# US 2018/0321584 A1 · Mold, imprint device, and imprint method

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- Number: US 2018/0321584 A1
- Document ID: US20180321584A1
- Status: Published application
- Kind: A1
- Application number: 15/768,030
- Filed: 2017-06-09
- Published: 2018-11-08
- Earliest claimed: 2016-07-05
- Assignees: Panasonic Intellectual Property Management Co., Ltd.
- Applicants: Panasonic Intellectual Property Management Co., Ltd.
- Inventors: AKIHIRO ISHIKAWA; TOSIHIKO WADA; TEPPEI IWASE
- Web page: https://patentgrep.com/patent/US20180321584A1

## CPC

- G03F 7/0002: {Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping}
- B29C 33/40: Plastics, e.g. foam or rubber
- B29C 33/424: {Moulding surfaces provided with means for marking or patterning (for injection moulding B29C45/372)}
- B29C 35/0888: {using transparant moulds}
- B29C 59/026: {of layered or coated substantially flat surfaces}
- B29C 59/046: {for layered or coated substantially flat surfaces}
- B29C 2035/0827: {using UV radiation}
- B29C 2059/023: {Microembossing}
- B29K 2995/0094: Geometrical properties
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS

## Abstract

A mold includes a rugged pattern layer, an inorganic sheet layer, and an elastic sheet layer. The inorganic sheet layer is formed of an inorganic material and supports the rugged pattern layer. The elastic sheet layer supports the inorganic sheet layer.

## Claims

### Claim 1

A mold comprising:
a rugged pattern layer;
an inorganic sheet layer that is formed of an inorganic material and supports the rugged pattern layer; and
an elastic sheet layer that supports the inorganic sheet layer.

### Claim 2 (depends on 1)

The mold of claim 1,
wherein the elastic sheet layer is larger than the inorganic sheet layer in top view, and
wherein the elastic sheet layer has a region not covered with the inorganic sheet layer.

### Claim 3 (depends on 1)

The mold of claim 1,
wherein the rugged pattern layer is formed of resin,
wherein the elastic sheet layer is formed of resin, and
wherein the inorganic sheet layer is formed of glass.

### Claim 4 (depends on 1)

The mold of claim 1,
wherein a thickness of the elastic sheet layer is larger than a thickness of the inorganic sheet layer, and
wherein the thickness of the inorganic sheet layer is larger than a thickness of the rugged pattern layer.

### Claim 5 (depends on 4)

The mold of claim 4,
wherein the thickness of the elastic sheet layer is equal to or larger than 50 μm and equal to or smaller than 1000 μm,
wherein the thickness of the inorganic sheet layer is equal to or larger than 30 μm and equal to or smaller than 100 μm, and
wherein the thickness of the rugged pattern layer is equal to or larger than 0.01 μm and equal to or smaller than 30 μm.

### Claim 6 (depends on 4)

The mold of claim 4, further comprising:
an adhesion layer disposed between the inorganic sheet layer and the elastic sheet layer.

### Claim 7 (depends on 6)

The mold of claim 6,
wherein the thickness of the inorganic sheet layer is larger than a thickness of the adhesion layer, and
wherein the thickness of the adhesion layer is larger than the thickness of the rugged pattern layer.

### Claim 8 (depends on 6)

The mold of claim 6,
wherein a Young's modulus of the inorganic sheet layer is higher than a Young's modulus of the elastic sheet layer, and
wherein the Young's modulus of the elastic sheet layer is higher than a Young's modulus of the adhesion layer.

### Claim 9 (depends on 8)

The mold of claim 8,
wherein the Young's modulus of the inorganic sheet layer is equal to or higher than 10 GPa and equal to or lower than 600 GPa,
wherein the Young's modulus of the elastic sheet layer is equal to or higher than 1 GPa and equal to or lower than 10 GPa, and
wherein the Young's modulus of the adhesion layer is higher than 0 Pa and equal to or lower than 1 GPa.

### Claim 10 (depends on 1)

The mold of claim 1,
wherein the rugged pattern layer, the inorganic sheet layer, and the elastic sheet layer transmit UV light.

### Claim 11 (depends on 1)

An imprint device comprising:
the mold of claim 1; and
a holder that holds the region of the elastic sheet layer, not covered with the inorganic sheet layer.

### Claim 12 (depends on 1)

An imprint method comprising:
preparing a board to which resin is applied; and
transferring a pattern to the resin using the mold of claim 1.