# US 2018/0320885 A1 · Light module having a heatsink crimped around a lens, and a method for crimping a heat sink around a lens of a light module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0320885 A1 - Document ID: US20180320885A1 - Status: Published application - Kind: A1 - Application number: 15/687,012 - Filed: 2017-08-25 - Published: 2018-11-08 - Earliest claimed: 2017-05-05 - Assignees: Flex Ltd. - Applicants: Flex Ltd. - Inventors: Jordon Musser; Chris Stratas - Web page: https://patentgrep.com/patent/US20180320885A1 ## CPC - F21V 29/89: Metals - F21K 9/275: Details of bases or housings, i.e. the parts between the light-generating element and the end caps; Arrangement of components within bases or housings (F21K9/278 takes precedence) - F21K 9/90: Methods of manufacture - F21S 4/28: rigid, e.g. LED bars - F21V 5/04: of lens shape - F21V 5/048: {the lens being a simple lens adapted to cooperate with a point-like source for emitting mainly in one direction and having an axis coincident with the main light transmission direction, e.g. convergent or divergent lenses, plano-concave or plano-convex lenses} - F21V 15/013: {the housing being an extrusion} - F21V 15/015: Devices for covering joints between adjacent lighting devices; End coverings - F21V 17/104: {using feather joints, e.g. tongues and grooves, with or without friction} - F21V 19/0045: {by tongue and groove connections, e.g. dovetail interlocking means fixed by sliding} - F21V 29/70: characterised by passive heat-dissipating elements, e.g. heat-sinks - F21V 29/75: with fins or blades having different shapes, thicknesses or spacing - F21V 29/763: {the planes containing the fins or blades having the direction of the light emitting axis} - F21V 29/83: the elements having apertures, ducts or channels, e.g. heat radiation holes - F21V 31/005: {Sealing arrangements therefor} - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)} - H05K 1/181: associated with surface mounted components - F21K 9/272: Details of end parts, i.e. the parts that connect the light source to a fitting; Arrangement of components within end parts (F21K9/278 takes precedence) - F21Y 2103/10: comprising a linear array of point-like light-generating elements - F21Y 2105/16: square or rectangular, e.g. for light panels - F21Y 2115/10: Light-emitting diodes [LED] - H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)} - H05K 7/20409: {Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing} - H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB] - H05K 2201/10106: Light emitting diode [LED] - H05K 2201/10598: Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - F21S: NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED ## Abstract A device is provided that includes a lens for covering a printed circuit board having a light emitting diode. The lens forms an arc in a lateral cross-section and includes two first edges at the ends of the arc. The arc spans a width of the printed circuit board and defines a space between the lens and the printed circuit board. The device also includes a heatsink adapted to couple to the printed circuit board and which extends substantially the width and the length of the printed circuit board. The heatsink includes two second edges along the length of the printed circuit board. One of the edges of the lens is positioned in a channel on one of the second edges of the heatsink, and the channel is crimped. A method is provided that includes providing a crimping a channel around a lens. ## Claims ### Claim 1 A device comprising: a lens for covering a printed circuit board having at least one light emitting diode, the lens forming an arc in a lateral cross-section, the lens including at least two first edges at the ends of the arc, the arc spanning at least a width of the printed circuit board and defining a space between the lens and the printed circuit board, the lens extending along the at least two first edges substantially a length of the printed circuit board; and a heatsink adapted to couple to the printed circuit board, the heatsink extending substantially the width and the length of the printed circuit board, the heatsink including at least two second edges along the length of the printed circuit board, at least one of the first edges of the lens being positioned in at least one channel on at least one of the second edges of the heatsink, the at least one channel being crimped. ### Claim 2 (depends on 1) The device of claim 1, wherein: the at least one of the first edges is at least two first edges of the lens; the at least one channel is at least two channels; the at least one of the second edges is at least two second edges of the heatsink; and the at least two first edges of the lens being received in the at least two channels on respective ones of the at least two second edges of the heatsink, the at least two channels being crimped. ### Claim 3 (depends on 1) The device of claim 1, wherein the crimping forms a seal between the heatsink and the lens at the at least one channel. ### Claim 4 (depends on 3) The device of claim 3, wherein the crimping provides ingress protection from dust and liquids. ### Claim 5 (depends on 3) The device of claim 3, wherein sealant is provided in the at least one channel to improve the seal when the at least one channel is crimped. ### Claim 6 (depends on 1) The device of claim 1, wherein the heatsink comprises extruded aluminum. ### Claim 7 (depends on 6) The device of claim 6, wherein the crimping comprises mechanically deforming the aluminum heatsink to seal around the lens. ### Claim 8 (depends on 1) The device of claim 1, wherein the lens comprises translucent plastic. ### Claim 9 (depends on 1) The device of claim 1, wherein: the printed circuit board is planar having the length in a longitudinal direction; and the heatsink is coupled to the printed circuit board by positioning at least one third edge of the printed circuit board in at least one further channel on at least one of the second edges of the heatsink, the at least one further channel being crimped. ### Claim 10 (depends on 1) The device of claim 1, further comprising: the printed circuit board interposed between the heatsink and the lens, the printed circuit board, the heatsink, and the lens forming in combination a first light module; at least one second light module; and two endcaps arranged on opposing ends of the first and second light modules, the two endcaps being mechanically coupled to the first and second light modules and providing a second seal to inhibit ingress from ends of the first and second light modules to the printed circuit board. ### Claim 11 (depends on 1) The device of claim 1, wherein: the heatsink forms a base of the arc in the lateral cross-section; and the base spans substantially the width of the printed circuit board and is substantially parallel to the printed circuit board. ### Claim 12 A method for lighting, comprising: providing a lens for covering a printed circuit board having at least one light emitting diode, the lens forming an arc in a lateral cross-section, the lens including at least two first edges at the ends of the arc, the arc spanning at least a width of the printed circuit board and defining a space between the lens and the printed circuit board, the lens extending along the at least two first edges substantially a length of the printed circuit board; providing a heatsink adapted to couple to the printed circuit board, the heatsink extending substantially the width and the length of the printed circuit board, the heatsink including at least two second edges along the length of the printed circuit board; positioning at least one of the first edges of the lens in at least one channel on at least one of the second edges of the heatsink; and crimping the at least one channel. ### Claim 13 (depends on 12) The method of claim 12, wherein: the at least one of the first edges is at least two first edges of the lens; the at least one channel is at least two channels; the at least one of the second edges is at least two second edges of the heatsink; the positioning operation is of at least two of the first edges of the lens in at least two channels on the at least two second edges of the heatsink; and the crimping operation is of the at least two channels. ### Claim 14 (depends on 12) The method of claim 12, wherein the crimping operation comprises forming a seal between the heatsink and the lens at the at least one channel. ### Claim 15 (depends on 12) The method of claim 12, wherein the crimping operation comprises providing ingress protection from dust and liquids. ### Claim 16 (depends on 12) The method of claim 12, further comprising providing sealant in the at least one channel to improve the seal, the providing sealant operation being performed one of: before, during, and after the crimping operation is performed. ### Claim 17 (depends on 12) The method of claim 12, wherein the heatsink comprises extruded aluminum; and the crimping operation comprises mechanically deforming the aluminum heatsink to seal around the lens. ### Claim 18 (depends on 12) The method of claim 12, wherein the printed circuit board is planar having the length in a longitudinal direction, and further comprising: positioning at least one third edge of the printed circuit board in at least one further channel on at least one of the second edges of the heatsink; and further crimping the at least one further channel of the heatsink around the at least one third edge of the printed circuit board, the further crimping operation and the crimping operation being performed substantially simultaneously. ### Claim 19 (depends on 12) The method of claim 12, further comprising: positioning the printed circuit board between the heatsink and the lens, the printed circuit board, the heatsink, and the lens forming in combination a first light module; providing at least one second light module; and arranging two endcaps on opposing ends of the first and second light modules, the two endcaps being mechanically coupled to the first and second light modules and providing a second seal to inhibit ingress from ends of the first and second light modules to the printed circuit board.