# US 2018/0320937 A1 · Tec heat dissipation assembly and projection device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0320937 A1 - Document ID: US20180320937A1 - Status: Published application - Kind: A1 - Application number: 15/772,397 - Filed: 2016-11-04 - Published: 2018-11-08 - Earliest claimed: 2015-11-04 - Assignees: Appotronics Corporation Limited - Applicants: Appotronics Corporation Limited - Inventors: Gaofei DENG; Wei LIN; Jinqing LI - Web page: https://patentgrep.com/patent/US20180320937A1 ## CPC - F25B 21/02: using Peltier effect; using Nernst-Ettinghausen effect - H01S 3/0407: {Liquid cooling, e.g. by water} - H05K 7/20254: {Cold plates transferring heat from heat source to coolant} - H05K 7/20445: {the coupling element being an additional piece, e.g. thermal standoff} - F25B 2321/023: Mounting details thereof - F25B 2321/0252: by liquids or two-phase fluids - F25B: REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A TEC heat dissipation assembly includes a TEC refrigeration module, which includes a TEC refrigeration chip, a mounting plate for mounting the TEC refrigeration chip, a water cooled plate located on one side of a heat generating surface of the TEC refrigeration chip for cooling the TEC refrigeration chip, and a cover plate for covering the TEC refrigeration module and a heat source substrate. A hollowed open window which is matched with the TEC refrigeration chip in appearance and used for allowing the heat generating surface of the TEC refrigeration chip to be in contact with the water cooled plate via the mounting plate is disposed on the surface of the mounting plate. A refrigeration surface of the TEC refrigeration chip is close to the heat source substrate at the other side of the hollowed open window. Also provided is a projection device employing the TEC heat dissipation assembly. ## Claims ### Claim 1 A TEC (thermoelectric cooler) heat dissipation assembly, comprising: a TEC refrigeration module, which includes a TEC refrigeration chip, a mounting plate for mounting the TEC refrigeration chip, and a water cooled plate disposed on a side of a heat generating surface of the TEC refrigeration chip and configured to cool the TEC refrigeration chip; and a cover plate, configured to cover the TEC refrigeration module and a heat source substrate, wherein a surface of the mounting plate defines a hollowed open window which has a shape that matches an external shape of the TEC refrigeration chip, configured to allow the heat generating surface of the TEC refrigeration chip to be in contact with the water cooled plate through the mounting plate, and wherein a refrigeration surface of the TEC refrigeration chip is disposed adjacent to the heat source substrate to be cooled through another side of the hollowed open window. ### Claim 2 (depends on 1) The TEC heat dissipation assembly of claim 1, further comprising a temperature homogenizing plate disposed on a surface of the heat source substrate, configured to conduct heat from the heat source substrate evenly to the temperature homogenizing plate, wherein one side of the temperature homogenizing plate is in contact with a heat generating region of the heat source substrate, and another side of the temperature homogenizing plate is in contact with the refrigeration surface of the TEC refrigeration chip, and wherein a surface of the other side of the temperature homogenizing plate has a flat shape that fits a shape of the refrigeration surface of the TEC refrigeration chip. ### Claim 3 (depends on 1) The TEC heat dissipation assembly of claim 1, wherein the contact between the heat generating surface of the TEC refrigeration chip and the surface of the water cooled plate is mediated by a coating of a thermal conductive material. ### Claim 4 (depends on 2) The TEC heat dissipation assembly of claim 2, further comprising a thermal conductive material coating located between the refrigeration surface of the TEC refrigeration chip and the surface of the temperature homogenizing plate and/or between the other surface of the temperature homogenizing plate and the surface of the heat source substrate. ### Claim 5 (depends on 2) The TEC heat dissipation assembly of claim 2, further comprising spring biased screws disposed on the heat source substrate, and the surface of the temperature homogenizing plate defines screw holes that fit the spring biased screws. ### Claim 6 (depends on 2) The TEC heat dissipation assembly of claim 2, comprising a plurality of TEC refrigeration chips, a plurality of hollowed open windows on the surface of the mounting plate, and a plurality of temperature homogenizing plates, respectively corresponding to each other. ### Claim 7 (depends on 4) The TEC heat dissipation assembly of claim 4, further comprising a sealing ring disposed between the mounting plate and the water cooled plate, and a sealing groove formed on the surface of the mounting plate that faces the water cooled plate configured to accommodate the sealing ring. ### Claim 8 (depends on 1) A projection device, comprising the TEC heat dissipation assembly of claim 1. ### Claim 9 (depends on 8) The projection device of claim 8, wherein the heat source substrate includes a laser source. ### Claim 10 (depends on 2) The TEC heat dissipation assembly of claim 2, wherein the contact between the heat generating surface of the TEC refrigeration chip and the surface of the water cooled plate is mediated by a coating of a thermal conductive material. ### Claim 11 (depends on 5) The TEC heat dissipation assembly of claim 5, further comprising a sealing ring disposed between the mounting plate and the water cooled plate, and a sealing groove formed on the surface of the mounting plate that faces the water cooled plate configured to accommodate the sealing ring. ### Claim 12 (depends on 6) The TEC heat dissipation assembly of claim 6, further comprising a sealing ring disposed between the mounting plate and the water cooled plate, and a sealing groove formed on the surface of the mounting plate that faces the water cooled plate configured to accommodate the sealing ring.