# US 2018/0323010 A1 · Multilayer electronic component and board having the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0323010 A1 - Document ID: US20180323010A1 - Status: Published application - Kind: A1 - Application number: 15/810,738 - Filed: 2017-11-13 - Published: 2018-11-08 - Earliest claimed: 2017-05-04 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Heung Kil PARK; Jae Yeol CHOI; Young Ghyu AHN; Soo Hwan SON; Se Hun PARK; Gu Won JI - Web page: https://patentgrep.com/patent/US20180323010A1 ## CPC - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G 2/065: {for surface mounting, e.g. chip capacitors} - H01G 4/012: Form of non-self-supporting electrodes - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 1/181: associated with surface mounted components - H05K 3/3442: {having edge contacts, e.g. leadless chip capacitors, chip carriers} - H01G 4/1227: {based on alkaline earth titanates} - H01G 4/248: the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) - H05K 2201/10015: Non-printed capacitor - H05K 2201/10636: Leadless chip, e.g. chip capacitor or resistor - H05K 2201/1078: Leads having locally deformed portion, e.g. for retention - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween. One end of each of the first and second internal electrodes extends, respectively, to a third or fourth surface of the capacitor body. First and second external electrodes respectively include first and second connected portions disposed on the third and fourth surfaces, and first and second band portions respectively extended from the first and second connected portions to portions of a first surface of the capacitor body. A first connection terminal is disposed on the first band portion to provide a first solder accommodating portion, and a second connection terminal is disposed on the second band portion to provide a second solder accommodating portion. ## Claims ### Claim 1 A multilayer electronic component comprising: a capacitor body, including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with dielectric layers interposed therebetween, having first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first, second, third, and fourth surfaces, and opposing each other, wherein one end of each of the first and second internal electrodes is exposed through the third and fourth surfaces, respectively; first and second external electrodes including, respectively, first and second connected portions respectively disposed on the third and fourth surfaces of the capacitor body and first and second band portions respectively extended from the first and second connected portions to portions of the first surface of the capacitor body; a first connection terminal disposed on the first band portion so that a first solder accommodating portion, open toward the third surface of the capacitor body, is provided along the first surface of the capacitor body; and a second connection terminal disposed on the second band portion so that a second solder accommodating portion, open toward the fourth surface of the capacitor body, is provided along the first surface of the capacitor body. ### Claim 2 (depends on 1) The multilayer electronic component of claim 1, wherein the first and second connection terminals are bump terminals. ### Claim 3 (depends on 1) The multilayer electronic component of claim 1, further comprising first and second conductive resin layers formed on at least portions of surfaces of the first and second connection terminals. ### Claim 4 (depends on 1) The multilayer electronic component of claim 1, wherein the first and second connection terminals each have a thickness of 50 μm or more. ### Claim 5 (depends on 1) The multilayer electronic component of claim 1, wherein the first and second connection terminals cover portions of the first and second band portions. ### Claim 6 (depends on 1) The multilayer electronic component of claim 1, wherein the first and second connection terminals are disposed to be spaced apart from the first and second connected portions, respectively, the first solder accommodating portion is a first space portion, open in directions extending towards the third surface, the fifth surface, and the sixth surface of the capacitor body on a lower surface of the first band portion, and the second solder accommodating portion is a second space portion, open in directions extending towards the fourth surface, the fifth surface, and the sixth surface of the capacitor body on a lower surface of the second band portion. ### Claim 7 (depends on 1) The multilayer electronic component of claim 1, wherein the first and second external electrodes further respectively include third and fourth band portions extended from the first and second connected portions to portions of the second surface of the capacitor body, and third and fourth connection terminals are disposed on the third and fourth band portions, respectively, to be disposed opposite to the first and second connection terminals, respectively. ### Claim 8 (depends on 1) The multilayer electronic component of claim 1, wherein BW/4≤G≤3 BW/4 in which BW is a width of the first or second band portion of the first or second external electrode, and G is a length of the first or second solder accommodating portion. ### Claim 9 (depends on 1) The multilayer electronic component of claim 1, wherein W/2≤BG≤W in which BG is a width of the first or second connection terminal measured in a first direction parallel to the third and fourth surfaces of the capacitor body, and W is a width of the capacitor body measured in the first direction. ### Claim 10 (depends on 1) The multilayer electronic component of claim 1, wherein the first connection terminal has a first cut portion so that the first solder accommodating portion is provided, and the second connection terminal has a second cut portion so that the second solder accommodating portion is provided. ### Claim 11 (depends on 10) The multilayer electronic component of claim 10, wherein the first and second cut portions have curved surfaces. ### Claim 12 (depends on 10) The multilayer electronic component of claim 10, wherein the first and second cut portions include a plurality of bent surfaces. ### Claim 13 (depends on 1) The multilayer electronic component of claim 1, wherein two first connection terminals are disposed on the first band portion to be spaced apart from each other in a direction in which the fifth surface and the sixth surface of the capacitor body are connected to each other, and two second connection terminals are disposed on the second band portion to be spaced apart from each other in the direction in which the fifth surface and the sixth surface of the capacitor body are connected to each other. ### Claim 14 (depends on 13) The multilayer electronic component of claim 13, wherein the first and second external electrodes further include third and fourth band portions extended from the first and second connected portions to portions of the second surface of the capacitor body, respectively, two third connection terminals are disposed on the third band portion to be spaced apart from each other in the direction in which the fifth surface and the sixth surface of the capacitor body are connected to each other, and two fourth connection terminals are disposed on the fourth band portion to be spaced apart from each other in the direction in which the fifth surface and the sixth surface of the capacitor body are connected to each other. ### Claim 15 (depends on 13) The multilayer electronic component of claim 13, wherein lower surfaces of the first and second connection terminals are flat. ### Claim 16 (depends on 13) The multilayer electronic component of claim 13, wherein the first and second connection terminals are convex in a mounting direction. ### Claim 17 A multilayer electronic component comprising: a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with dielectric layers interposed therebetween having first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first, second, third, and fourth surfaces, and opposing each other, wherein one end of each of the first and second internal electrodes is exposed through the third and fourth surfaces, respectively; first and second external electrodes including, respectively, first and second connected portions respectively disposed on the third and fourth surfaces of the capacitor body and first and second band portions respectively extended from the first and second connected portions to portions of the first surface of the capacitor body; a first connection terminal disposed on the first band portion to be spaced apart from the first connected portion so that a first space portion, open in directions corresponding to the third surface, the fifth surface, and the sixth surface of the capacitor body is provided on a lower surface of the first band portion; and a second connection terminal disposed on the second band portion to be spaced apart from the second connected portion so that a second space portion, open in directions corresponding to the fourth surface, the fifth surface, and the sixth surface of the capacitor body is provided on a lower surface of the second band portion. ### Claim 18 (depends on 17) The multilayer electronic component of claim 17, wherein the first and second external electrodes further include third and fourth band portions extended from the first and second connected portions to portions of the second surface of the capacitor body, respectively, and third and fourth connection terminals are disposed on the third and fourth band portions, respectively, to be disposed opposite to the first and second connection terminals, respectively. ### Claim 19 (depends on 17) The multilayer electronic component of claim 17, wherein BW/4≤G≤3 BW/4 in which BW is a width of the first or second band portion of the first or second external electrode, and G is a length of the first or second space portion. ### Claim 20 (depends on 17) The multilayer electronic component of claim 17, wherein W/2≤BG≤W in which BG is a width of the first or second connection terminal measured in a first direction parallel to the third and fourth surfaces of the capacitor body, and W is a width of the capacitor body measured in the first direction. ### Claim 21 A multilayer electronic component comprising: a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with dielectric layers interposed therebetween having first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first, second, third, and fourth surfaces, and opposing each other, wherein one end of each of the first and second internal electrodes is exposed through the third and fourth surfaces, respectively; first and second external electrodes including, respectively, first and second connected portions respectively disposed on the third and fourth surfaces of the capacitor body and first and second band portions respectively extended from the first and second connected portions to portions of the first surface of the capacitor body; a first connection terminal disposed on the first band portion and having a first cut portion open toward the third surface of the capacitor body; and a second connection terminal disposed on the second band portion and having a second cut portion open toward the fourth surface of the capacitor body. ### Claim 22 (depends on 21) The multilayer electronic component of claim 21, wherein the first and second cut portions have curved surfaces. ### Claim 23 (depends on 21) The multilayer electronic component of claim 21, wherein the first and second cut portions include a plurality of bent surfaces. ### Claim 24 (depends on 1) A board having a multilayer electronic component, comprising: a circuit board having first and second electrode pads disposed on one surface thereof; and the multilayer electronic component of claim 1 mounted on the circuit board so that the first and second connection terminals are respectively connected to the first and second electrode pads. ### Claim 25 (depends on 17) A board having a multilayer electronic component, comprising: a circuit board having first and second electrode pads disposed on one surface thereof; and the multilayer electronic component of claim 17 mounted on the circuit board so that the first and second connection terminals are respectively connected to the first and second electrode pads. ### Claim 26 (depends on 21) A board having a multilayer electronic component, comprising: a circuit board having first and second electrode pads disposed on one surface thereof; and the multilayer electronic component of claim 21 mounted on the circuit board so that the first and second connection terminals are respectively connected to the first and second electrode pads. ### Claim 27 A multilayer electronic component comprising: a capacitor body including pluralities of first and second internal electrodes alternately stacked with dielectric layers disposed therebetween; first and second external electrodes disposed on respective opposing end surfaces of the capacitor body and respectively connected to the pluralities of first and second internal electrodes, wherein the first and second external electrodes respectively include first and second connected portions disposed on a connecting surface of the capacitor body connecting the opposing end surfaces of the capacitor body; a first connection terminal disposed on the first connected portion on the connecting surface of the capacitor body, the first connection terminal comprising first and second connection terminal portions disposed separately from each other on the first connected portion to form a first space for accommodating solder; and a second connection terminal disposed on the second connected portion on the connecting surface of the capacitor body, the second connection terminal comprising third and fourth connection terminal portions disposed separately from each other on the second connected portion to form a second space for accommodating solder. ### Claim 28 (depends on 27) The multilayer electronic component of claim 27, wherein the first and second external electrodes are disposed on respective end surfaces of the capacitor body opposing each other in a length direction, the first and second connection terminal portions are spaced apart from each other on the first connected portion in a direction orthogonal to the length direction, and the third and fourth connection terminal portions are spaced apart from each other on the second connected portion in the direction orthogonal to the length direction. ### Claim 29 (depends on 27) The multilayer electronic component of claim 27, wherein the first, second, third, and fourth connection terminal portions each have a cuboid shape. ### Claim 30 (depends on 29) The multilayer electronic component of claim 29, wherein the first connection terminal further comprises a cuboid connection terminal portion disposed between the first and second connection terminal portions on the first connected portion and extending from the first connection terminal portion to the second connection terminal portion; and the second connection terminal further comprises a cuboid connection terminal portion disposed between the third and fourth connection terminal portions on the second connected portion and extending from the third connection terminal portion to the fourth connection terminal portion. ### Claim 31 (depends on 30) The multilayer electronic component of claim 30, wherein the cuboid connection terminal portions of the first and second connection terminals are spaced away from the opposing end surfaces of the capacitor body. ### Claim 32 (depends on 27) The multilayer electronic component of claim 27, wherein the first, second, third, and fourth connection terminal portions each have a hemispherical shape.