical sections of the media channel; and a molding compound covering side surfaces of the first substrate, the second substrate, and the sensor chip. ## Claims ### Claim 1 A sensor device, comprising: a first substrate having a bottom surface and a top surface; a second substrate having a bottom surface and a top surface, wherein the bottom surface of the second substrate is disposed on the top surface of the first substrate; a media channel having two vertical sections and a horizontal section, wherein the two vertical sections are through the second substrate, a portion of the bottom surface of the second substrate forms a top surface of the horizontal section, and a portion of the top surface of the first substrate forms a bottom surface of the horizontal section; a sensor chip disposed on the top surface of the second substrate and on one of the two vertical sections of the media channel; and a molding compound covering side surfaces of the first substrate, the second substrate, and the sensor chip. ### Claim 2 (depends on 1) The sensor device of claim 1, further comprising: a port disposed on the top surface of the second substrate and directly on the other one of the two vertical sections of the media channel. ### Claim 3 (depends on 2) The sensor device of claim 2, further comprising: another port disposed directly on the sensor chip. ### Claim 4 (depends on 1) The sensor device of claim 1, wherein the first substrate comprises a printed circuit board (PCB) and the second substrate comprises a plastic material, a metallic material, or another PCB. ### Claim 5 (depends on 4) The sensor device of claim 4, further comprising: one or more bond wires electrically connecting the first substrate to the sensor chip. ### Claim 6 (depends on 5) The sensor device of claim 5, further comprising: one or more contact pads on the bottom surface of the first substrate, the one or more contact pads electrically connecting to the sensor chip. ### Claim 7 (depends on 4) The sensor device of claim 4, wherein the bottom surface of the horizontal section of the media channel comprises copper or gold. ### Claim 8 (depends on 4) The sensor device of claim 4, wherein the horizontal section of the media channel comprises a recess in the second substrate. ### Claim 9 (depends on 4) The sensor device of claim 4, wherein the horizontal section of the media channel comprises a recess in the first substrate. ### Claim 10 (depends on 1) The sensor device of claim 1, wherein the first substrate comprises a plastic material, a metallic material, or a PCB, and the second substrate comprises another PCB. ### Claim 11 (depends on 10) The sensor device of claim 10, wherein the top surface of the second substrate includes contact pads, further comprising: one or more bond wires electrically connecting the sensor chip to the contact pads, wherein the molding compound covers the one or more bond wires. ### Claim 12 (depends on 10) The sensor device of claim 10, further comprising: one or more contact pads on the bottom surface of the first substrate; and one or more pins through the first and second substrates and electrically connecting the one or more contact pads to the sensor chip. ### Claim 13 (depends on 10) The sensor device of claim 10, wherein the sensor chip is soldered onto the top surface of the second substrate. ### Claim 14 (depends on 10) The sensor device of claim 10, wherein the horizontal section of the media channel comprises a recess in the first substrate. ### Claim 15 (depends on 10) The sensor device of claim 10, wherein the horizontal section of the media channel comprises a recess in the second substrate. ### Claim at position 16 16-20. (canceled) ### Claim 21 A sensor device, comprising: a first substrate having a bottom surface and a top surface; a second substrate having a bottom surface and a top surface, wherein the bottom surface of the second substrate is disposed over the top surface of the first substrate, wherein the first and second substrates have different materials and at least one of the first and second substrates includes a printed circuit board (PCB); a media channel having two vertical sections and a horizontal section, wherein the two vertical sections are through the second substrate, the horizontal section is between the first and second substrates; a sensor chip disposed over the top surface of the second substrate and directly above one of the two vertical sections of the media channel; and a molding compound covering at least side surfaces of the first substrate, the second substrate, and the sensor chip. ### Claim 22 (depends on 21) The sensor device of claim 21, wherein the top surface of the first substrate is substantially flat, the bottom surface of the second substrate has a recessed portion, and the horizontal section is defined by the recessed portion. ### Claim 23 (depends on 21) The sensor device of claim 21, wherein the first substrate includes a PCB and the second substrate includes a plastic material. ### Claim 24 A sensor device, comprising: a first substrate having a bottom surface and a substantially flat top surface; a second substrate having a bottom surface and a top surface, wherein the bottom surface of the second substrate has a horizontal channel and is disposed over the top surface of the first substrate, the second substrate includes two vertical channels that connect the horizontal channel to the top surface of the second substrate, wherein the first and second substrates have different materials and at least one of the first and second substrates includes a printed circuit board (PCB); a sensor chip disposed over the top surface of the second substrate and directly above one of the two vertical channels; and a molding compound covering at least side surfaces of the first substrate, the second substrate, and the sensor chip. ### Claim 25 (depends on 24) The sensor device of claim 24, further comprising: contact pads on the bottom surface of the first substrate; and conductive elements connecting the contact pads to the sensor chip.