Fingerprint identification module

A fingerprint identification module, comprising:

• an electrical mechanism and a mechanics mechanism provided on the periphery of the electrical mechanism that is configured to disperse a pressure loaded on the electrical mechanism, wherein
• the mechanics mechanism includes an upper cover plate and a force transmission component with a hollowed-out middle portion, the upper cover plate being provided on the top of the force transmission component and forming an accommodation space together with the force transmission component;
• and
• the electrical mechanism includes a circuit board and a fingerprint identification chip, the circuit board including an extension portion and a connection portion, the fingerprint identification chip being provided in the accommodation space and being electrically connected to the connection portion via a conductor, a top end face of the fingerprint identification chip being fixedly connected to a bottom end face of the upper cover plate, and the horizontal height of a bottom end face of the connection portion being higher than that of a bottom end face of the mechanics mechanism.