# US 2018/0323070 A1 · Method and system for applying materials on a substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0323070 A1 - Document ID: US20180323070A1 - Status: Published application - Kind: A1 - Application number: 16/023,998 - Filed: 2018-06-29 - Published: 2018-11-08 - Earliest claimed: 2008-11-30 - Assignees: Xjet Ltd. - Applicants: Xjet Ltd. - Inventors: Michael DOVRAT; Ran Asher PELEG; Amir HADAR; Hanan GOTHAIT - Web page: https://patentgrep.com/patent/US20180323070A1 ## CPC - H10P 14/46: using a liquid - B41J 2/155: for line printing - B41J 3/543: {with multiple inkjet print heads (B41J2/17503, B41J2/2103 take precedence)} - B41J 25/001: {Mechanisms for bodily moving print heads or carriages parallel to the paper surface} - B41M 1/22: Metallic printing; Printing with powdered inks - B41M 5/0047: {by ink-jet printing} - C23C 4/01: Selective coating, e.g. pattern coating, without pre-treatment of the material to be coated - H05K 3/125: {by ink-jet printing} - H10F 19/902: {for series or parallel connection of photovoltaic cells} - B41J 2202/04: Heads using conductive ink - B41J 2202/21: Line printing - H05K 2201/09236: Parallel layout - Y02E 10/50: Photovoltaic [PV] energy - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS - B41M: PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING, (correction of typographical errors B41J; processes for applying transfer pictures or the like B44C1/16; fluid media for correction of typographical errors by coating C09D10/00; printing textiles D06P) - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION ## Abstract Embodiments of the invention are directed to a method of printing lines. A method may include positioning a plurality of print units according to a predefined spacing parameter. A method may include depositing material on a substrate by a plurality of print units to form a respective plurality of parallel lines according to a predefined spacing parameter. A printing unit may be positioned at an angle with respect to a predefined scan direction such that a predefined width of a printed line is achieved. A substrate may be rotated between scans such that a plurality of lines in a respective plurality of directions is printed in a scan direction. ## Claims ### Claim 1 A method of printing, the method comprising: positioning a plurality of printing units according to a plurality of spacing values and according to a predefined scan direction; and while introducing a relative translation between a substrate and said printing units according to said predefined scan direction, depositing material on said substrate by said plurality of printing units to form a plurality of parallel lines on said substrate such that said plurality of parallel lines are spaced from each other according to said plurality of spacing values. ### Claim 2 (depends on 1) The method of claim 1, wherein said plurality of printing units comprise a respective plurality of arrays of nozzles arranged along a first direction and wherein positioning said plurality of printing units is such that said first direction is along said scan direction. ### Claim 3 (depends on 2) The method of claim 2, wherein each of said arrays forms one of said plurality of parallel lines. ### Claim 4 (depends on 1) The method of claim 1, wherein within at least one of said line, droplets of said material partially overlap. ### Claim 5 (depends on 1) The method of claim 1, wherein the material is electrically conductive and the substrate is a semiconductor wafer. ### Claim 6 A method of printing, the method comprising: positioning at least one printing unit at a predefined angle with respect to a scan direction wherein said printing unit comprises an array of nozzles arranged along a first direction and wherein said angle is determined based on at least one line width parameter; and while introducing a relative translation between a substrate and said printing unit along said scan direction, depositing material on said substrate by said printing unit to form a line on said substrate according to said width. ### Claim 7 (depends on 6) The method of claim 6, wherein within at least one line, droplets of said material partially overlap. ### Claim 8 (depends on 6) The method of claim 6, wherein the material is electrically conductive and the substrate is a semiconductor wafer. ### Claim 9 A system for printing, comprising: means for positioning a plurality of printing units according to a plurality of spacing values and according to a predefined scan direction; and means for introducing a relative translation between a substrate and said printing units according to said predefined scan direction and for depositing, while introducing said relative translation, material on said substrate by said plurality of printing units to form a plurality of parallel lines on said substrate such that said plurality of parallel lines are spaced from each other according to said plurality of spacing values. ### Claim 10 (depends on 9) The system of claim 9, wherein said plurality of printing units comprise a respective plurality of arrays of nozzles arranged along a first direction and wherein positioning said plurality of printing units is such that said first direction is along said scan direction. ### Claim 11 (depends on 10) The system of claim 10, wherein each of said arrays forms one of said plurality of parallel lines. ### Claim 12 (depends on 9) The system of claim 9, wherein within at least one of said line, droplets of said material partially overlap. ### Claim 13 (depends on 9) The system of claim 9, wherein the material is electrically conductive and the substrate is a semiconductor wafer.