# US 2018/0323069 A1 · Method and device for aligning a first substrate with a second substrate

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- Number: US 2018/0323069 A1
- Document ID: US20180323069A1
- Status: Published application
- Kind: A1
- Application number: 15/970,303
- Filed: 2018-05-03
- Published: 2018-11-08
- Earliest claimed: 2017-05-05
- Assignees: Suss Microtec Lithography GmbH
- Applicants: SUSS MicroTec Lithography GmbH
- Inventors: Katrin Schindler
- Web page: https://patentgrep.com/patent/US20180323069A1

## CPC

- H10P 90/1914: {using bonding}
- C09J 9/02: Electrically-conducting adhesives
- G03F 9/7038: {Alignment for proximity or contact printer (proximity or contact printers per se G03F7/7035)}
- G03F 9/7088: {Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection}
- H10H 20/018: {Bonding of wafers}
- H10P 10/128: {by direct semiconductor to semiconductor bonding}
- H10P 72/57: {Mask-wafer alignment}
- H10W 46/00: Marks applied to devices, e.g. for alignment or identification
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method for aligning a first substrate, in particular a mask, with a second substrate, in particular a wafer, comprises inserting the first substrate and the second substrate into a positioning means; capturing at least one joint image of the first substrate and the second substrate; displaying the image; a plurality of image points in the image being marked by a user; and determining a control command for actuating the positioning means on the basis of the marked image points in such a way that the substrates are aligned with one another.

## Claims

### Claim 1

A method for aligning a first substrate, in particular a mask, with a second substrate, in particular a wafer, comprising:
inserting the first substrate and the second substrate into a positioning means;
capturing at least one joint image of the first substrate and the second substrate;
displaying the image;
a plurality of image points in the image being marked by a user; and
determining a control command for actuating the positioning means on the basis of the marked image points, in such a way that the substrates are aligned with one another.

### Claim 2 (depends on 1)

The method of claim 1 wherein the substrates are aligned with one another laterally in response to the positioning means receiving a control command.

### Claim 3 (depends on 1)

The method according of claim 1 wherein, before the control command is determined, a machine state is detected, for example a current process step, a machine type or a machine configuration.

### Claim 4 (depends on 3)

The method of claim 3 wherein the control command is additionally determined on the basis of the detected machine state.

### Claim 5 (depends on 1)

The method of claim 1 wherein the plurality of image points are marked in the image by the user by clicking on the image points, for example using a peripheral device, or by dragging a mouse cursor.

### Claim 6 (depends on 1)

The method of claim 1 wherein the plurality of image points are marked in the image by the user by touching a touch display.

### Claim 7 (depends on 1)

The method of claim 1 wherein the method step of capturing the image comprises capturing a first joint image and a second joint image of the substrates, the first and the second joint image being displayed side by side, one above the other or alternately.

### Claim 8 (depends on 7)

The method of claim 7 wherein at least two image points in the first joint image and at least two image points in the second joint image are marked.

### Claim 9

A device for aligning a first substrate with a second substrate, comprising
a positioning means into which the substrates can be inserted;
an image capture means which is configured to capture at least one joint image of the substrates inserted into the positioning means;
an input device by means of which a plurality of image points can be marked in the image; and
a control element which is configured to determine a control command for actuating the positioning means on the basis of the marked image points.

### Claim 10 (depends on 9)

The device of claim 9 wherein the device comprises a display device, in particular a screen or a display, for displaying the image.

### Claim 11 (depends on 9)

The device of claim 9 wherein the display device and the input device form a touch display.

### Claim 12 (depends on 9)

The device of claim 9 wherein the input device is a peripheral device, for example a mouse, a trackball or a touchpad.

### Claim 13 (depends on 9)

The device of claim 9 wherein the positioning means comprises a substrate positioning device for the first substrate and/or a substrate positioning device for the second substrate.

### Claim 14 (depends on 9)

The device of claim 9 wherein the image capture means comprises at least one microscope.

### Claim 15 (depends on 9)

The device of claim 9 wherein the image capture means comprises a number of image cameras, which are arranged above and/or below and/or inside the positioning means.

### Claim 16 (depends on 9)

The device of claim 9 wherein the image capture means comprises a movement means for positioning the number of image cameras, the movement means being controllable by means of the input device.
