# US 2018/0320883 A1 · Light module having a heatsink crimped around a printed circuit board, and a method for crimping a heat sink around a printed circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0320883 A1 - Document ID: US20180320883A1 - Status: Published application - Kind: A1 - Application number: 15/687,022 - Filed: 2017-08-25 - Published: 2018-11-08 - Earliest claimed: 2017-05-05 - Assignees: Flex Ltd. - Applicants: Flex Ltd. - Inventors: Jordon Musser; Chris Stratas - Web page: https://patentgrep.com/patent/US20180320883A1 ## CPC - F21V 29/89: Metals - F21K 9/275: Details of bases or housings, i.e. the parts between the light-generating element and the end caps; Arrangement of components within bases or housings (F21K9/278 takes precedence) - F21K 9/90: Methods of manufacture - F21S 4/28: rigid, e.g. LED bars - F21V 5/04: of lens shape - F21V 5/048: {the lens being a simple lens adapted to cooperate with a point-like source for emitting mainly in one direction and having an axis coincident with the main light transmission direction, e.g. convergent or divergent lenses, plano-concave or plano-convex lenses} - F21V 15/013: {the housing being an extrusion} - F21V 15/015: Devices for covering joints between adjacent lighting devices; End coverings - F21V 17/104: {using feather joints, e.g. tongues and grooves, with or without friction} - F21V 19/0045: {by tongue and groove connections, e.g. dovetail interlocking means fixed by sliding} - F21V 29/70: characterised by passive heat-dissipating elements, e.g. heat-sinks - F21V 29/75: with fins or blades having different shapes, thicknesses or spacing - F21V 29/763: {the planes containing the fins or blades having the direction of the light emitting axis} - F21V 29/83: the elements having apertures, ducts or channels, e.g. heat radiation holes - F21V 31/005: {Sealing arrangements therefor} - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)} - H05K 1/181: associated with surface mounted components - F21K 9/272: Details of end parts, i.e. the parts that connect the light source to a fitting; Arrangement of components within end parts (F21K9/278 takes precedence) - F21Y 2103/10: comprising a linear array of point-like light-generating elements - F21Y 2105/16: square or rectangular, e.g. for light panels - F21Y 2115/10: Light-emitting diodes [LED] - H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)} - H05K 7/20409: {Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing} - H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB] - H05K 2201/10106: Light emitting diode [LED] - H05K 2201/10598: Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - F21S: NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED ## Abstract A device is provided that includes a printed circuit board having a light emitting diode. The printed circuit board is substantially planar and has a length and a width. The printed circuit board includes two first edges extending substantially the length of the printed circuit board. The device also includes a heatsink extending substantially the width and the length of the printed circuit board. The heatsink includes edges along the length of the printed circuit board, and an edge of the printed circuit board is positioned in a channel on an edge of the heatsink. The channel is crimped. A method for manufacturing a light module according to the present disclosure includes positioning a first edge of a printed circuit board in a channel on a second edge of a heatsink. The method further includes crimping the channel. ## Claims ### Claim 1 A device comprising: a printed circuit board having at least one light emitting diode, the printed circuit board being substantially planar and having a length and a width, the printed circuit board including two first edges extending substantially the length of the printed circuit board; and a heatsink extending substantially the width and the length of the printed circuit board, the heatsink including two second edges along the length of the printed circuit board, at least one of the first edges of the printed circuit board being positioned in at least one channel on at defined by at least one of the second edges of the heatsink, the at least one channel being crimped, wherein the at least one of the second edges of the heatsink has an arm extending over the at least one of the first edges of the printed circuit board, the arm including: a first portion extending from a substantially planar base of the heatsink; and a second portion extending from the first portion at an angle toward the printed circuit board and the base of the heat sink. ### Claim 2 (depends on 1) The device of claim 1, wherein: the at least one channel is two channels; the two first edges of the printed circuit board are positioned in the two channels; and the two channels are crimped. ### Claim 3 (depends on 1) The device of claim 1, wherein the crimping mechanically couples the heatsink and the printed circuit board. ### Claim 4 (depends on 3) The device of claim 3, wherein the crimping provides structural stability and heat conduction. ### Claim 5 (depends on 1) The device of claim 1, wherein the heatsink comprises extruded aluminum. ### Claim 6 (depends on 5) The device of claim 5, wherein the crimping comprises mechanically deforming the aluminum heatsink to couple to the printed circuit board. ### Claim 7 (depends on 1) The device of claim 1, wherein the printed circuit board is interposed between the heatsink and a lens, and wherein the printed circuit board, the heatsink, and the lens form, in combination a first light module; the device further comprising: at least one second light module; and two endcaps arranged on opposing ends of the first and second light modules, the two endcaps being mechanically coupled to the first and second light modules and providing a seal to inhibit ingress from the ends of the first and second light modules to the printed circuit board. ### Claim 8 (depends on 1) The device of claim 1, wherein the base spans substantially the width of the printed circuit board and is substantially parallel to the printed circuit board. ### Claim 9 A method for manufacturing a light module, comprising: positioning at least one of two first edges of a printed circuit board in at least one channel defined in at least one of two second edges of a heatsink, the at least one of the second edges of the heatsink having an arm extending over the at least one of the first edges of the printed circuit board, the printed circuit board having at least one light emitting diode, the printed circuit board being substantially planar and having a length and a width, the two first edges of the printed circuit board extending substantially the length of the printed circuit board, the heatsink extending substantially the width and the length of the printed circuit board, the heatsink including the two second edges along the length of the printed circuit board; and crimping the arm of the at least one of the second edges of the heatsink to capture the at least one of the first edges of the printed circuit board in the at least one channel, wherein the arm extends over the at least one of the first edges of the printed circuit board prior to and after crimping. ### Claim 10 (depends on 9) The method of claim 9, wherein: the at least one channel is two channels; the positioning operation includes positioning the two first edges of the printed circuit board in the two channels; and the crimping operation includes crimping the two first edges of the printed circuit board to capture the two first edges of the printed circuit board in the two channels. ### Claim 11 (depends on 9) The method of claim 9, wherein the crimping operation comprises mechanically coupling the heatsink and the printed circuit board. ### Claim 12 (depends on 9) The method of claim 9, wherein the crimping operation provides structural stability and heat conduction. ### Claim 13 (depends on 9) The method of claim 9, wherein: the heatsink comprises extruded aluminum; and the crimping operation comprises mechanically deforming the aluminum heatsink to couple to the printed circuit board. ### Claim 14 (depends on 9) The method of claim 9, further comprising: positioning the printed circuit board between the heatsink and a lens, the printed circuit board, the heatsink, and the lens forming in combination a first light module; and arranging two endcaps on opposing ends of the first light module and at least one second light module, the two endcaps being mechanically coupled to the first and second light modules and providing a second seal to inhibit ingress from the ends of the first and second light modules to the printed circuit board. ### Claim 15 (depends on 9) The method according to claim 9, wherein prior to the crimping operation, the arm of the at least one of the second edges of the heatsink includes: a first portion extending from a substantially planar base of the heatsink at an angle toward a central longitudinal axis defined by the heatsink; and a second portion extending from the first portion at an angle downwardly toward the printed circuit board and the base of the heat sink. ### Claim 16 (depends on 15) The method according to claim 15, wherein the crimping operation closes a gap between an end of the second portion of the arm and the printed circuit board. ### Claim 17 (depends on 1) The device of claim 1, wherein the first portion of the arm extends toward a central longitudinal axis defined by the heatsink, and the second portion of the arm extends from the first portion at the angle downwardly toward the printed circuit board and the base of the heat sink.